Comparing Spansion S34ML04G100 with Macronix MX30LF4G18AC

APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF4G18AC from the Spansion®
S34ML04G100 4Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of the
datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Macronix MX30LF4G18AC
Vcc voltage range
2.7V ~ 3.6V
Bus Width
x8
Operating Temperature
-40°C ~ 85°C
Interface
ONFI 1.0 Standard
Block Size
128KB+4KB
Page Size
2KB+64B
4b/528B
ECC Requirement
OTP Size
30 pages
Guarantee Good Blocks at
Block 0
Shipping
Unique ID
ONFI standard
C2h/DCh/90h/95h/56h
ID Code
ONFI Signature
4Fh/4Eh/46h/49h
Data Retention
10 Years
48-TSOP (12x20mm)
Package
63-VFBGA (9x11mm)
P/N: AN0356
1
Spansion S34ML04G100
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+4KB
2KB+64B
1b/528B
64 pages
Block 0, 1
ONFI standard
01h/DCh/90h/95h/54h
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
3. Performance
Table 3-1 and Table 3-2 show MX30LF4G18AC and S34ML04G100 Read/Write performance.
Table 3-1: Read Function Performance (Read Latency time and Sequential Read)
Read function
Macronix MX30LF4G18AC
Spansion S34ML04G100
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Function Performance (Program and Erase)
Write Function
Macronix MX30LF4G18AC
Page Program time (tPROG)
300us (typ.) / 600us (max.)
Block Erase time (tERASE)
1ms (typ.) / 3.5ms (max.)
NOP
4 (max.)
1
Write/Erase Cycles* (Endurance)
100,000
Spansion S34ML04G100
200us (typ.) / 700us (max.)
3.5ms (typ.) / 10ms (max.)
4 (max.)
100,000
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Sequential Read Current (ICC1)
Program Current (ICC2)
Erase Current (ICC3)
Standby Current – CMOS
Macronix MX30LF4G18AC
20mA (typ.) / 30mA (max.)
20mA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
10uA (typ.) / 50uA (max.)
Spansion S34ML04G100
15mA (typ.) / 30mA (max.)
NA (typ.) / 30mA (max.)
15mA (typ.) / 30mA (max.)
10uA (typ.) / 50uA (max.)
Table 4-2: Input / Output Voltage
DC Characteristic
Macronix MX30LF4G18AC
Spansion S34ML04G100
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
Input High Voltage (VIH)
0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
0.4V (max.)
Output High Voltage (VOH)
VCC-0.2 (min.)
2.4V (min.)
P/N: AN0356
2
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Spansion devices. S34ML04G100 can be compared by the MX30LF4G18AC without
pin conflicts. Only 48-TSOP pin #38 (ball G5 on VFBGA) may need special attention because the
pin is designated “PT” which is chip protected function on the MX30LF4G18AC-TI, but
S34ML04G100 is designated as NC.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF4G18AC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML04G100
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: NC
Pin38: PT
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Spansion
Part Name
MX30LF4G18AC-TI
S34ML04G100
PT*
NC*
#38
#3
8 pin
1
1
Note
If no connect, both pin
functions are the same
Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature..
Please refer to the datasheet for more details.NC = No Connect.
P/N: AN0356
3
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF4G18AC
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML04G100
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
NC
VCC
*1
PT
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5 : NC
G5: PT
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Part Name
#G5
#G
5 ball
Macronix
Spansion
MX30LF4G18AC-XKI
S34ML04G100
PT*
NC*
1
1
Note
If no connect, both pin
functions are the same
Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature..
Please refer to the datasheet for more details.NC = No Connect.
P/N: AN0356
4
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
6. Command Set
Basic command sets (Read/Program/Erase commands)
and status checking methods are similar.
Additionally, Macronix supports a Unique ID Read, Set/Get Feature and Block Protection Status
Read function and Spansion® does not (Table 6-1).
Table 6-1: Command Table
Command
Macronix MX30LF4G18AC
1st Cycle
85h
05h
00h
31h
00h
3Fh
90h
FFh
80h
80h
60h
70h
78h
ECh
EDh
EFh
EEh
7Ah
Random Data Input
Random Data Output
Cache Read Begin
Cache Read Sequential
Read Mode
Cache Read End
Copy Back Read
Read ID
Reset
Page Program
Cache Program
Copy Back Program
Block Erase
Read Status
Read Status Enhanced
Read Parameter Pg.
Unique ID Read
Set Feature
Get Feature
Block Protection Status Read
2nd Cycle
E0h
31h
30h
10h
15h
D0h
-
Table 6-2: Two-Plane Command Table
Command
Macronix MX30LF4G18AC
ONFI 2 Plane Program
ONFI 2 Plane Cache Program
ONFI 2 Plane Copy Back Program
ONFI 2 Plane Block Erase
P/N: AN0356
Spansion
S34ML04G100
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
31h
00h
30h
3Fh
00h
35h
90h
FFh
80h
10h
80h
15h
85h
10h
60h
D0h
70h
78h
ECh
-
Spansion S34ML04G100
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
80h
80h
60h
11h
11h
D1h
80h
80h
60h
10h
15h
D0h
80h
80h
85h
60h
11h
11h
11h
D1h
80h
80h
85h
60h
10h
15h
10h
D0h
5
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
6-2 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking”
or “Status Output Checking” method may be used to monitor the operation. Both are standard
NAND flash algorithms and can be used for both devices. Table 6-3 shows that Status Output
content provided by the Read Status command (70h) is compatible. Table 6-4 shows that
Two–plane Operation Status output provided by the Enhance Read Status command (78h) is
compatible.
Table 6-3: Status Output
Status Output
Macronix MX30LF4G18AC
Spansion S34ML04G100
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Reserved
Reserved
SR[3]
Reserved
Reserved
SR[4]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
SR[6]
PGM/ERS/Read status: Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[5]
Table 6-4: Two-Plane Status Output
Status Output
Macronix MX30LF4G18AC
Spansion S34ML04G100
SR[2]
Selected Plane PGM/ERS status:
Pass/Fail
Selected Plane Cache Program status:
Pass/Fail
Reserved
SR[3]
Reserved
Reserved
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[0]
SR[1]
SR[5]
P/N: AN0356
6
Selected Plane PGM/ERS status: Pass/Fail
Selected Plane Cache Program status:
Pass/Fail
Reserved
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
7. Read ID Command
The ID codes of the Macronix MX30LF4G18AC and S34ML04G100 differ in the manufacturer ID
and in the last byte (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID code
Macronix MX30LF4G18AC
Spansion S34ML04G100
Value
C2h/DCh/90h/95h/56h
01h/DCh/90h/95h/54h
st
Manufacturer Code
Manufacturer Code
nd
Device Identifier
Device Identifier
IO1, IO0
Number of Die per Chip Enable
Number of Die per Chip Enable
IO3, IO2
IO7
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
IO1, IO0
Page Size (exclude Spare Area)
Page Size (exclude Spare Area)
IO2
Size of Spare Area (Byte per 512Byte)
Size of Spare Area (Byte per 512Byte)
IO7, IO3
Sequential Read Cycle Time (tRC)
Serial Access Time (tRC)
IO5, IO4
Block Size (exclude Spare Area)
Block Size (exclude Spare Area)
IO6
Organization
Organization
IO0, IO1
ECC Level Requirement
Reserved
IO2, IO3
Number of Plane per CE
Number of Plane per CE
IO4~IO6
Plane Size
Plane Size
IO7
Reserved
Reserved
1 Byte
2 Byte
3rd Byte
IO5, IO4
IO6
th
4 Byte
5th Byte
P/N: AN0356
7
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
8. Power-Up Timing
Macronix and Spansion® power-up sequences are similar, but the timing is slightly different.
Although both devices use 2.7V (VCC min.) as the start point, measurement items are different.
Check the system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Macronix MX30LF4G18AC
1ms (max.)
N/A
10us (max.)
Spansion S34ML04G100
N/A
5ms (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
P/N: AN0356
8
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
9. Summary
Macronix MX30LF4G18AC and Spansion® S34ML04G100 NAND have similar features and pinouts.
Because basic Read/Program/Erase commands as well as block, page, and spare area sizes are
the same, device migration may require minimal or no firmware modifications to accommodate
differences in ECC requirements.
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
Website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
Location
MX30LF4G18AC
Website
S34ML04G100
Website
Date Issue
Oct. 23, 2014
Feb. 10, 2014
Revision
Rev. 1.0
Rev. 17
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF4G18AC and Spansion® S34ML04G100 product families.
Table 11-1: Part Number Cross Reference
Density
Macronix Part No.
Spansion Part No.
MX30LF4G18AC-TI
S34ML04G100TFI00
4Gb
MX30LF4G18AC-XKI
S34ML04G100BHI00
Package
48-TSOP
63-VFBGA
Dimension
12x20mm
9x11x1.0mm
12. Revision History
Revision
1.0
P/N: AN0356
Description
Initial Release
9
Date
Dec. 14, 2014
Ver.1, Dec.14, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit,
Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS,
KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM.
The names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0356
10
Ver.1, Dec.14, 2014
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