Power Matters.™ Antifuse Product Information Brochure Providing industry-leading FPGAs and SoCs for applications where security is vital, reliability is non-negotiable and power matters. 2 www.microsemi.com/fpga-soc Antifuse Product Information Brochure Table of Contents Axcelerator • Nonvolatile, high-speed antifuse FPGAs • Utilizes FuseLock™ design security • Based upon 0.15 µm, seven-layers-of-metal CMOS antifuse process technology 4 eX • Third-generation, low-power, low-density antifuse devices • Based on the SX-A architecture with greater than 350 MHz performance • Manufactured on 0.22 µm CMOS antifuse process technology 5 SX-A • Antifuse devices with 270 MHz system performance and sea-of-modules architecture • Enabled by Microsemi’s patented metal-to-metal antifuse interconnect elements • 66 MHz PCI compliant 6 MX • Antifuse devices with 250 MHz system performance and MultiPlex I/O • Supports mixed-voltage and 5 V-only operation • Contains embedded Dual-port SRAM modules 7 FPGA Packages • Package dimensions 8 Antifuse FPGA Selector Guide • Compare Microsemi antifuse FPGAs features 10 Antifuse I/Os by Package • Compare packages for Microsemi’s antifuse devices 11 Please refer to www.microsemi.com/fpga-soc and appropriate product datasheets for the latest device information, valid ordering codes and more information. www.microsemi.com/fpga-soc 3 Axcelerator The Axcelerator FPGA family is a single-chip, nonvolatile solution offering high performance and unprecedented design security at densities of up to 2 million equivalent system gates. Utilizing the AX architecture, Axcelerator devices have several system-level features, such as embedded SRAM (with embedded FIFO control logic), PLLs, segmentable clocks, chip-wide highway routing and carry logic. The solution is based upon 0.15 µm, seven-layers-of-metal CMOS antifuse process technology and 350 MHz system performance. • 500+ MHz internal performance • 500+ MHz embedded FIFOs • PLL output up to 1 GHz and 8 PLLs per device • Bank-selectable I/Os—8 banks per chip • 4.5 kbits variable-aspect RAM blocks with built-in FIFO control • 1.5 V, 1.8 V, 2.5 V, and 3.3 V mixed-voltage operation Axcelerator Devices Axcelerator Devices AX125 AX250 AX500 AX1000 AX2000 Capacity (in equivalent system gates) 125,000 250,000 500,000 1,000,000 2,000,000 Typical Gates 82,000 154,000 286,000 612,000 1,060,000 672 1,408 2,688 6,048 10,752 Combinatorial (C-cells) 1,344 2,816 5,376 12,096 21,504 Maximum Flip-flops 1,344 2,816 5,376 12,096 21,504 Register (R-cells) Number of Core RAM Blocks Total Bits of Core RAM 12 16 36 64 55,296 73,728 165,888 294,912 Clocks (hardwired) 4 4 4 4 4 Clocks (routed) 4 4 4 4 4 PLLs 8 8 8 8 8 8 8 8 8 8 168 248 336 516 684 Maximum LVDS Channels 84 124 168 258 342 Total I/O Registers 504 744 1,008 1,548 2,052 Std., –1, –2 Std., –1, –2 Std., –1, –2 Std., –1, –2 Std., –1, –2 C, I C, I, M C, I, M C, I, M C, I, M AX250 AX500 AX1000 AX2000 208 208 I/O Banks Maximum User I/Os Speed Grades Axc e le ra tor 4 18,432 Temperature Grades C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B I/Os Per Package Axcelerator Devices AX125 PQFP 729 PBGA FBGA 256, 324 CQFP CCGA /CLGA 4 www.microsemi.com/products/fpga-soc/antifuse-fpgas/axcelerator 256, 484 484, 676 484, 676, 896 896, 1152 208, 352 208, 352 352 256, 352 624 624 eX The eX family of FPGAs, with its focused combination of features, can meet all of your power, speed, package and price requirements. eX devices are optimized for wired and mobile e-appliances, and enable designers to use a flexible single-chip FPGA for their traditional low-density ASIC requirements without the long lead times and costly NRE charges. • Low power consumption • Live at power-up • 2.5 V, 3.3 V, and 5.0 V mixedvoltage operation with 5.0 V input tolerance and 5.0 V drive strength • Up to 100% resource utilization with 100% pin locking • Available in automotive temperature grades • Fuselock secure programming technology prevents reverse engineering and design theft eX Devices eX Devices eX64 eX128 eX256 System Gates 3,000 6,000 12,000 Typical Gates 2,000 4,000 8,000 Dedicated Flip-flops 64 128 256 Maximum Flip-flops 128 256 512 Combinatorial Cells 128 256 512 Maximum User I/Os 84 100 132 1 Capacity Register Cells Global Clocks Hardwired 1 1 Routed 2 2 2 –F, Std, –P –F, Std, –P –F, Std, –P C, I, A C, I, A C, I, A 64, 100 64, 100 100 Speed Grades Temperature Grades Package (by pin count) TQFP C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B eX www.microsemi.com/products/fpga-soc/antifuse-fpgas/ex-fpga 5 SX-A The SX-A family of FPGAs offers a cost-effective, single-chip solution for low-power, high-performance designs. SX-A devices can be used to generate system-wide savings by integrating multiple functions into a single-chip solution. Providing a combination of performance, security and low power, SX-A FPGAs decrease the premium for performance while providing a solution that is highly resistant to reverse engineering. • 250 MHz system performance • 350 MHz internal performance • Power-up and power-down friendly (no sequencing required for supply voltages) • 66 MHz, 64-bit 3.3 V / 5.0 V PCI performance (supporting target, master and master/target) • 2.5 V, 3.3 V, and 5.0 V mixed-voltage support • 100% resource utilization with 100% pin locking SX-A Devices SX-A Device A54SX08A A54SX16A A54SX32A Typical Gates 8,000 16,000 32,000 72,000 System Gates 12,000 24,000 48,000 108,000 Logic Modules 768 1,452 2,880 6,036 Combinatorial Cells 512 924 1,800 4,024 Dedicated Flip-flops 256 528 1,080 2,012 Maximum Flip-flops 512 * 990 1,980 4,024 Maximum User I/Os 130 180 249 360 3 3 3 3 Global Clocks Quadrant Clocks Boundary Scan Testing A54SX72A 0 0 0 4 Yes Yes Yes Yes 3.3 V / 5 V PCI Yes Yes Yes Yes Input Set-up (external) 0 ns 0 ns 0 ns 0 ns –F, Std., –1, –2 –F, Std., –1, –2 –F, Std., –1, –2 –F, Std., –1, –2 C, I, A, M C, I, A, M C, I, A, M, B C, I, A, M, B A54SX08A A54SX16A A54SX32A A54SX72A 208 208 208 208 100, 144 100, 144 100, 144, 176 Speed Grades Temperature Grades C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B SX-A I/Os Per Package SX-A Devices PQFP VQFP TQFP 329 PBGA FBGA CQFP 6 www.microsemi.com/products/fpga-soc/antifuse-fpgas/sx-a 144 144, 256 144, 256, 484 256, 484 84, 208, 256 208, 256 MX Featuring very low power consumption and the industry’s highest design security, MX FPGAs offer designers a reliable, single-chip ASIC alternative. MX devices provide high performance while shortening the system design and development cycle. Offering an efficient, flexible 5.0 V architecture, MX is an ideal high-volume platform for integrating your legacy PLDs into a single device. Example applications include high-speed controllers and address decoding, peripheral bus interfaces, DSP and coprocessor functions. • Single-chip ASIC alternative • Fast wide-decode circuitry • High performance mixed-voltage solution • Contains embedded dual-port SRAM modules • Ceramic devices available to DSCC SM • QML certification MX Devices MX Devices A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 A42MX36 3,000 6,000 14,000 24,000 36,000 54,000 SRAM Bits — — — — — 2,560 Sequential — — 348 624 954 1,230 295 547 336 608 912 1,184 — — — — 24 24 9.5 ns 9.5 ns 5.6 ns 6.1 ns 6.1 ns 6.3 ns SRAM Modules (64x4 or 32x8) — — — — — 10 Dedicated Flip-flops — — 348 624 954 1,230 System Gates Combinatorial Decode Clock-to-out 1 1 2 2 2 6 Maximum Flip-flops 147 273 516 928 1,410 1,822 User I/Os (maximum) 57 69 104 140 176 202 PCI — — — — Yes Yes Boundary Scan Test (BST) — — — — Yes Yes –F, Std., –1, –2, –3 –F, Std., –1, –2, –3 –F, Std., –1, –2, –3 –F, Std., –1, –2, –3 –F, Std., –1, –2, –3 –F, Std., –1, –2, –3 C, I, M, A C, I, M, A C, I, M, A C, I, M, A C, I, M, A C, I, M, A, B A42MX36 Clocks Speed Grades Temperature Grades C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B MX I/Os Per Package A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 PLCC MX Devices 44, 68 44, 68, 84 84 84 84 PQFP 100 100 100, 160 100, 160, 208 160, 208 VQFP 80 80 TQFP 100 100 176 176 208, 240 176 CQFP 208, 256 PBGA 272 www.microsemi.com/products/fpga-soc/antifuse-fpgas/mx-fpga 7 FPGA Packages Key: f – family bs – package body size excluding leads p s – overall package dimensions including package leads BG729 FG1152 fAxcelerator p s 35x35 mm h 2.33 mm p 1.27 mm fAxcelerator ps 35x35 mm h 2.23 mm p 1.00 mm h – package thickness p – pin pitch / ball pitch FG324 fAxcelerator p s 19x19 mm h 1.63 mm p 1.00 mm FG256 BG329 fSX-A SX p s 31x31 mm h 2.33 mm p 1.27 mm FG896 fAxcelerator p s 17x17 mm h 1.60 mm p 1.00 mm fAxcelerator p s 31x31 mm h 2.23 mm p 1.00 mm FG256 fSX-A p s 17x17 mm h 1.76 mm p 1.00 mm BG313 FPGA Pa c k a ge s fSX p s 35x35 mm h 2.33 mm p 1.27 mm FG676 fAxcelerator p s 27x27 mm h 2.23 mm p 1.00 mm FG484 BG272 fMX p s 27x27 mm h 2.33 mm p 1.27 mm fAxcelerator p s 23x23 mm h 2.23 mm p 1.00 mm FG484 fSX-A p s 27x27 mm h 2.23 mm p 1.00 mm 8 www.microsemi.com/fpga-soc FG144 fSX-A SX p s 13x13 mm h 1.45 mm p 1.00 mm PQ240 fMX bs 32x32 mm ps 34.6x34.6 mm h 3.40 mm p 0.50 mm PL84 TQ176 fSX MX p s1.154x1.154” h0.150” p0.050” fSX-A SX MX bs 24x24 mm p s 26x26 mm h 1.40 mm p 0.50 mm TQ144 PQ208 fAxcelerator SX-A SX MX bs 28x28 mm ps 30.6x30.6 mm h 3.40 mm p 0.50 mm PL68 fMX p s0.954x0.954” h0.150” p0.050” TQ100 PL44 PQ160 fMX bs 28x28 mm ps 31.2x31.2 mm h 3.37 mm p 0.65 mm fSX-A SX bs 20x20 mm p s 22x22 mm h 1.40 mm p 0.50 mm fMX p s0.654x0.654” h0.152” p0.050” fSX-A eX bs 14x14 mm p s 16x16 mm h 1.40 mm p 0.50 mm TQ64 f eX bs 10x10 mm ps 12x12 mm h 1.40 mm p 0.50 mm FP GA Pa c k a ge s VQ100 PQ100 fMX bs 14x20 mm ps 17.2x23.2 mm h 2.80 mm p 0.65 mm fSX MX bs 14x14 mm ps 16x16 mm h 1.00 mm p 0.50 mm VQ80 fMX bs 14x14 mm ps 16x16 mm h 1.00 mm p 0.65 mm Refer to the Package Mechanical Drawings document located at www.microsemi.com/soc/documents/PckgMechDrwngs.pdf for more information concerning package dimensions. www.microsemi.com/fpga-soc 9 Antifuse FPGA Selector Guide eX SX-A MX AX125 AX250 AX500 AX1000 AX2000 eX64 eX128 eX256 A54SX08A A54SX16A A54SX32A A54SX72A A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 A42MX36 A nti fuse FP GA Se le c tor Guide Axcelerator System Gates 125 k 250 k 500 k 1M 2M 3k 6k 12 k 12 k 24 k 48 k 108 k 3k 6k 14 k 24 k 36 k 54 k Typical Gates 82 k 154 k 286 k 612 k 1.06 M 2k 4k 8k 8k 16 k 32 k 72 k 2k 4k 9k 16 k 24 k 36 k Logic Modules 2,016 4,224 8,064 18,144 32,256 192 384 768 768 1,452 2,880 6,036 295 547 684 1,232 1,890 2,438 Dedicated Flip-flops 672 1,408 2,688 6,048 10,752 64 128 256 256 528 1,080 2,012 — — 348 624 954 1,230 Maximum Flip-flops 1,344 2,816 5,376 12,096 21,504 128 256 512 512 990 1,980 4,024 147 273 516 928 1,410 1,822 SRAM Bits 18 k 55 k 74 k 166 k 295 k — — — — — — — — — — — — 2,560 Maximum I/O Available 168 248 336 516 684 84 100 132 130 180 249 360 57 69 104 140 176 202 Maximum I/O Single-ended 168 248 336 516 684 84 100 132 — — — — — — — — — — Maximum I/O Differential 84 124 168 258 342 — — — — — — — — — — — — — 1.5 V CMOS Drive Yes Yes Yes Yes Yes — — — — — — — — — — — — — 1.8 V CMOS Drive Yes Yes Yes Yes Yes — — — — — — — — — — — — — 2.5 V CMOS Drive Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes — — — — — — 3.3 V LVTTL Drive Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 5.0 V CMOS Drive — — — — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 5 V Tolerant Inputs — — — — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 3.3 V PCI I/O Yes Yes Yes Yes Yes — — — Yes Yes Yes Yes — — — — Yes Yes 5.0 V PCI I/O Yes 1 Yes1 Yes1 Yes1 Yes1 — — — Yes Yes Yes Yes — — — — Yes Yes Slew Rate Control Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes — — — — — — Routed Clocks 2 4 4 4 4 4 2 2 2 3 3 3 3 1 1 2 2 2 6 Hard-wired Clocks 2 4 4 4 4 4 1 1 1 0 0 0 4 — — — — — — PLL 8 8 8 8 8 — — — — — — — — — — — — — JTAG Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes — — — — Yes Yes 33 MHz PCI Yes Yes Yes Yes Yes — — — Yes Yes Yes Yes — — — — Yes Yes 66 MHz PCI Yes Yes Yes Yes Yes — — — Yes Yes Yes Yes — — — — — — Temp. Range C, I C, I, M C, I, M C, I, M C, I, M C, I, A C, I, A C, I, A C, I, A, M C, I, A, M C, I, A, M, B C, I, A, M, B C, I, A, M C, I, A, M C, I, A, M C, I, A, M C, I, A, M C, I, A, M, B Std, -1, Std, -1, Std, -1, Std, -1, Std, -1, -2 -2 -2 -2 -2 -F, Std, -P -F, Std, -P -F, Std, -P -F, Std, -1, -2 -F, Std, -1, -2 -F, Std, -1, -2 -F, Std, -1, -2 -F, Std, -1, -2, -3 -F, Std, -1, -2, -3 -F, Std, -1, -2, -3 -F, Std, -1, -2, -3 -F, Std, -1, -2, -3 -F, Std, -1, -2, -3 Speed Grades C – Commercial I – Industrial A – Automotive M – Military B – MIL-STD-883 Class B Notes: 1. With the use of an external resistor. 2. For SX-A routed clocks are called global clocks. Hard-wired clocks are called quadrant clocks. 3. Not all speed grades are available for all temperature ranges. Please refer to the Microsemi website and appropriate product datasheets for the latest device information and valid ordering codes. 10 www.microsemi.com/fpga-soc Antifuse I/Os by Package Axcelerator SX-A 202 44 34 34 68 57 57 84 100 PQFP 57 69 72 72 69 83 83 101 125 125 140 176 160 208 115 115 130 175 174 171 72 240 VQFP 202 80 57 100 64 41 46 100 56 70 144 81 81 81 81 113 113 113 176 147 272 PBGA 329 111 138 324 168 896 1152 83 104 140 150 516 256 676 83 249 144 484 69 202 729 FBGA 176 138 248 317 317 336 418 516 111 111 180 203 203 249 360 586 684 www.microsemi.com/fpga-soc 11 Antifuse I/ Os by Pa c k a ge TQFP A42MX36 418 213 A42MX24 418 228 A42MX16 198 176 A42MX09 624 198 171 A40MX04 198 174 A40MX02 198 A54SX72A 136 MX A54SX32A A54SX16A A54SX08A eX256 eX128 eX64 AX2000 115 AX1000 PLCC 115 256 352 CCGA AX500 CQFP AX250 AX125 208 eX Learn more about Microsemi’s FPGAs and SoC FPGAs at www.microsemi.com/fpga-soc Microsemi SoC Products Group 3870 North First Street, San Jose, CA 95134 Phone: (408) 643-6000 Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 email: [email protected] www.microsemi.com Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable antitamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com. ©2013 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. MS2-013-13/8.13