Comparing Spansion S34ML04G100 with Macronix MX30LF4G28AB

APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF4G28AB from the
Spansion® S34ML04G100 4Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of
the datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Vcc Voltage Range
Bus Width
Operating Temperature
Interface
Block Size
Page Size
ECC Requirement
OTP size
Guaranteed Good blocks at
shipping
Unique ID
ID Code
ONFI signature
Data Retention
Package
P/N: AN0281
Macronix MX30LF4G28AB
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+7KB
2KB+112B
8b/540B
30 pages
Spansion S34ML04G100
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+4KB
2KB+64B
1b/528B
64 pages
Block 0
Block 0 & 1
ONFI standard
C2h/DCh/90h/95h/57h
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
ONFI standard
01h/DCh/90h/95h/54h
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
1
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
3. Performance
Table 3-1 and Table 3-2 show MX30LF4G28AB and S34ML04G100 Read/Write performance.
Table 3-1: Read Function Performance (Read Latency time and Sequential Read)
Read function
Macronix MX30LF4G28AB
Spansion S34ML04G100
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Function Performance (Program and Erase)
Write Function
Macronix MX30LF4G28AB
Page Program time (tPROG)
300us (typ.)/600us (max.)
Block Erase time (tERASE)
1ms (typ.)/3.5ms (max.)
NOP
4 (max.)
1
Write/Erase Cycles* (Endurance)
100,000
Spansion S34ML04G100
300us (typ.)/700us (max.)
3.5ms (typ.)/10ms (max.)
4 (max.)
100,000
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Sequential Read Current (ICC1)
Program Current (ICC2)
Erase Current (ICC3)
Standby Current – CMOS
Macronix MX30LF4G28AB
20mA (typ.)/30mA (max.)
20mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
10uA (typ.)/50uA (max.)
Spansion S34ML04G100
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
10uA (typ.)/50uA (max.)
Table 4-2: Input / Output Voltage
DC Characteristic
Macronix MX30LF4G28AB
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
Input High Voltage (VIH)
0.8VCC (min.) / VCC+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
Output High Voltage (VOH)
VCC-0.2V (min.)
P/N: AN0281
2
Spansion S34ML04G100
-0.3V (min.) / 0.2Vcc (max.)
0.8Vcc (min.) / Vcc+0.3V (max.)
0.4V (max.)
2.4V (min.)
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
5. Package Pins
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Spansion devices. S34ML04G100 can be compared by the MX30LF4G28AB without
pin conflicts. Only 48-TSOP pin 38 and 63-VFBGA pin G5 may need special attention because the
pins are designated “DNU” (Do Not Use) on the MX30LF4G28AB. A DNU pin should not be
connected to any signal or power trace on the board.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF4G28AB
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
DNU
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML04G100
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Pin38: DNU (Do Not Use)
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Differences
Brand
Part Name
pin 38
P/N: AN0281
Macronix
Spansion
MX30LF4G28AB-TI
S34ML04G100TFI00
DNU
NC
3
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF4G28AB
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML04G100
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
NC
VCC
*1
DNU
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5: DNU (Do Not Use)
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Pin Differences
Brand
Part Name
pin G5
P/N: AN0281
Macronix
Spansion
MX30LF4G28AB-XKI
S34ML04G100
DNU
NC
4
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
6. Command Set
Basic command sets and status checking methods are the same (Table 6-1). Basic Two-Plane
commands are also the same (Table 6-2).
Table 6-1: Command Table
Command
Macronix MX30LF4G28AB
Spansion S34ML04G100
1st Cycle
2nd Cycle
1st Cycle
2nd Cycle
Read
00h
30h
00h
30h
Random Data Input
85h
-
85h
-
Random Data Output
05h
E0h
05h
E0h
Cache Read Random
00h
31h
00h
31h
Cache Read Sequential
31h
-
31h
-
Cache Read End
3Fh
-
3Fh
-
Read ID
90h
-
90h
-
Reset
FFh
-
FFh
-
Page Program
80h
10h
80h
10h
Cache Program
80h
15h
80h
15h
Block Erase
60h
D0h
60h
D0h
Read Status
70h
-
70h
-
Read Status Enhanced
78h
Read Parameter Page
ECh
Read Unique ID
EDh
-
Set Feature
EFh
-
Get Feature
EEh
-
P/N: AN0281
78h
-
5
ECh
-
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
Table 6-2: Two-Plane Command Table
Macronix MX30LF4G28AB
Spansion S34ML04G100
Command
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
2 Plane Program
80h
11h
80h
10h
80h
11h
80h
10h
2 Plane Cache Program
80h
11h
80h
15h
80h
11h
80h
15h
2 Plane Block Erase
60h
D1h
60h
D0h
60h
D1h
60h
D0h
6-1 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking”
or “Status Output Checking” method may be used to monitor the operation. Both are standard
NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status
Output content provided by the Read Status command (70h) is compatible.
Table 6-3: Status Output
Status Output
Macronix MX30LF4G28AB
Spansion S34ML04G100
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Not Used
Not Used
SR[3]
Not Used
Not Used
SR[4]
Not Used
Not Used
SR[5]
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read internal controller:
Ready/Busy
SR[6]
PGM/ERS/Read status: Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
P/N: AN0281
6
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
7. Device Identification
The 5-byte device identification codes of the S34ML04G100 and the MX30LF4G28AB are
identical with the exception of the first and last byte of the ID which contain the manufacturer ID
and the ECC requirement (Table 7-1). Please note that although the Spansion and Macronix
devices have the same code of “1” for the Spare Area Size (4th Byte, Bit 2), the S34ML04G100
Spare Area Size is 16 Bytes per 512 Bytes (64 Bytes per page), whereas the MX30LF4G28AB
Spare Area Size is 28 bytes per 512 bytes (112 Bytes per page). Firmware that uses a non-ONFI
detection method may need to be modified to recognize the larger spare area of the Macronix
device.
Table 7-1: Manufacturer and Device IDs
ID Code
Value
1st Byte
2nd Byte
bit 1- 0
bit 3 - 2
3rd Byte
bit 5 - 4
bit 6
4th Byte
5th Byte
bit 7
bit 1- 0
bit 2
bit 7, 3
bit 5 - 4
bit 6
bit 1- 0
bit 3 - 2
bit 6 - 4
bit 7
P/N: AN0281
Macronix MX30LF4G28AB
Spansion S34ML04G100
C2h/DCh/90h/95h/57h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (excluding Spare Area)
Spare Area Size (per 512 Bytes)
Sequential Read Cycle Time (tRC)
Block Size (excluding Spare Area)
Organization
01h/DCh/90h/95h/54h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (excluding Spare Area)
Spare Area Size (per 512 Bytes)
Serial Access Time (tRC)
Block Size (excluding Spare Area)
Organization
ECC Level Requirement
Reserved
Number of Planes per Chip Enable
Plane Size
Reserved
Number of Planes per Chip Enable
Plane Size
Reserved
7
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
8. Power-Up Timing
Macronix and Spansion® Power-up sequences are similar, but the timing is slightly different.
Although both devices use 2.7V (VCC min.) as the start point to activate the internal initialization
sequence, timing parameters used to identify the end of the sequence are different. Check the
system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Macronix MX30LF4G28AB
1ms (max.)
N/A
10us (max.)
Spansion S34ML04G100
N/A
5ms (max.)
100us (max.)
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
P/N: AN0281
8
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
9. Summary
Macronix MX30LF4G28AB and Spansion® S34ML04G100 NAND have similar features and
pinouts. Basic Read/Program/Erase commands are the same. Overall, device migration may
require minimal or no firmware modifications, except those that may be needed to accommodate
differences in spare area size and ECC requirements.
10. References
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
Location
MX30LF4G28AB
S34ML01G1_04G1
Website
-
Date Issued
Revision
Jun. 3, 2014
Aug. 9, 2013
Rev. 1.1
Rev. 16
Note: Macronix datasheet is subject to change without notice.
11. Part Number Cross-Reference
Table 11-1: Part Number Cross Reference
Density
4Gb
Macronix Part No.
MX30LF4G28AB-TI
MX30LF4G28AB-XKI
Spansion Part No.
S34ML04G100TFI00
S34ML04G100BHI00
Package
48-TSOP
63-VFBGA
Dimension
12x20mm
9x11x1.0mm
12. Revision History
Table 12-1: Revision History
Revision
1.0
2.0
P/N: AN0281
Description
Initial Release
Table 3-1 values revised to match Macronix Rev 1.1 datasheet.
Added text in Section 7 to highlight that firmware changes may be
needed to properly recognize the Macronix Spare Area Size.
9
Date
Dec. 26, 2013
Jun. 10, 2014
Rev: 2, Jun. 10, 2014
APPLICATION NOTE
Comparing Spansion® S34ML04G100 with Macronix MX30LF4G28AB
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Website at: http://www.macronix.com
P/N: AN0281
10
Rev: 2, Jun. 10, 2014
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