Antifuse Product Information Brochure ( 647.76 kB )

Power Matters.™
Antifuse Product
Information Brochure
Providing industry-leading FPGAs and SoCs for
applications where security is vital, reliability is
non-negotiable and power matters.
2
www.microsemi.com/fpga-soc
Antifuse Product Information Brochure
Table of Contents
Axcelerator
• Nonvolatile, high-speed antifuse FPGAs
• Utilizes FuseLock™ design security
• Based upon 0.15 µm, seven-layers-of-metal
CMOS antifuse process technology
4
eX
• Third-generation, low-power, low-density
antifuse devices
• Based on the SX-A architecture with greater
than 350 MHz performance
• Manufactured on 0.22 µm CMOS antifuse
process technology
5
SX-A
• Antifuse devices with 270 MHz system performance
and sea-of-modules architecture
• Enabled by Microsemi’s patented metal-to-metal
antifuse interconnect elements
• 66 MHz PCI compliant
6
MX
• Antifuse devices with 250 MHz system performance
and MultiPlex I/O
• Supports mixed-voltage and 5 V-only operation
• Contains embedded Dual-port SRAM modules
7
FPGA Packages
• Package dimensions
8
Antifuse FPGA Selector Guide
• Compare Microsemi antifuse FPGAs features
10
Antifuse I/Os by Package
• Compare packages for Microsemi’s antifuse devices
11
Please refer to www.microsemi.com/fpga-soc and appropriate product datasheets for the latest device information, valid ordering codes and more information.
www.microsemi.com/fpga-soc
3
Axcelerator
The Axcelerator FPGA family is a single-chip, nonvolatile solution offering high performance and unprecedented design security at densities of up to 2 million
equivalent system gates. Utilizing the AX architecture, Axcelerator devices have several system-level features, such as embedded SRAM (with embedded FIFO
control logic), PLLs, segmentable clocks, chip-wide highway routing and carry logic. The solution is based upon 0.15 µm, seven-layers-of-metal CMOS antifuse
process technology and 350 MHz system performance.
• 500+ MHz internal performance
• 500+ MHz embedded FIFOs
• PLL output up to 1 GHz and
8 PLLs per device
• Bank-selectable I/Os—8 banks
per chip
• 4.5 kbits variable-aspect RAM
blocks with built-in FIFO control
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V
mixed-voltage operation
Axcelerator Devices
Axcelerator Devices
AX125
AX250
AX500
AX1000
AX2000
Capacity
(in equivalent system gates)
125,000
250,000
500,000
1,000,000
2,000,000
Typical Gates
82,000
154,000
286,000
612,000
1,060,000
672
1,408
2,688
6,048
10,752
Combinatorial (C-cells)
1,344
2,816
5,376
12,096
21,504
Maximum Flip-flops
1,344
2,816
5,376
12,096
21,504
Register (R-cells)
Number of Core RAM Blocks
Total Bits of Core RAM
12
16
36
64
55,296
73,728
165,888
294,912
Clocks (hardwired)
4
4
4
4
4
Clocks (routed)
4
4
4
4
4
PLLs
8
8
8
8
8
8
8
8
8
8
168
248
336
516
684
Maximum LVDS Channels
84
124
168
258
342
Total I/O Registers
504
744
1,008
1,548
2,052
Std., –1, –2
Std., –1, –2
Std., –1, –2
Std., –1, –2
Std., –1, –2
C, I
C, I, M
C, I, M
C, I, M
C, I, M
AX250
AX500
AX1000
AX2000
208
208
I/O Banks
Maximum User I/Os
Speed Grades
Axc e le ra tor
4
18,432
Temperature Grades
C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B
I/Os Per Package
Axcelerator Devices
AX125
PQFP
729
PBGA
FBGA
256, 324
CQFP
CCGA /CLGA
4
www.microsemi.com/products/fpga-soc/antifuse-fpgas/axcelerator
256, 484
484, 676
484, 676, 896
896, 1152
208, 352
208, 352
352
256, 352
624
624
eX
The eX family of FPGAs, with its focused combination of features, can meet all of your power, speed, package and price requirements. eX devices are optimized
for wired and mobile e-appliances, and enable designers to use a flexible single-chip FPGA for their traditional low-density ASIC requirements without the long
lead times and costly NRE charges.
• Low power consumption
• Live at power-up
• 2.5 V, 3.3 V, and 5.0 V mixedvoltage operation with 5.0 V input
tolerance and 5.0 V drive strength
• Up to 100% resource utilization
with 100% pin locking
• Available in automotive
temperature grades
• Fuselock secure programming
technology prevents reverse
engineering and design theft
eX Devices
eX Devices
eX64
eX128
eX256
System Gates
3,000
6,000
12,000
Typical Gates
2,000
4,000
8,000
Dedicated Flip-flops
64
128
256
Maximum Flip-flops
128
256
512
Combinatorial Cells 128
256
512
Maximum User I/Os
84
100
132
1
Capacity
Register Cells
Global Clocks
Hardwired
1
1
Routed
2
2
2
–F, Std, –P
–F, Std, –P
–F, Std, –P
C, I, A
C, I, A
C, I, A
64, 100
64, 100
100
Speed Grades
Temperature Grades
Package (by pin count)
TQFP
C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B
eX
www.microsemi.com/products/fpga-soc/antifuse-fpgas/ex-fpga
5
SX-A
The SX-A family of FPGAs offers a cost-effective, single-chip solution for low-power, high-performance designs. SX-A devices can be used to generate system-wide
savings by integrating multiple functions into a single-chip solution. Providing a combination of performance, security and low power, SX-A FPGAs decrease the
premium for performance while providing a solution that is highly resistant to reverse engineering.
• 250 MHz system performance
• 350 MHz internal performance
• Power-up and power-down
friendly (no sequencing required
for supply voltages)
• 66 MHz, 64-bit 3.3 V / 5.0 V PCI
performance (supporting target,
master and master/target)
• 2.5 V, 3.3 V, and 5.0 V
mixed-voltage support
• 100% resource utilization
with 100% pin locking
SX-A Devices
SX-A Device
A54SX08A
A54SX16A
A54SX32A
Typical Gates
8,000
16,000
32,000
72,000
System Gates
12,000
24,000
48,000
108,000
Logic Modules
768
1,452
2,880
6,036
Combinatorial Cells
512
924
1,800
4,024
Dedicated Flip-flops
256
528
1,080
2,012
Maximum Flip-flops
512 *
990
1,980
4,024
Maximum User I/Os
130
180
249
360
3
3
3
3
Global Clocks
Quadrant Clocks
Boundary Scan Testing
A54SX72A
0
0
0
4
Yes
Yes
Yes
Yes
3.3 V / 5 V PCI
Yes
Yes
Yes
Yes
Input Set-up (external)
0 ns
0 ns
0 ns
0 ns
–F, Std., –1, –2
–F, Std., –1, –2
–F, Std., –1, –2
–F, Std., –1, –2
C, I, A, M
C, I, A, M
C, I, A, M, B
C, I, A, M, B
A54SX08A
A54SX16A
A54SX32A
A54SX72A
208
208
208
208
100, 144
100, 144
100, 144, 176
Speed Grades
Temperature Grades
C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B
SX-A
I/Os Per Package
SX-A Devices
PQFP
VQFP
TQFP
329
PBGA
FBGA
CQFP
6
www.microsemi.com/products/fpga-soc/antifuse-fpgas/sx-a
144
144, 256
144, 256, 484
256, 484
84, 208, 256
208, 256
MX
Featuring very low power consumption and the industry’s highest design security, MX FPGAs offer designers a reliable, single-chip ASIC alternative. MX devices
provide high performance while shortening the system design and development cycle. Offering an efficient, flexible 5.0 V architecture, MX is an ideal high-volume
platform for integrating your legacy PLDs into a single device. Example applications include high-speed controllers and address decoding, peripheral bus
interfaces, DSP and coprocessor functions.
• Single-chip ASIC alternative
• Fast wide-decode circuitry
• High performance
mixed-voltage solution
• Contains embedded dual-port
SRAM modules
• Ceramic devices available
to DSCC SM
• QML certification
MX Devices
MX Devices
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
3,000
6,000
14,000
24,000
36,000
54,000
SRAM Bits
—
—
—
—
—
2,560
Sequential
—
—
348
624
954
1,230
295
547
336
608
912
1,184
—
—
—
—
24
24
9.5 ns
9.5 ns
5.6 ns
6.1 ns
6.1 ns
6.3 ns
SRAM Modules
(64x4 or 32x8)
—
—
—
—
—
10
Dedicated Flip-flops
—
—
348
624
954
1,230
System Gates
Combinatorial
Decode
Clock-to-out
1
1
2
2
2
6
Maximum Flip-flops
147
273
516
928
1,410
1,822
User I/Os (maximum)
57
69
104
140
176
202
PCI
—
—
—
—
Yes
Yes
Boundary Scan Test (BST)
—
—
—
—
Yes
Yes
–F, Std., –1, –2, –3
–F, Std., –1, –2, –3
–F, Std., –1, –2, –3
–F, Std., –1, –2, –3
–F, Std., –1, –2, –3
–F, Std., –1, –2, –3
C, I, M, A
C, I, M, A
C, I, M, A
C, I, M, A
C, I, M, A
C, I, M, A, B
A42MX36
Clocks
Speed Grades
Temperature Grades
C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B
MX
I/Os Per Package
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
PLCC
MX Devices
44, 68
44, 68, 84
84
84
84
PQFP
100
100
100, 160
100, 160, 208
160, 208
VQFP
80
80
TQFP
100
100
176
176
208, 240
176
CQFP
208, 256
PBGA
272
www.microsemi.com/products/fpga-soc/antifuse-fpgas/mx-fpga
7
FPGA Packages
Key:
f – family
bs – package body size excluding leads
p s – overall package dimensions including package leads
BG729
FG1152
fAxcelerator
p s 35x35 mm
h 2.33 mm
p 1.27 mm
fAxcelerator
ps 35x35 mm
h 2.23 mm
p 1.00 mm
h – package thickness
p – pin pitch / ball pitch
FG324
fAxcelerator
p s 19x19 mm
h 1.63 mm
p 1.00 mm
FG256
BG329
fSX-A
SX
p s 31x31 mm
h 2.33 mm
p 1.27 mm
FG896
fAxcelerator
p s 17x17 mm
h 1.60 mm
p 1.00 mm
fAxcelerator
p s 31x31 mm
h 2.23 mm
p 1.00 mm
FG256
fSX-A
p s 17x17 mm
h 1.76 mm
p 1.00 mm
BG313
FPGA Pa c k a ge s
fSX
p s 35x35 mm
h 2.33 mm
p 1.27 mm
FG676
fAxcelerator
p s 27x27 mm
h 2.23 mm
p 1.00 mm
FG484
BG272
fMX
p s 27x27 mm
h 2.33 mm
p 1.27 mm
fAxcelerator
p s 23x23 mm
h 2.23 mm
p 1.00 mm
FG484
fSX-A
p s 27x27 mm
h 2.23 mm
p 1.00 mm
8
www.microsemi.com/fpga-soc
FG144
fSX-A
SX
p s 13x13 mm
h 1.45 mm
p 1.00 mm
PQ240
fMX
bs 32x32 mm
ps 34.6x34.6 mm
h 3.40 mm
p 0.50 mm
PL84
TQ176
fSX
MX
p s1.154x1.154”
h0.150”
p0.050”
fSX-A
SX
MX
bs 24x24 mm
p s 26x26 mm
h 1.40 mm
p 0.50 mm
TQ144
PQ208
fAxcelerator
SX-A
SX
MX
bs 28x28 mm
ps 30.6x30.6 mm
h 3.40 mm
p 0.50 mm
PL68
fMX
p s0.954x0.954”
h0.150”
p0.050”
TQ100
PL44
PQ160
fMX
bs 28x28 mm
ps 31.2x31.2 mm
h 3.37 mm
p 0.65 mm
fSX-A
SX
bs 20x20 mm
p s 22x22 mm
h 1.40 mm
p 0.50 mm
fMX
p s0.654x0.654”
h0.152”
p0.050”
fSX-A
eX
bs 14x14 mm
p s 16x16 mm
h 1.40 mm
p 0.50 mm
TQ64
f eX
bs 10x10 mm
ps 12x12 mm
h 1.40 mm
p 0.50 mm
FP GA Pa c k a ge s
VQ100
PQ100
fMX
bs 14x20 mm
ps 17.2x23.2 mm
h 2.80 mm
p 0.65 mm
fSX
MX
bs 14x14 mm
ps 16x16 mm
h 1.00 mm
p 0.50 mm
VQ80
fMX
bs 14x14 mm
ps 16x16 mm
h 1.00 mm
p 0.65 mm
Refer to the Package Mechanical Drawings document located at www.microsemi.com/soc/documents/PckgMechDrwngs.pdf for more information concerning package dimensions.
www.microsemi.com/fpga-soc
9
Antifuse FPGA Selector Guide
eX
SX-A
MX
AX125
AX250
AX500
AX1000
AX2000
eX64
eX128
eX256
A54SX08A
A54SX16A
A54SX32A
A54SX72A
A40MX02
A40MX04
A42MX09
A42MX16
A42MX24
A42MX36
A nti fuse FP GA Se le c tor Guide
Axcelerator
System Gates
125 k
250 k
500 k
1M
2M
3k
6k
12 k
12 k
24 k
48 k
108 k
3k
6k
14 k
24 k
36 k
54 k
Typical Gates
82 k
154 k
286 k
612 k
1.06 M
2k
4k
8k
8k
16 k
32 k
72 k
2k
4k
9k
16 k
24 k
36 k
Logic Modules
2,016
4,224
8,064
18,144
32,256
192
384
768
768
1,452
2,880
6,036
295
547
684
1,232
1,890
2,438
Dedicated
Flip-flops
672
1,408
2,688
6,048
10,752
64
128
256
256
528
1,080
2,012
—
—
348
624
954
1,230
Maximum
Flip-flops
1,344
2,816
5,376
12,096
21,504
128
256
512
512
990
1,980
4,024
147
273
516
928
1,410
1,822
SRAM Bits
18 k
55 k
74 k
166 k
295 k
—
—
—
—
—
—
—
—
—
—
—
—
2,560
Maximum I/O
Available
168
248
336
516
684
84
100
132
130
180
249
360
57
69
104
140
176
202
Maximum I/O
Single-ended
168
248
336
516
684
84
100
132
—
—
—
—
—
—
—
—
—
—
Maximum I/O
Differential
84
124
168
258
342
—
—
—
—
—
—
—
—
—
—
—
—
—
1.5 V CMOS
Drive
Yes
Yes
Yes
Yes
Yes
—
—
—
—
—
—
—
—
—
—
—
—
—
1.8 V CMOS
Drive
Yes
Yes
Yes
Yes
Yes
—
—
—
—
—
—
—
—
—
—
—
—
—
2.5 V CMOS
Drive
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
—
—
—
—
—
—
3.3 V LVTTL
Drive
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
5.0 V CMOS
Drive
—
—
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
5 V Tolerant
Inputs
—
—
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
3.3 V PCI I/O
Yes
Yes
Yes
Yes
Yes
—
—
—
Yes
Yes
Yes
Yes
—
—
—
—
Yes
Yes
5.0 V PCI I/O
Yes 1
Yes1
Yes1
Yes1
Yes1
—
—
—
Yes
Yes
Yes
Yes
—
—
—
—
Yes
Yes
Slew Rate
Control
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
—
—
—
—
—
—
Routed
Clocks 2
4
4
4
4
4
2
2
2
3
3
3
3
1
1
2
2
2
6
Hard-wired
Clocks 2
4
4
4
4
4
1
1
1
0
0
0
4
—
—
—
—
—
—
PLL
8
8
8
8
8
—
—
—
—
—
—
—
—
—
—
—
—
—
JTAG
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
—
—
—
—
Yes
Yes
33 MHz PCI
Yes
Yes
Yes
Yes
Yes
—
­—
—
Yes
Yes
Yes
Yes
—
—
—
—
Yes
Yes
66 MHz PCI
Yes
Yes
Yes
Yes
Yes
—
—
—
Yes
Yes
Yes
Yes
—
—
—
—
—
—
Temp. Range
C, I
C, I, M
C, I, M
C, I, M
C, I, M
C, I, A
C, I, A
C, I, A
C, I, A,
M
C, I, A,
M
C, I, A,
M, B
C, I, A,
M, B
C, I, A,
M
C, I, A,
M
C, I, A,
M
C, I, A,
M
C, I, A,
M
C, I, A,
M, B
Std, -1, Std, -1, Std, -1, Std, -1, Std, -1,
-2
-2
-2
-2
-2
-F, Std,
-P
-F, Std,
-P
-F, Std,
-P
-F, Std,
-1, -2
-F, Std,
-1, -2
-F, Std,
-1, -2
-F, Std,
-1, -2
-F, Std,
-1, -2,
-3
-F, Std,
-1, -2,
-3
-F, Std,
-1, -2,
-3
-F, Std,
-1, -2,
-3
-F, Std,
-1, -2,
-3
-F, Std,
-1, -2,
-3
Speed Grades
C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B
Notes:
1. With the use of an external resistor.
2. For SX-A routed clocks are called global clocks. Hard-wired clocks are called quadrant clocks.
3. Not all speed grades are available for all temperature ranges. Please refer to the Microsemi website and appropriate product datasheets for the latest device information and valid ordering codes.
10 www.microsemi.com/fpga-soc
Antifuse I/Os by Package
Axcelerator
SX-A
202
44
34
34
68
57
57
84
100
PQFP
57
69
72
72
69
83
83
101
125
125
140
176
160
208
115
115
130
175
174
171
72
240
VQFP
202
80
57
100
64
41
46
100
56
70
144
81
81
81
81
113
113
113
176
147
272
PBGA
329
111
138
324
168
896
1152
83
104
140
150
516
256
676
83
249
144
484
69
202
729
FBGA
176
138
248
317
317
336
418
516
111
111
180
203
203
249
360
586
684
www.microsemi.com/fpga-soc 11
Antifuse I/ Os by Pa c k a ge
TQFP
A42MX36
418
213
A42MX24
418
228
A42MX16
198
176
A42MX09
624
198
171
A40MX04
198
174
A40MX02
198
A54SX72A
136
MX
A54SX32A
A54SX16A
A54SX08A
eX256
eX128
eX64
AX2000
115
AX1000
PLCC
115
256
352
CCGA
AX500
CQFP
AX250
AX125
208
eX
Learn more about Microsemi’s FPGAs and SoC FPGAs at www.microsemi.com/fpga-soc
Microsemi SoC Products Group 3870 North First Street, San Jose, CA 95134 Phone: (408) 643-6000
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4996
email: [email protected]
www.microsemi.com
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and
system solutions for communications, defense & security, aerospace and industrial markets.
Products include high-performance, radiation-hardened and highly reliable analog mixed-signal
integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice
processing devices; RF solutions; discrete components; security technologies and scalable antitamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities
and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000
employees globally. Learn more at www.microsemi.com.
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and service marks are the property of their respective owners.
MS2-013-13/8.13
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