Comparing Spansion S29AL016J with Macronix MX29LV160D

APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
1. Introduction
Macronix MX29LV160D and Spansion® S29AL016J 16Mb 3.0V parallel flash have similar features,
performance, and command codes. This application note explains how to simply and easily
compare the Spansion® device with the equivalent Macronix MX29LV160D flash.
The information in this document is based on datasheets listed in Section 10.
Newer versions of the datasheets may override the contents of this document.
2. General Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Features
Type / Function
VCC Voltage Range
Access Time
Bus Width
Boot Block
Sector Architecture
OTP Security Region
CFI Compliant
Sector Protect/Unprotect
Temp Sector Protect/Unprotect
Erase Suspend/Resume
Hardware Reset# Pin
WP# Pin
Manufacture ID
Device ID Top/Bottom
Note:
MX29LV160D
2.7V ~ 3.6V
70ns
X8 / x16
Top/Bottom
S29AL016J
2.7V ~ 3.6V
55ns*1/70ns
X8 / x16
Top/Bottom
16KB+ 2*8KB+32KB
+ 31*64KB sectors.
16KB+ 2*8KB+32KB
+ 31*64KB sectors.
Yes
Yes
Yes
Yes
Yes
Yes
C2h
256Byte
Yes
Yes
Yes
Yes
Yes
Yes
01h
22C4h/2249h
22C4h/2249h
Restricted Vcc Voltage Range, Vcc = 3.0V ~ 3.6V.
P/Nr: AN0223
1
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
3. Package and Pinout
Current package offerings are shown in Table 3-1.
Table 3-1: Package Options
Package
MX29LV160D
Yes
Yes
Yes*1
Yes*1
Yes
Yes
-
48-TSOP (12x20mm) Normal
48-CSP TFBGA(6x8x1.2mm) 0.3mm ball
48-TFBGA (6x8x1.2mm) 0.4mm ball
48-LFBGA (6x8x1.3mm) 0.4mm ball
48-XFLGA (4 x 6 x 0.5mm) 0.3mm ball
48-WFBGA (4 x 6 x 0.75mm) 0.3mm ball
64-LFBGA (9x9mm)
0.6mm ball
S29AL016J
Yes
Yes*1
Yes*1
Yes
Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm.
The Macronix and Spansion® families have virtually identical footprints and pinouts. The
48-TSOP and 48-LFBGA packages are shown below for comparison. Macronix offers an
accelerated programming option on pin 14 of the 48TSOP (pin B3 of the LFBGA) shared
with the WP# pin. No modifications are necessary to accommodate this extra feature.
Figure 3-1: 48-TSOP (12x20mm) Package Pin-out Comparison
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE#
RESET#
NC
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
43
42
42
MX29LV160
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
GND
Q15/A-1
Q7
Q14
Q6
Q13
Q5
Q12
Q4
VCC
Q11
Q3
Q10
Q2
Q9
Q1
Q8
Q0
OE#
GND
CE#
A0
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE#
RESET#
NC
WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
Note: Pin 14= WP#/ACC
P/Nr: AN0223
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
43
42
42
S29AL016
41
40
39
38
37
36
35
34
33
32
31
30
29
27
28
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
Note: Spansion pin 14= WP#
2
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
Figure 3-2: 48-LFBGA (6x8mm) Package Pin-out Comparison
MX29LV160
S29AL016
6
A13
A12
A14
A15
A16
BYTE
#
Q15/
A-1
GND
7
A13
A12
A14
A15
A16
BYTE
#
DQ15
/A-1
VSS
5
A9
A8
A10
A11
Q7
Q14
Q13
Q6
6
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
4
WE#
RESET#
NC
A19
Q5
Q12
VCC
Q4
5
WE#
RESET#
NC
A19
DQ5
DQ12
VCC
DQ4
3
RY/
BY#
WP#/
ACC
A18
NC
Q2
Q10
Q11
Q3
4
RY/
BY#
WP#
A18
NC
DQ2
DQ10
DQ11
DQ3
2
A7
A17
A6
A5
Q0
Q8
Q9
Q1
3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
1
A3
A4
A2
A1
A0
CE#
OE#
GND
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
D
E
F
G
H
A
B
C
D
Note: Spansion pin B3= WP#
E
F
G
H
A
B
C
Note: Pin B3= WP#/ACC
4. Command Set and Firmware
Basic commands and write status checking methods are the same. The Read operation and Write
command could be used directly without any modification. Table 4-1 shows the command set in
Word mode.
Table 4-1: Basic Commands (Word Mode)
Command
Read
Reset
Program
Chip
Erase
Sector
Erase
Program/Erase
Suspend
Program/Erase
Resume
Addr
Addr
XXX
555h
555h
555h
XXX
XXX
Cycle
Data
Data
F0h
AAh
AAh
AAh
B0h
30h
nd
Addr
2AAh
2AAh
2AAh
Data
55h
55h
55h
Addr
555h
555h
555h
st
1 Bus
2
Bus
Cycle
rd
3 Bus
Cycle
Data
A0h
80h
80h
4 Bus
Addr
Addr
555h
555h
Cycle
Data
Data
AAh
AAh
2AAh
2AAh
Data
55h
55h
Addr
555h
SA
10h
30h
th
th
5 Bus
Cycle
th
6 Bus
Addr
Cycle
Data
Note: SA: Sector Address
P/Nr: AN0223
3
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
5. Electrical Characteristics
Both device families have similar power requirements during Program and Erase.
Table 5-1: Read / Write Current
DC Characteristic
Condition
typ @ 5MHz
Read Current
max @ 5MHz
typ
Standby Current
max
typ
Write Current
max
MX29LV160D
5mA
12mA
5uA
15uA
15mA
30mA
S29AL016J
7mA
12mA
0.2uA
5uA
20mA
30mA
Table 5-2 shows that both devices have similar input sink and output drive characteristics.
Macronix supports a high voltage Accelerated Programming option (typically done off-line).
Table 5-2: Input / Output Voltage
DC Characteristic
Condition
min
Input Low Voltage
max
min
Input High Voltage
max
Output Low Voltage
max
Output High Voltage
min
ACC Program Acceleration Voltage
P/Nr: AN0223
MX29LV160D
-0.5V
0.8V
0.7VCC
VCC+0.3V
0.45V
0.85VCC
9.5V ~ 10.5V
4
S29AL016J
-0.1V
0.8V
0.7VCC
VCC+0.3V
0.45V
0.85VCC
-
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
6. Erase and Programming Performance
Table 6-1 and 6-2 show MX29LV160D and S29AL016J series have similar Read/Write
performance.
Table 6-1: AC Characteristics
Symbol
Taa
Tce
Tcp
Note:
Description
Random Read
Access Time
VCC =3.0-3.6V
VCC= 2.7-3.6V
MX29LV160D
70ns
Valid data
output after
CE# low
VCC =3.0-3.6V
-
55ns
VCC= 2.7-3.6V
70ns
70ns
VCC =2.7-3.6V
35ns
35ns
Chip Enable Pulse
Width
S29AL016J
55ns
70ns
Values provided in Table 6-1 are “maximum” values.
Table 6-2: Write Function Performance (Program and Erase)
Write Function
MX29LV160D
Byte Program Time
9us
Word Program Time
11us
Accelerated Byte/Word Programming
7us
Time
S29AL016J
6us
6us
-
Chip Program Time Byte Mode
18s
21.6s
Chip Program Time Word Mode
12s
6.3s
Sector Erase time
0.7s
0.5s
Chip Erase time
15s
16s
Note: Values provided in Table 6-2 are “typical” values.
P/Nr: AN0223
5
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
7. Memory Organization
The memory and sector architecture of the MX29LV160D is identical to the S29AL016J, as seen in
Features Table 2-1.
8. Manufacturer ID & Device ID Command
Manufacturer IDs are different and permits software to identify the device manufacturer, but Device
IDs are the same. The same command set is used read the different Manufacturer IDs.
Table 8-1: Manufacturer and Device ID Command Definitions (Word Mode)
Manufacturer ID
Flash Vender
st
1 Bus Cycle
(command)
2nd Bus Cycle
(command)
3rd Bus Cycle
(command)
4th Bus Cycle
(ID output)
Address
Data
Address
Data
Address
Data
Address
Data
Device ID
MX29LV160D
S29AL016J
MX29LV160D
S29AL016J
555h
AAh
2AAh
55h
555h
90h
X00h
C2h
555h
AAh
2AAh
55h
555h
90h
X00h
01h
555h
AAh
2AAh
55h
555h
90h
X01h
22C4h/2249h
555h
AAh
2AAh
55h
555h
90h
X01h
22C4h/2249h
Note.
(1) Device ID can be read out after Manufacturer ID with proper address and does not need another command
sequence.
(2) Use Reset command (F0h) to return to normal read mode.
P/Nr: AN0223
6
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
9. Part Number Cross-Reference
Cross Reference Table 9-1 shows basic part number and package information for the Macronix
MX29LV160D and Spansion products.
Table 9-1: Part Number Cross Reference
Density
Macronix Part*1
Spansion® Part
16Mb
MX29LV160DTXGI-70G*1
MX29LV160DBXGI-70G*1
MX29LV160DTXGI-70G*1
MX29LV160DBXGI-70G*1
MX29LV160DTXGI-55Q*1
MX29LV160DBXGI-55Q*1
MX29LV160DTXEI-70G*1
MX29LV160DBXEI-70G*1
MX29LV160DTXEI-70G*1
MX29LV160DBXEI-70G*1
MX29LV160DTXEI-55Q*1
MX29LV160DBXEI-55Q*1
MX29LV160DTTI-70G
MX29LV160DBTI-70G
MX29LV160DTTI-70G
MX29LV160DBTI-70G
MX29LV160DTTI-55Q
MX29LV160DBTI-55Q
S29AL016J70BFI01
S29AL016J70BFI02
S29AL016J70BFI03
S29AL016J70BFI04
S29AL016J55BFIR1
S29AL016J55BFIR2
S29AL016J70BFI01
S29AL016J70BFI02
S29AL016J70BFI03
S29AL016J70BFI04
S29AL016J55BFIR1
S29AL016J55BFIR2
S29AL016J70TFI01
S29AL016J70TFI02
S29AL016J70TFI03
S29AL016J70TFI04
S29AL016J55TFIR1
S29AL016J55TFIR2
Package
Dimension
48-LFBGA*1
6x8x1.2mm
0.4mm ball
48-LFBGA*1
6x8x1.3mm
0.4mm ball
48-TSOP
12x20mm
Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm.
10. Reference Documents
Table 10-1 shows the datasheet versions used for comparison in this application note. For the
most current, detailed Macronix specification, please refer to the Macronix Website at
http://www.macronix.com
Table 10-1: Datasheet Version
Data sheet
Location
Date Issue
Revision
MX29LV160D
S29AL016J_00
Website
Website
Dec. 22, 2011
Apr. 12, 2012
Rev. 1.2
Rev. 12
P/Nr: AN0223
7
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
11. Summary
Macronix MX29LV160D and Spansion S29AL016J 16Mb 3.0V parallel Flash occupy the same PCB
footprint and have similar commands, functions, and features. Macronix does not support a
Secured Silicon Sector.
12. Revision History
Table 12-1: Revision History
Revision No.
Description
Page
Date
REV. 1
Initial Release
ALL
Jan. 15, 2013
P/Nr: AN0223
8
Ver.1, Jan. 15, 2013
APPLICATION NOTE
Comparing Spansion® S29AL016J with Macronix MX29LV160D
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations;
and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2011~2012. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit,
Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo,
BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich
TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification
purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/Nr: AN0223
9
Ver.1, Jan. 15, 2013
Similar pages