APPLICATION NOTE Migrating from MX29GL256E to MX29GL256F 1. Introduction This application note describes the major differences between MX29GL256E and MX29GL256F. All the information in this document is based on the latest datasheet of the MX29GL256F and it will be subject to change if any further update from datasheet. 2. Feature Comparison Part Number MX29GL256E MX29GL256F 2.7~3.6V 2.7~3.6V 56-TSOP (14x20mm²) 64-FGBA/LFBGA (11x13mm²) 70-SSOP 56-TSOP (14x20mm²) 64-FGBA/LFBGA (11x13mm²) 70-SSOP 56FBGA (7x9mm²) Uniform Sector 128KB Uniform Sector 128KB Read 8Word (16Byte) 8Word (16Byte) Write 32Word (64Byte) 32Word (64Byte) x8 /x16 x8 / x16 Yes Yes VCC Range Package Feature Sector Architecture Page buffer Configuration CFI (Commom Flash Interface) Security Sector Protection 256 bytes Software Hardware Parameter Password protection Solid Protection, USPB (Note 1) WP# Typ. Max. 256 bytes Password protection Solid Protection, USPB (Note 1) WP# Min. 90ns (3.0~3.6) 100ns (2.7~3.6) 25ns Max. 90ns (3.0~3.6) 100ns (2.7~3.6) 25ns Access Time (Taa) Random ns Access Time (Taa) Page ns Word Program Time us 11 360 10 180 Chip Program Time sec 100 350 80 350 Sector Erase Time sec 0.6 5 0.5 3.5 Chip Erase Time sec 128 300 100 250 Total Write Buffer Time us 200 120 Ace Total Write Buffer Time us 100 70 cycles 100,000 100,000 Erase/Program Cycle Note 1. USPB = Temporary un-protect solid write protect bits. Publication Number: AN-077 1 REV. 2, OCT. 29, 2013 APPLICATION NOTE Migrating from MX29GL256E to MX29GL256F 3. DC Specifications Parameter MX29GL256E MX29GL256F Icr1, Read current (5MHz,mA) Icr2, Read current (10MHz,mA) 50 (Max) 10 (Max) 20 (Max) 5 (Max) Isb ,Standby current (uA ) Isbr, Reset current 100 (Max) 100 (Max) 50 (Max) 50 (Max) 10uA (Typical) 1uA (Typical) Idpd, Deep power down current 4. AC Specifications Parameter MX29GL256E MX29GL256F Taa, Valid data output after address (ns) Tce, Valid data output after CE# low (ns) 90 /100 (Max.) 90 / 100 (Max.) 90 / 100 (Max.) 90 / 100 (Max.) Toe, Valid data output after OE# low (ns) Trc, Read period time (ns) 25 (Max.) 90 / 100 (Max.) 25 (Max.) 90 / 100 (Max.) Twc, Write period time (ns) Tcwc, Command period time (ns) 90 / 100 (Max.) 90 / 100 (Max.) 90 / 100 (Max.) 90 / 100 (Max.) 5. Manufacturer ID & Device ID Comparison Part Number MX29GL256E Manufacturer ID Device ID (Word Mode) Publication Number: AN-077 MX29GL256F 00C2h 00C2h 227Eh / 2222h / 2201h 227Eh / 2222h / 2201h 2 REV. 2, OCT. 29, 2013 APPLICATION NOTE Migrating from MX29GL256E to MX29GL256F 6. Software Notices The MX29GL256F is command compatible with MX29GL256E such that it will be easy to migrate without any command change. The CFI code of MX2GL256F is the same as MX29GL256E. 7. References The following datasheets were used for preparing this comparison note: Datasheet Location Date Issued Version MX29GL256E Macronix Website Jul. 26, 2011 1.4 MX29GL256F Macronix Website Jan. 12, 2012 1.3 For more functional and parametric specifications, please refer to the datasheet on the Macronix Website at http://www.macronix.com/ and go to: Products/Flash Memory/Parallel Flash. Publication Number: AN-077 3 REV. 2, OCT. 29, 2013 APPLICATION NOTE Migrating from MX29GL256E to MX29GL256F REVISION HISTORY Revision No. DescriptionPageDate 1. 1. Initial release JUL/20/2010 2. 1. Added a new package - 56FBGA(7x9mm²) P1 2. Updated parameters & DC specifications P1, 2 3. Updated Feature Comparison Table P1 Publication Number: AN-077 4 OCT/07/2013 REV. 2, OCT. 29, 2013 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 5