Comparing Spansion S34ML02G200 with Macronix MX30LF2G18AC

APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF2G18AC from the Spansion®
S34ML02G200 2Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of the
datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Vcc voltage range
Bus Width
Operating Temperature
Interface
Block Size
Page Size
ECC Requirement
OTP size
Guarantee Good blocks at
shipping
Unique ID
ID Code
ONFI signature
Data Retention
Package
P/N: AN0333
Macronix MX30LF2G18AC
Spansion S34ML02G200
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+4KB
2KB+64B
4b/528B
30 pages
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+8KB
2KB+128B
4b/528B
64 pages
Block 0
Block 0 & 1
ONFI standard
C2h/DAh/90h/95h/06h
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
ONFI standard
01h/DAh/90h/95h/46h
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
1
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
3. Performance
Table 3-1 and Table 3-2 show MX30LF2G18AC and S34ML02G200 Read/Write performance.
Table 3-1: Read Performance (Read Latency and Sequential Read)
Read function
Macronix MX30LF2G18AC
Spansion S34ML02G200
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Performance (Program and Erase)
Write Function
Page Program time (tPROG)
Block Erase time (tERASE)
Macronix MX30LF2G18AC
Spansion S34ML02G200
300us (typ.) / 600us (max.)
300us (typ.) / 700us (max.)
1ms (typ.) / 3.5ms (max.)
3.5ms (typ.) / 10ms (max.)
4 (max.)
4 (max.)
100,000
100,000
NOP
1
Write/Erase Cycles* (Endurance)
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Macronix MX30LF2G18AC
Spansion S34ML02G200
Sequential Read Current (ICC1)
20mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
Program Current (ICC2)
20mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
Erase Current (ICC3)
15mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
Standby Current – CMOS
10uA (typ.) / 50uA (max.)
10uA (typ.) / 50uA (max.)
Macronix MX30LF2G18AC
Spansion S34ML02G200
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
Input High Voltage (VIH)
0.8VCC (min.) /
VCC+0.3V (max.)
0.8VCC (min.) /
VCC+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
0.4V (max.)
Output High Voltage (VOH)
VCC-0.2V (min.)
2.4V (min.)
Table 4-2: Input / Output Voltage
DC Characteristic
P/N: AN0333
2
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Table 5-1 shows differences in pin assignments between the Macronix and
Spansion devices. The S34ML02G200 can be compared by the MX30LF2G18CA without pin
conflicts. Only 48-TSOP pin #38 (63-VFBGA ball G5) may need special attention because the pin is
designated “PT” which, if high during power-up, enables a memory protection function on the
MX30LF2G18AC. The PT pin can be left unconnected as it has a weak internal pull-down to disable
the protection feature.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX30LF2G18AC
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML02G200
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: PT
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Spansion
Part Name
MX30LF2G18AC-TI
S34ML02G200TFI00
#38 pin
PT
NC
Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature.
Please refer to the datasheet for more details.
P/N: AN0333
3
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF2G18AC
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML02G200
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
NC
VCC
*1
PT
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5: PT
G5: DNU
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Spansion
Part Name
MX30LF2G18AC-XKI
S34ML02G200BHI00
#G5 ball
PT
NC
Note: PT pin has internal weak pull low. It enables the protection function, if active. Please refer to the datasheet for
more details.
P/N: AN0333
4
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
6. Command Set
Basic command sets and status checking methods are similar. Read, Write, and Erase operation
commands are identical (Table 6-1). Macronix implements the ONFI 2-Plane Block Erase command
sequence (Table 6-2).
Table 6-1: Command Table
Command
Random Data Input
Random Data Output
Cache Read Begin
Read Mode
Cache Read End
Read ID
Reset
Page Program
Cache Program
Block Erase
Read Status
Read Parameter Pg.
Unique ID Read
Set Feature
Get Feature
Status Enhance Read
Macronix MX30LF2G18AC
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
00h
30h
3Fh
90h
FFh
80h
10h
80h
15h
60h
D0h
70h
ECh
EDh
EFh
EEh
78h
Table 6-2: Two-Plane Command Table
Macronix MX30LF2G18AC
Command
1st
2nd
3rd
4th
2 Plane Program
ONFI 2 Plane Program
2 Plane Cache Program
ONFI 2 Plane Cache Program
2 Plane Block Erase
ONFI 2 Plane Block Erase
P/N: AN0333
Spansion S34ML02G200
1st Cycle
2nd Cycle
85h
05h
31h
00h
3Fh
90h
FFh
80h
80h
60h
70h
ECh
EDh
78h
E0h
30h
10h
15h
D0h
-
Spansion S34ML02G200
Cycle
Cycle
Cycle
Cycle
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
80h
80h
60h
11h
11h
D1h
80h
80h
60h
10h
15h
D0h
80h
80h
80h
80h
60h
60h
11h
11h
11h
11h
60h
D1h
81h
80h
81h
80h
D0h
60h
10h
10h
15h
15h
D0h
5
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
6-2 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking”
or “Status Output Checking” method may be used to monitor the operation. Both are standard
NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status
Output content provided by the Read Status command (70h) is compatible. Table 6-4 shows that
Two–plane Operation Status output provided by the Enhance Read command (78h) is compatible.
Table 6-3: Status Output
Status Output
Macronix MX30LF2G18AC
Spansion S34ML02G200
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Reserved
Reserved
SR[3]
Reserved
Reserved
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[5]
Table 6-4: Two-plane Status Output
Status Output
Macronix MX30LF2G18AC
SR[0]
Selected Plane PGM/ERS status: Pass/Fail
Spansion S34ML02G200
SR[2]
Selected Plane Cache Program status:
Pass/Fail
Reserved
Selected Plane PGM/ERS status:
Pass/Fail
Selected Plane Cache Program status:
Pass/Fail
Reserved
SR[3]
Reserved
Reserved
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[1]
SR[5]
P/N: AN0333
6
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
7. Read ID Command
The ID of the Macronix MX30LF2G18AC begins with a one-byte Manufacturer Code followed by a
four-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID,
and flash structure, the IDs are different, allowing software to identify the device manufacturer and
device type (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID code
Macronix MX30LF2G18AC
C2h/DAh/90h/95h/06h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
01h/DAh/90h/95h/46h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Cell Structure
IO7
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Programming
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Programming
IO1, IO0
Page Size (exclude Spare Area)
Page Size (exclude Spare Area)
IO2
Size of Spare Area (Byte per 512Byte)
Size of Spare Area (Byte per 512Byte)
IO7, IO3
Sequential Read Cycle Time (tRC)
Serial Access Time (tRC)
IO5, IO4
Block Size (exclude Spare Area)
Block Size (exclude Spare Area)
IO6
Organization
Organization
IO0, IO1
ECC Level Requirement
Reserved
IO2, IO3
Number of Planes per CE
Number of Planes per CE
IO4~IO6
Plane Size
Plane Size
IO7
Reserved
Reserved
Value
1st Byte
2nd Byte
IO1, IO0
IO3, IO2
3rd Byte
IO5, IO4
IO6
4th
Byte
5th
Byte
Spansion S34ML02G200
P/N: AN0333
7
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
8. Power-Up Timing
Macronix and Spansion® power-up sequences are similar, but the timing is slightly different.
Although both devices use 2.7V (VCC min.) as the start point, timing references are different. Check
the system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Macronix MX30LF2G18AC
1ms (max.)
N/A
10us (max.)
Spansion S34ML02G200
N/A
5ms (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
9. Summary
Macronix MX30LF2G18AC and Spansion® S34ML02G200 NAND have similar features and pin
outs. Because basic Read/Program/Erase commands are the same, device migration may require
minimal firmware modifications primarily due to differences in spare area sizes.
P/N: AN0333
8
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note. For the most
current, detailed Macronix specification, please refer to the Macronix website at
http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
MX30LF2G18AC
S34ML01G2_04G2
Location
Website
Date Issue
Sept. 5, 2014
Sept. 5, 2014
Revision
Rev. 0.02
Rev. 10
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF2G18AC and Spansion® S34ML02G200 product.
Table 11-1: Part Number Cross Reference
Density
Macronix Part No.
Spansion Part No.
2Gb
MX30LF2G18AC-TI
S34ML02G200TFI00
2Gb
MX30LF2G18AC-XKI
S34ML02G200BHI00
Package
Dimension
48-TSOP
63-VFBGA
12x20mm
9x11mm
12. Revision History
Revision
1.0
P/N: AN0333
Description
Initial Release
Date
Sept 26, 2014
9
Ver.1, Sept. 26, 2014
APPLICATION NOTE
Comparing Spansion® S34ML02G200 with Macronix MX30LF2G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0333
10
Ver.1, Sept. 26, 2014
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