APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 1. Introduction This application note is a guide for migrating to the Macronix MX30LF4G28AB from the Spansion® S34ML04G100 4Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Vcc Voltage Range Bus Width Operating Temperature Interface Block Size Page Size ECC Requirement OTP size Guaranteed Good blocks at shipping Unique ID ID Code ONFI signature Data Retention Package P/N: AN0281 Macronix MX30LF4G28AB 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+7KB 2KB+112B 8b/540B 30 pages Spansion S34ML04G100 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+4KB 2KB+64B 1b/528B 64 pages Block 0 Block 0 & 1 ONFI standard C2h/DCh/90h/95h/57h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) ONFI standard 01h/DCh/90h/95h/54h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 1 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 3. Performance Table 3-1 and Table 3-2 show MX30LF4G28AB and S34ML04G100 Read/Write performance. Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Read function Macronix MX30LF4G28AB Spansion S34ML04G100 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 20ns (min.) 25ns (min.) Table 3-2: Write Function Performance (Program and Erase) Write Function Macronix MX30LF4G28AB Page Program time (tPROG) 300us (typ.)/600us (max.) Block Erase time (tERASE) 1ms (typ.)/3.5ms (max.) NOP 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 Spansion S34ML04G100 300us (typ.)/700us (max.) 3.5ms (typ.)/10ms (max.) 4 (max.) 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Sequential Read Current (ICC1) Program Current (ICC2) Erase Current (ICC3) Standby Current – CMOS Macronix MX30LF4G28AB 20mA (typ.)/30mA (max.) 20mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) Spansion S34ML04G100 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) Table 4-2: Input / Output Voltage DC Characteristic Macronix MX30LF4G28AB Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) Output Low Voltage (VOL) 0.2V (max.) Output High Voltage (VOH) VCC-0.2V (min.) P/N: AN0281 2 Spansion S34ML04G100 -0.3V (min.) / 0.2Vcc (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) 0.4V (max.) 2.4V (min.) Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 5. Package Pins Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. S34ML04G100 can be compared by the MX30LF4G28AB without pin conflicts. Only 48-TSOP pin 38 and 63-VFBGA pin G5 may need special attention because the pins are designated “DNU” (Do Not Use) on the MX30LF4G28AB. A DNU pin should not be connected to any signal or power trace on the board. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF4G28AB 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 DNU VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML04G100 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: DNU (Do Not Use) Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Differences Brand Part Name pin 38 P/N: AN0281 Macronix Spansion MX30LF4G28AB-TI S34ML04G100TFI00 DNU NC 3 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF4G28AB 1 2 A NC NC B NC 3 4 5 6 7 S34ML04G100 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 DNU NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G5: DNU (Do Not Use) Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Pin Differences Brand Part Name pin G5 P/N: AN0281 Macronix Spansion MX30LF4G28AB-XKI S34ML04G100 DNU NC 4 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 6. Command Set Basic command sets and status checking methods are the same (Table 6-1). Basic Two-Plane commands are also the same (Table 6-2). Table 6-1: Command Table Command Macronix MX30LF4G28AB Spansion S34ML04G100 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle Read 00h 30h 00h 30h Random Data Input 85h - 85h - Random Data Output 05h E0h 05h E0h Cache Read Random 00h 31h 00h 31h Cache Read Sequential 31h - 31h - Cache Read End 3Fh - 3Fh - Read ID 90h - 90h - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h 80h 15h Block Erase 60h D0h 60h D0h Read Status 70h - 70h - Read Status Enhanced 78h Read Parameter Page ECh Read Unique ID EDh - Set Feature EFh - Get Feature EEh - P/N: AN0281 78h - 5 ECh - Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB Table 6-2: Two-Plane Command Table Macronix MX30LF4G28AB Spansion S34ML04G100 Command 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 2 Plane Program 80h 11h 80h 10h 80h 11h 80h 10h 2 Plane Cache Program 80h 11h 80h 15h 80h 11h 80h 15h 2 Plane Block Erase 60h D1h 60h D0h 60h D1h 60h D0h 6-1 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-3: Status Output Status Output Macronix MX30LF4G28AB Spansion S34ML04G100 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Not Used Not Used SR[3] Not Used Not Used SR[4] Not Used Not Used SR[5] PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect P/N: AN0281 6 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 7. Device Identification The 5-byte device identification codes of the S34ML04G100 and the MX30LF4G28AB are identical with the exception of the first and last byte of the ID which contain the manufacturer ID and the ECC requirement (Table 7-1). Please note that although the Spansion and Macronix devices have the same code of “1” for the Spare Area Size (4th Byte, Bit 2), the S34ML04G100 Spare Area Size is 16 Bytes per 512 Bytes (64 Bytes per page), whereas the MX30LF4G28AB Spare Area Size is 28 bytes per 512 bytes (112 Bytes per page). Firmware that uses a non-ONFI detection method may need to be modified to recognize the larger spare area of the Macronix device. Table 7-1: Manufacturer and Device IDs ID Code Value 1st Byte 2nd Byte bit 1- 0 bit 3 - 2 3rd Byte bit 5 - 4 bit 6 4th Byte 5th Byte bit 7 bit 1- 0 bit 2 bit 7, 3 bit 5 - 4 bit 6 bit 1- 0 bit 3 - 2 bit 6 - 4 bit 7 P/N: AN0281 Macronix MX30LF4G28AB Spansion S34ML04G100 C2h/DCh/90h/95h/57h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (excluding Spare Area) Spare Area Size (per 512 Bytes) Sequential Read Cycle Time (tRC) Block Size (excluding Spare Area) Organization 01h/DCh/90h/95h/54h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (excluding Spare Area) Spare Area Size (per 512 Bytes) Serial Access Time (tRC) Block Size (excluding Spare Area) Organization ECC Level Requirement Reserved Number of Planes per Chip Enable Plane Size Reserved Number of Planes per Chip Enable Plane Size Reserved 7 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 8. Power-Up Timing Macronix and Spansion® Power-up sequences are similar, but the timing is slightly different. Although both devices use 2.7V (VCC min.) as the start point to activate the internal initialization sequence, timing parameters used to identify the end of the sequence are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Macronix MX30LF4G28AB 1ms (max.) N/A 10us (max.) Spansion S34ML04G100 N/A 5ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN0281 8 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB 9. Summary Macronix MX30LF4G28AB and Spansion® S34ML04G100 NAND have similar features and pinouts. Basic Read/Program/Erase commands are the same. Overall, device migration may require minimal or no firmware modifications, except those that may be needed to accommodate differences in spare area size and ECC requirements. 10. References Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet Location MX30LF4G28AB S34ML01G1_04G1 Website - Date Issued Revision Jun. 3, 2014 Aug. 9, 2013 Rev. 1.1 Rev. 16 Note: Macronix datasheet is subject to change without notice. 11. Part Number Cross-Reference Table 11-1: Part Number Cross Reference Density 4Gb Macronix Part No. MX30LF4G28AB-TI MX30LF4G28AB-XKI Spansion Part No. S34ML04G100TFI00 S34ML04G100BHI00 Package 48-TSOP 63-VFBGA Dimension 12x20mm 9x11x1.0mm 12. Revision History Table 12-1: Revision History Revision 1.0 2.0 P/N: AN0281 Description Initial Release Table 3-1 values revised to match Macronix Rev 1.1 datasheet. Added text in Section 7 to highlight that firmware changes may be needed to properly recognize the Macronix Spare Area Size. 9 Date Dec. 26, 2013 Jun. 10, 2014 Rev: 2, Jun. 10, 2014 APPLICATION NOTE Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Website at: http://www.macronix.com P/N: AN0281 10 Rev: 2, Jun. 10, 2014