APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 1. Introduction This application note is a guide for migrating to the Macronix MX30LF4G18AC from the Spansion® S34ML04G100 4Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Macronix MX30LF4G18AC Vcc voltage range 2.7V ~ 3.6V Bus Width x8 Operating Temperature -40°C ~ 85°C Interface ONFI 1.0 Standard Block Size 128KB+4KB Page Size 2KB+64B 4b/528B ECC Requirement OTP Size 30 pages Guarantee Good Blocks at Block 0 Shipping Unique ID ONFI standard C2h/DCh/90h/95h/56h ID Code ONFI Signature 4Fh/4Eh/46h/49h Data Retention 10 Years 48-TSOP (12x20mm) Package 63-VFBGA (9x11mm) P/N: AN0356 1 Spansion S34ML04G100 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+4KB 2KB+64B 1b/528B 64 pages Block 0, 1 ONFI standard 01h/DCh/90h/95h/54h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 3. Performance Table 3-1 and Table 3-2 show MX30LF4G18AC and S34ML04G100 Read/Write performance. Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Read function Macronix MX30LF4G18AC Spansion S34ML04G100 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Function Performance (Program and Erase) Write Function Macronix MX30LF4G18AC Page Program time (tPROG) 300us (typ.) / 600us (max.) Block Erase time (tERASE) 1ms (typ.) / 3.5ms (max.) NOP 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 Spansion S34ML04G100 200us (typ.) / 700us (max.) 3.5ms (typ.) / 10ms (max.) 4 (max.) 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Sequential Read Current (ICC1) Program Current (ICC2) Erase Current (ICC3) Standby Current – CMOS Macronix MX30LF4G18AC 20mA (typ.) / 30mA (max.) 20mA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 10uA (typ.) / 50uA (max.) Spansion S34ML04G100 15mA (typ.) / 30mA (max.) NA (typ.) / 30mA (max.) 15mA (typ.) / 30mA (max.) 10uA (typ.) / 50uA (max.) Table 4-2: Input / Output Voltage DC Characteristic Macronix MX30LF4G18AC Spansion S34ML04G100 Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) Output Low Voltage (VOL) 0.2V (max.) 0.4V (max.) Output High Voltage (VOH) VCC-0.2 (min.) 2.4V (min.) P/N: AN0356 2 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. S34ML04G100 can be compared by the MX30LF4G18AC without pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the pin is designated “PT” which is chip protected function on the MX30LF4G18AC-TI, but S34ML04G100 is designated as NC. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF4G18AC 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML04G100 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: NC Pin38: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Spansion Part Name MX30LF4G18AC-TI S34ML04G100 PT* NC* #38 #3 8 pin 1 1 Note If no connect, both pin functions are the same Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature.. Please refer to the datasheet for more details.NC = No Connect. P/N: AN0356 3 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF4G18AC 1 2 A NC NC B NC 3 4 5 6 7 S34ML04G100 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 PT NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5 : NC G5: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Ball Definition Brand Part Name #G5 #G 5 ball Macronix Spansion MX30LF4G18AC-XKI S34ML04G100 PT* NC* 1 1 Note If no connect, both pin functions are the same Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature.. Please refer to the datasheet for more details.NC = No Connect. P/N: AN0356 4 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 6. Command Set Basic command sets (Read/Program/Erase commands) and status checking methods are similar. Additionally, Macronix supports a Unique ID Read, Set/Get Feature and Block Protection Status Read function and Spansion® does not (Table 6-1). Table 6-1: Command Table Command Macronix MX30LF4G18AC 1st Cycle 85h 05h 00h 31h 00h 3Fh 90h FFh 80h 80h 60h 70h 78h ECh EDh EFh EEh 7Ah Random Data Input Random Data Output Cache Read Begin Cache Read Sequential Read Mode Cache Read End Copy Back Read Read ID Reset Page Program Cache Program Copy Back Program Block Erase Read Status Read Status Enhanced Read Parameter Pg. Unique ID Read Set Feature Get Feature Block Protection Status Read 2nd Cycle E0h 31h 30h 10h 15h D0h - Table 6-2: Two-Plane Command Table Command Macronix MX30LF4G18AC ONFI 2 Plane Program ONFI 2 Plane Cache Program ONFI 2 Plane Copy Back Program ONFI 2 Plane Block Erase P/N: AN0356 Spansion S34ML04G100 1st Cycle 2nd Cycle 85h 05h E0h 00h 31h 31h 00h 30h 3Fh 00h 35h 90h FFh 80h 10h 80h 15h 85h 10h 60h D0h 70h 78h ECh - Spansion S34ML04G100 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 80h 80h 60h 11h 11h D1h 80h 80h 60h 10h 15h D0h 80h 80h 85h 60h 11h 11h 11h D1h 80h 80h 85h 60h 10h 15h 10h D0h 5 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 6-2 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both devices. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-4 shows that Two–plane Operation Status output provided by the Enhance Read Status command (78h) is compatible. Table 6-3: Status Output Status Output Macronix MX30LF4G18AC Spansion S34ML04G100 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Reserved SR[4] Reserved PGM/ERS/Read internal controller: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[5] Table 6-4: Two-Plane Status Output Status Output Macronix MX30LF4G18AC Spansion S34ML04G100 SR[2] Selected Plane PGM/ERS status: Pass/Fail Selected Plane Cache Program status: Pass/Fail Reserved SR[3] Reserved Reserved SR[4] SR[6] Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[0] SR[1] SR[5] P/N: AN0356 6 Selected Plane PGM/ERS status: Pass/Fail Selected Plane Cache Program status: Pass/Fail Reserved Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 7. Read ID Command The ID codes of the Macronix MX30LF4G18AC and S34ML04G100 differ in the manufacturer ID and in the last byte (Table 7-1). Table 7-1: Manufacturer and Device IDs ID code Macronix MX30LF4G18AC Spansion S34ML04G100 Value C2h/DCh/90h/95h/56h 01h/DCh/90h/95h/54h st Manufacturer Code Manufacturer Code nd Device Identifier Device Identifier IO1, IO0 Number of Die per Chip Enable Number of Die per Chip Enable IO3, IO2 IO7 Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program IO1, IO0 Page Size (exclude Spare Area) Page Size (exclude Spare Area) IO2 Size of Spare Area (Byte per 512Byte) Size of Spare Area (Byte per 512Byte) IO7, IO3 Sequential Read Cycle Time (tRC) Serial Access Time (tRC) IO5, IO4 Block Size (exclude Spare Area) Block Size (exclude Spare Area) IO6 Organization Organization IO0, IO1 ECC Level Requirement Reserved IO2, IO3 Number of Plane per CE Number of Plane per CE IO4~IO6 Plane Size Plane Size IO7 Reserved Reserved 1 Byte 2 Byte 3rd Byte IO5, IO4 IO6 th 4 Byte 5th Byte P/N: AN0356 7 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 8. Power-Up Timing Macronix and Spansion® power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point, measurement items are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Macronix MX30LF4G18AC 1ms (max.) N/A 10us (max.) Spansion S34ML04G100 N/A 5ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN0356 8 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC 9. Summary Macronix MX30LF4G18AC and Spansion® S34ML04G100 NAND have similar features and pinouts. Because basic Read/Program/Erase commands as well as block, page, and spare area sizes are the same, device migration may require minimal or no firmware modifications to accommodate differences in ECC requirements. 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet Location MX30LF4G18AC Website S34ML04G100 Website Date Issue Oct. 23, 2014 Feb. 10, 2014 Revision Rev. 1.0 Rev. 17 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF4G18AC and Spansion® S34ML04G100 product families. Table 11-1: Part Number Cross Reference Density Macronix Part No. Spansion Part No. MX30LF4G18AC-TI S34ML04G100TFI00 4Gb MX30LF4G18AC-XKI S34ML04G100BHI00 Package 48-TSOP 63-VFBGA Dimension 12x20mm 9x11x1.0mm 12. Revision History Revision 1.0 P/N: AN0356 Description Initial Release 9 Date Dec. 14, 2014 Ver.1, Dec.14, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0356 10 Ver.1, Dec.14, 2014