APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 1. Introduction This application note is a guide for migrating to the Macronix MX30LF2G18AC from the Spansion® S34ML02G200 2Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Vcc voltage range Bus Width Operating Temperature Interface Block Size Page Size ECC Requirement OTP size Guarantee Good blocks at shipping Unique ID ID Code ONFI signature Data Retention Package P/N: AN0333 Macronix MX30LF2G18AC Spansion S34ML02G200 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+4KB 2KB+64B 4b/528B 30 pages 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+8KB 2KB+128B 4b/528B 64 pages Block 0 Block 0 & 1 ONFI standard C2h/DAh/90h/95h/06h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) ONFI standard 01h/DAh/90h/95h/46h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 1 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 3. Performance Table 3-1 and Table 3-2 show MX30LF2G18AC and S34ML02G200 Read/Write performance. Table 3-1: Read Performance (Read Latency and Sequential Read) Read function Macronix MX30LF2G18AC Spansion S34ML02G200 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Performance (Program and Erase) Write Function Page Program time (tPROG) Block Erase time (tERASE) Macronix MX30LF2G18AC Spansion S34ML02G200 300us (typ.) / 600us (max.) 300us (typ.) / 700us (max.) 1ms (typ.) / 3.5ms (max.) 3.5ms (typ.) / 10ms (max.) 4 (max.) 4 (max.) 100,000 100,000 NOP 1 Write/Erase Cycles* (Endurance) Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Macronix MX30LF2G18AC Spansion S34ML02G200 Sequential Read Current (ICC1) 20mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) Program Current (ICC2) 20mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) Erase Current (ICC3) 15mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) Standby Current – CMOS 10uA (typ.) / 50uA (max.) 10uA (typ.) / 50uA (max.) Macronix MX30LF2G18AC Spansion S34ML02G200 Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) 0.8VCC (min.) / VCC+0.3V (max.) Output Low Voltage (VOL) 0.2V (max.) 0.4V (max.) Output High Voltage (VOH) VCC-0.2V (min.) 2.4V (min.) Table 4-2: Input / Output Voltage DC Characteristic P/N: AN0333 2 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Table 5-1 shows differences in pin assignments between the Macronix and Spansion devices. The S34ML02G200 can be compared by the MX30LF2G18CA without pin conflicts. Only 48-TSOP pin #38 (63-VFBGA ball G5) may need special attention because the pin is designated “PT” which, if high during power-up, enables a memory protection function on the MX30LF2G18AC. The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 MX30LF2G18AC VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML02G200 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Spansion Part Name MX30LF2G18AC-TI S34ML02G200TFI00 #38 pin PT NC Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature. Please refer to the datasheet for more details. P/N: AN0333 3 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF2G18AC 1 2 A NC NC B NC 3 4 5 6 7 S34ML02G200 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 PT NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5: PT G5: DNU Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Spansion Part Name MX30LF2G18AC-XKI S34ML02G200BHI00 #G5 ball PT NC Note: PT pin has internal weak pull low. It enables the protection function, if active. Please refer to the datasheet for more details. P/N: AN0333 4 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 6. Command Set Basic command sets and status checking methods are similar. Read, Write, and Erase operation commands are identical (Table 6-1). Macronix implements the ONFI 2-Plane Block Erase command sequence (Table 6-2). Table 6-1: Command Table Command Random Data Input Random Data Output Cache Read Begin Read Mode Cache Read End Read ID Reset Page Program Cache Program Block Erase Read Status Read Parameter Pg. Unique ID Read Set Feature Get Feature Status Enhance Read Macronix MX30LF2G18AC 1st Cycle 2nd Cycle 85h 05h E0h 00h 31h 00h 30h 3Fh 90h FFh 80h 10h 80h 15h 60h D0h 70h ECh EDh EFh EEh 78h Table 6-2: Two-Plane Command Table Macronix MX30LF2G18AC Command 1st 2nd 3rd 4th 2 Plane Program ONFI 2 Plane Program 2 Plane Cache Program ONFI 2 Plane Cache Program 2 Plane Block Erase ONFI 2 Plane Block Erase P/N: AN0333 Spansion S34ML02G200 1st Cycle 2nd Cycle 85h 05h 31h 00h 3Fh 90h FFh 80h 80h 60h 70h ECh EDh 78h E0h 30h 10h 15h D0h - Spansion S34ML02G200 Cycle Cycle Cycle Cycle 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 80h 80h 60h 11h 11h D1h 80h 80h 60h 10h 15h D0h 80h 80h 80h 80h 60h 60h 11h 11h 11h 11h 60h D1h 81h 80h 81h 80h D0h 60h 10h 10h 15h 15h D0h 5 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 6-2 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-4 shows that Two–plane Operation Status output provided by the Enhance Read command (78h) is compatible. Table 6-3: Status Output Status Output Macronix MX30LF2G18AC Spansion S34ML02G200 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Reserved SR[4] SR[6] Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[5] Table 6-4: Two-plane Status Output Status Output Macronix MX30LF2G18AC SR[0] Selected Plane PGM/ERS status: Pass/Fail Spansion S34ML02G200 SR[2] Selected Plane Cache Program status: Pass/Fail Reserved Selected Plane PGM/ERS status: Pass/Fail Selected Plane Cache Program status: Pass/Fail Reserved SR[3] Reserved Reserved SR[4] SR[6] Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[1] SR[5] P/N: AN0333 6 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 7. Read ID Command The ID of the Macronix MX30LF2G18AC begins with a one-byte Manufacturer Code followed by a four-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs are different, allowing software to identify the device manufacturer and device type (Table 7-1). Table 7-1: Manufacturer and Device IDs ID code Macronix MX30LF2G18AC C2h/DAh/90h/95h/06h Manufacturer Code Device Identifier Number of Die per Chip Enable 01h/DAh/90h/95h/46h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Cell Structure IO7 Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Programming Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Programming IO1, IO0 Page Size (exclude Spare Area) Page Size (exclude Spare Area) IO2 Size of Spare Area (Byte per 512Byte) Size of Spare Area (Byte per 512Byte) IO7, IO3 Sequential Read Cycle Time (tRC) Serial Access Time (tRC) IO5, IO4 Block Size (exclude Spare Area) Block Size (exclude Spare Area) IO6 Organization Organization IO0, IO1 ECC Level Requirement Reserved IO2, IO3 Number of Planes per CE Number of Planes per CE IO4~IO6 Plane Size Plane Size IO7 Reserved Reserved Value 1st Byte 2nd Byte IO1, IO0 IO3, IO2 3rd Byte IO5, IO4 IO6 4th Byte 5th Byte Spansion S34ML02G200 P/N: AN0333 7 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 8. Power-Up Timing Macronix and Spansion® power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point, timing references are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Macronix MX30LF2G18AC 1ms (max.) N/A 10us (max.) Spansion S34ML02G200 N/A 5ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing 9. Summary Macronix MX30LF2G18AC and Spansion® S34ML02G200 NAND have similar features and pin outs. Because basic Read/Program/Erase commands are the same, device migration may require minimal firmware modifications primarily due to differences in spare area sizes. P/N: AN0333 8 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet MX30LF2G18AC S34ML01G2_04G2 Location Website Date Issue Sept. 5, 2014 Sept. 5, 2014 Revision Rev. 0.02 Rev. 10 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF2G18AC and Spansion® S34ML02G200 product. Table 11-1: Part Number Cross Reference Density Macronix Part No. Spansion Part No. 2Gb MX30LF2G18AC-TI S34ML02G200TFI00 2Gb MX30LF2G18AC-XKI S34ML02G200BHI00 Package Dimension 48-TSOP 63-VFBGA 12x20mm 9x11mm 12. Revision History Revision 1.0 P/N: AN0333 Description Initial Release Date Sept 26, 2014 9 Ver.1, Sept. 26, 2014 APPLICATION NOTE Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0333 10 Ver.1, Sept. 26, 2014