Advanced Packaging Brief A4 OLFR1 ( 1.78 MB )

Module Parameters
Minimum substrate thickness
450um (assumes 4 copper layers
and minimum 75um die thickness)
Minimum feature size
75um
Minimum module XY size
die XY dimension + 1.4mm
Encapsulation
yes
Traceability
yes
Embedded components
yes
SMD components on top layer
yes
Packaging
JEDEC tray or tape and reel.
Footprint
LGA
Test Group
Moisture Sensitivity Preconditioning:
Test Standard
Result
JESD22-A113F, IPC/JEDEC J-STD-020 Level 2a
Temperature Cycling
-40°C to 60°C, 5 cycles
Bake
125°C for 24 hrs
Moisture Soak
120 hrs, 60°C/60%RH
3x Reflow
JESD22-A113F, 260°C
3
Thermal Stress:
Low Temperature Storage
-40°C, 72 hrs
High Temperature Storage
125°C, 72 hrs
Temperature Cycling
MIL-STD-883 Method 1010, Condition B, -55°C to 125°C, 20 cycles
3
Mechanical Stress:
Mechanical Shock
MIL-STD-883 Method 2002, Condition B, 5 shocks, 1500g
Mechanical Vibration
MIL-STD-883 Method 2007, Condition A, 20-2000Hz, 20G
Constant Acceleration
MIL-STD-883 Method 2001, 10,000G
3
Steady State Life Testing:
Low and High Temperature Testing
0°C, 55°C
HTOL
125°C, 1000 hrs
3
Exposure:
Resistance to Solvents
MIL-STD-883 Method 2016
ESD
MIL-883 Method 3015, 1000V HBM
3
Assembly:
Component Shear
MIL-STD-883 Method 2019/2011
External physical dimensions
MIL-883 Method 2016
Solderability
MIL-STD-883 Method 2003.8/2022.2
Ionic Cleanliness
IPC-TM-650
3
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