Comparing Spansion S34ML01G100 with Macronix MX30LF1G18AC

APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF1G18AC from the
Spansion® S34ML01G100 1Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of
the datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Vcc Voltage Range
Macronix MX30LF1G18AC
Spansion S34ML01G100
2.7V ~ 3.6V
2.7V ~ 3.6V
x8
x8
Bus Width
Operating Temperature
Interface
-40°C ~ 85°C
-40°C ~ 85°C
ONFI 1.0 Standard
ONFI 1.0 Standard
Block Size
128KB+4KB
128KB+4KB
Page Size
2KB+64B
2KB+64B
ECC Requirement
4b/528B
1b/528B
OTP Size
30 pages
64 pages
Block 0
Block 0, 1
ONFI standard
ONFI standard
C2h/F1h/80h/95h/02h
01h/F1h/00h/1Dh
ONFI Signature
4Fh/4Eh/46h/49h
4Fh/4Eh/46h/49h
Data Retention
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
Guarantee Good Blocks at Shipping
Unique ID
ID Code
Package
P/N: AN0352
1
Ver.1, Jul.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
3. Performance
Table 3-1 and Table 3-2 show MX30LF1G18AC and S34ML01G100 Read/Write performance.
Table 3-1: Read Performance (Read Latency and Sequential Read)
Read function
Macronix MX30LF1G18AC Spansion S34ML01G100
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Performance (Program and Erase)
Write Function
Macronix MX30LF1G18AC Spansion S34ML01G100
Page Program time (tPROG)
300us (typ.) / 600us (max.) 200us (typ.) / 700us (max.)
Block Erase time (tERASE)
1ms (typ.) / 3.5ms (max.)
2ms (typ.) / 3ms (max.)
NOP
4 (max.)
4 (max.)
1
Write/Erase Cycles* (Endurance)
100,000
100,000
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Macronix MX30LF1G18AC
Sequential Read Current (ICC1) 20mA (typ.) / 30mA (max.)
Program Current (ICC2)
20mA (typ.) / 30mA (max.)
Erase Current (ICC3)
15mA (typ.) / 30mA (max.)
Standby Current – CMOS
10uA (typ.) / 50uA (max.)
Spansion S34ML01G100
15mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
10uA (typ.) / 50uA (max.)
Table 4-2: Input / Output Voltage
DC Characteristic
Macronix MX30LF1G18AC
Spansion S34ML01G100
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
Input High Voltage (VIH)
0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
0.4V (max.)
Output High Voltage (VOH)
VCC-0.2 (min.)
2.4V (min.)
P/N: AN0352
2
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to
the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Spansion devices. S34ML01G100 can be replaced by the MX30LF1G18AC
without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention
because the pin is designated “PT” which is chip protected function on the MX30LF1G18AC-TI,
but S34ML01G100 is designated as NC.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF1G18AC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML01G100
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: NC
Pin38: PT
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Part Name MX30LF1G18AC-XKI
#38 pin
PT*1
Spansion
Note
S34ML01G100
If no connect, both pin functions are the
same
NC*2
Note:
1. PT pin has internal weak pull low. It enables the protection function if active.
2. NC= Not Connected
P/N: AN0352
3
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF1G18AC
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML01G100
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
NC
VCC
*1
PT
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5 : NC
G5: PT
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Part Name MX30LF1G18AC-XKI
#G5 ball
PT*1
Spansion
Note
S34ML01G100
If no connect, both pin functions are the
same
NC*2
Note:
PT pin has internal weak pull low. It enables the protection function if active.
NC= Not Connected
P/N: AN0352
4
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
6. Command Set
Basic command sets and status checking methods are similar.
The Read and Write operation commands are identical, but the devices have different command
sequences when accessing the Cache Read function. Additionally, Macronix supports a Cache
Read Begin, Unique ID Read, Set/Get feature and Block Protection Status Read function and
Spansion® does not (Table 6-1).
Table 6-1: Command Table
Command
Random Data Input
Random Data Output
Cache Read Begin
Cache Read Sequential
Read Mode
Cache Read End
Copy Back Read
Read ID
Reset
Page Program
Cache Program
Copy Back Program
Block Erase
Read Status
Read Parameter Pg.
Unique ID Read
Set Feature
Get Feature
Block Protection Status Read
P/N: AN0352
Macronix
Spansion
MX30LF1G18AC
S34ML01G100
1st Cycle 2nd Cycle 1st Cycle 2nd Cycle
85h
85h
05h
E0h
05h
E0h
00h
31h
31h
31h
00h
30h
00h
30h
3Fh
3Fh
00h
35h
90h
90h
FFh
FFh
80h
10h
80h
10h
80h
15h
80h
15h
85h
10h
60h
D0h
60h
D0h
70h
70h
ECh
ECh
EDh
EFh
EEh
7Ah
-
5
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
6-2 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin
Checking” or “Status Output Checking” method may be used to monitor the operation. Both are
standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that
Status Output content provided by the Read Status command (70h) is compatible.
Table 6-3: Status Output
Status Output
Macronix MX30LF1G18AC
Spansion S34ML01G100
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Reserved
Reserved
SR[3]
Reserved
Reserved
SR[4]
Reserved
Reserved
SR[5]
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read internal controller:
Ready/Busy
SR[6]
PGM/ERS/Read status: Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
P/N: AN0352
6
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
7. Read ID Command
The ID of the Macronix MX30LF1G18AC begins with a one-byte Manufacturer Code followed by
a four-byte Device ID while the Spansion NAND only outputs a three-byte Device ID. While the
same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs
are different, allowing software to distinguish between the device manufacturer, Sequential Read
Cycle Times, and ECC Level Requirement (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID Code
Value
1st Byte
2nd Byte
IO1, IO0
IO3, IO2
3rd
Byte
IO5, IO4
IO6
4th
Byte
5th
Byte
P/N: AN0352
IO7
IO1, IO0
IO2
IO7, IO3
IO5, IO4
IO6
IO0, IO1
IO2, IO3
IO4~IO6
IO7
Macronix MX30LF1G18AC
Spansion S34ML01G100
C2h/F1h/80h/95h/62h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Sequential Read Cycle Time (tRC)
Block Size (exclude Spare Area)
Organization
ECC Level Requirement
Number of Plane per CE
Plane Size
Reserved
01h/F1h/00h/1Dh
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Serial Access Time (tRC)
Block Size (exclude Spare Area)
Organization
-
7
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
8. Power-Up Timing
Macronix and Spansion® power-up sequences are similar, but the timing is slightly different.
Although both devices use 2.7V (VCC min.) as the start point, timing references are different.
Check the system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Macronix MX30LF1G18AC
Spansion S34ML01G100
Vcc (min.) to WE# Low
1ms (max.)
N/A
Vcc (min.) to R/B# High
N/A
5ms (max.)
Vcc (min.) to R/B# Low
10us (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
9. Summary
Macronix MX30LF1G18AC and Spansion® S34ML01G100 NAND have similar features and
pinouts. Because basic Read/Program/Erase commands as well as block, page, and spare area
sizes are the same, device migration may require only minimal firmware modification if special
features such as Copy Back Read/Program are used, or to support Macronix 4-bit ECC.
P/N: AN0352
8
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
Website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
MX30LF1G18AC
S34ML01G100
Location
-
Date Issue
Sep. 04, 2014
Feb. 10, 2014
Revision
Rev. 0.01
Rev. 17
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF1G18AC and Spansion® S34ML01G100 product families.
Table 11-1: Part Number Cross Reference
Density
1Gb
Macronix Part No.
MX30LF1G18AC-TI
MX30LF1G18AC-XKI
Spansion Part No.
S34ML01G100TFI00
S34ML01G100BHI00
Package
48-TSOP
63-VFBGA
Dimension
12x20mm
9x11x1.0mm
12. Revision History
Revision
1.0
P/N: AN0352
Description
Initial Release
9
Date
Nov. 14, 2014
Ver.1, Nov.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML01G100 with Macronix MX30LF1G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit,
Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS,
KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM.
The names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0352
10
Ver.1, Nov.14, 2014
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