19-1716; Rev 0; 4/00 Low-Voltage SIM/Smart Card Level Translators in µMAX Features ♦ SIM/Smart Card Level Shifting ♦ +1.4V to +5.5V Controller Voltage Range ♦ +1.7V to +5.5V Card Voltage Range ♦ ±10kV ESD Card Socket Protection ♦ Allows Level Translation with DVCC ≥ VCC or DVCC ≤ VCC ♦ Automatically Shuts Down When Either Supply Is Removed ♦ Card Contacts Actively Pulled Low During Shutdown ♦ 1µA Total Quiescent Supply Current ♦ 0.01µA Total Shutdown Supply Current ♦ Ultra-Small 10-Pin µMAX Package ♦ Compliant with GSM Test Specifications 11.11 and 11.12 Applications SIM Interface in GSM Cellular Telephones Ordering Information PART TEMP. RANGE PIN-PACKAGE Smart Card Readers MAX1840EUB -40°C to +85°C 10 µMAX Logic Level Translation MAX1841EUB -40°C to +85°C 10 µMAX SPI™/QSPI™/MICROWIRE™ Level Translation Typical Operating Circuit DVCC DVCC SYSTEM CONTROLLER Pin Configuration VCC TOP VIEW DVCC VCC VCC RIN RST RST MAX1840 MAX1841 CIN CLK CLK SIM OR SMART CARD DATA 1 DVCC 2 CIN 3 RIN 4 SHDN (DDRV) 5 DATA OPTIONAL OPTIONAL 10 IO 9 MAX1840 MAX1841 VCC 8 CLK 7 RST 6 GND µMAX SHDN* IO DDRV* GND GND * SHDN FOR MAX1840 ONLY; DDRV FOR MAX1841 ONLY. IO ( ) ARE FOR MAX1841. GND SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp. ________________________________________________________________ Maxim Integrated Products 1 For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769. MAX1840/MAX1841 General Description The MAX1840/MAX1841 subscriber identity module (SIM)/smart card level translators provide level shifting and electrostatic discharge (ESD) protection for SIM and smart card ports. These devices integrate two unidirectional level shifters for the reset and clock signals, a bidirectional level shifter for the serial data stream, and ±10kV ESD protection on all card contacts. The MAX1840 includes a SHDN control input to aid insertion and removal of SIM and smart cards, while the MAX1841 includes a system-side data driver to support system controllers without open-drain outputs. The logic supply voltage range is +1.4V to +5.5V for the “controller side” and +1.7V to +5.5V for the “card side.” Total supply current is 1.0µA. Both devices automatically shut down when either power supply is removed. For a complete SIM card interface, combine the MAX1840/ MAX1841 with the MAX1686H 0V/3V/5V regulated charge pump. The MAX1840/MAX1841 are available in ultra-small 10-pin µMAX packages that are only 1.09mm high and half the area of an 8-pin SO. The MAX1840/MAX1841 are compliant with GSM test specifications 11.11 and 11.12. MAX1840/MAX1841 Low-Voltage SIM/Smart Card Level Translators in µMAX ABSOLUTE MAXIMUM RATINGS DVCC, VCC to GND................................................-0.3V to +6.0V RIN, CIN, DATA, DDRV, SHDN to GND ......................................-0.3V to (DVCC + 0.3V) RST, CLK, IO to GND .................................-0.3V to (VCC + 0.3V) Continuous Power Dissipation (TA = +70°C) 10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Figure 1, DVCC = +1.8V; VCC = +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 5.5 V 5.5 V POWER SUPPLIES DVCC Operating Range VCC Operating Range DVCC Operating Current VCC Operating Current Total Shutdown Current 1.4 DVCC 1.7 VCC IDVCC IVCC ISHDN CIN static 0.1 CIN clocked at 1.625MHz from GND to DVCC with 50% duty cycle 2.5 CIN clocked at 3.25MHz from GND to DVCC with 50% duty cycle 5 0.5 µA CIN static 0.9 CIN clocked at 1.625MHz from GND to DVCC with 50% duty cycle 3.0 0.4 CIN clocked at 3.25MHz from GND to DVCC with 50% duty cycle 0.8 IOFF = IVCC + IDVCC, SHDN = GND (MAX1840 only), or DVCC = GND or VCC = GND 0.01 µA mA 1 µA CIN, RIN, SHDN, DDRV LOGIC INPUTS Digital Input Low Threshold VIL Digital Input High Threshold VIH 0.2 ✕ DVCC V 0.7 ✕ DVCC 0.01 Input Leakage Current V 1 µA 0.4 V CLK, RST OUTPUTS Digital Output Low Level VOL Digital Output High Level VOH ISINK = 200µA ISOURCE = 20µA 0.9 ✕ VCC ISOURCE = 200µA 0.8 ✕ VCC V DATA INPUT/OUTPUT Between DATA and DVCC 13 Input Low Threshold VIL(DATA) (Note 2) 0.3 Input High Threshold VIH(DATA) (Note 3) DATA Pullup Resistance RDATA Input Low Current IIL Input High Current IIH 2 20 28 kΩ V DVCC - 0.6 V 1 mA 2 µA VCC = 5.0V _______________________________________________________________________________________ Low-Voltage SIM/Smart Card Level Translators in µMAX (Figure 1, DVCC = +1.8V; VCC = +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC, CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note1) PARAMETER SYMBOL Output Low Level VOL(DATA) Output High Level VOH(DATA) CONDITIONS MIN TYP MAX IO = GND, ISINK = 100µA 0.4 DVCC = 3.0V, IO = GND, ISINK = 200µA 0.4 ISOURCE = 10µA 0.7 ✕ DVCC DVCC = 3.0V, ISOURCE = 20µA 0.7 ✕ DVCC UNITS V V IO (INPUT/OUTPUT) IO Pullup Resistance RIO Input Low Threshold VIL(IO) Input High Threshold VIH(IO) Between IO and VCC 6.5 IIL(MAX) = 1mA (Note 2) 0.3 10 14 kΩ V IIH(MAX) = ±20µA (Note 3) 0.7 ✕ VCC V Input Low Current IIL 1 mA Input High Current IIH 20 µA Output Low Level VOL(IO) DATA = GND or DDRV = GND, ISINK = 200µA 0.4 V Output High Level VOH(IO) ISOURCE = 20µA 0.8 ✕ VCC V SHUTDOWN OUTPUT LEVELS Shutdown Output Levels (IO, CLK, RST) ISINK = 200µA, SHDN = GND, DATA = CIN = RIN = DVCC (MAX1840 only) 0.4 V ISINK = 200µA, DVCC = GND, SHDN (MAX1840) = DDRV (MAX1841) = DATA = CIN = RIN = DVCC 0.4 V ISINK = 200µA, VCC = GND, SHDN (MAX1840) = DDRV (MAX1841) = DATA = CIN = RIN = DVCC 0.4 V TIMING Maximum CLK Frequency (Notes 4, 5) Note 1: Note 2: Note 3: Note 4: Note 5: VCC = 2.7V to 5.5V, DVCC = 1.4V to 2.7V 5 20 VCC = 1.7V to 3.6V, DVCC = 1.4V to 2.25V 5 15 fCLK MHz Specifications to -40°C are guaranteed by design, not production tested. VIL is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V. VIH is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV. Timing specifications are guaranteed by design, not production tested. The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform. _______________________________________________________________________________________ 3 MAX1840/MAX1841 ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (Circuit of Figure 1, DVCC = 3.0V, VCC = +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.) TOTAL OPERATING SUPPLY CURRENT vs. CARD-SIDE SUPPLY VOLTAGE (DATA STATIC) 2.0 VCC = 5V 1.5 VCC = 3V 1.0 VCC = 1.8V 0.5 fCIN = 5MHz 1.2 fCIN = 3.25MHz 0.8 0.4 1.6 0 2 4 6 8 VCC = 5V VCC = 3V 0.8 VCC = 1.8V 0.4 DATA OR DDRV = DVCC CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE 0 1.5 10 fCIN = 5MHz 1.2 fCIN = 1.625MHz 0 0 MAX1840/1-03 1.6 DATA OR DDRV = DVCC CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE SUPPLY CURRENT, IVCC + IDVCC (mA) 2.5 2.0 TOTAL OPERATING SUPPLY CURRENT vs. TEMPERATURE (DATA STATIC) MAX1840/1-02 DATA OR DDRV = DVCC CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE SUPPLY CURRENT, IVCC + IDVCC (mA) 2.5 3.5 4.5 5.5 -40 -15 10 35 60 85 TEMPERATURE (°C) TOTAL OPERATING SUPPLY CURRENT vs. CLOCK FREQUENCY (DATA ACTIVE) TOTAL OPERATING SUPPLY CURRENT vs. CARD-SIDE SUPPLY VOLTAGE (DATA ACTIVE) TOTAL OPERATING SUPPLY CURRENT vs. TEMPERATURE (DATA ACTIVE) 2.5 VCC = 5V 2.0 VCC = 3V 1.5 1.0 VCC = 1.8V 0.5 2.0 1.6 fDATA OR fDDRV = fCIN/372 CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE 1.2 fCIN = 3.25MHz fCIN = 5MHz 0.8 0.4 fCIN = 1.625MHz 0 0 0 2 4 6 8 fCIN = 5MHz VCC = 5V 1.6 1.2 VCC = 3V 0.8 0.4 VCC = 1.8V fDATA OR fDDRV = fCIN/372 CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE 0 1.5 10 2.0 SUPPLY CURRENT, IVCC + IDVCC (mA) fDATA OR fDDRV = fCIN/372 CIN CLOCKED WITH A 0 TO DVCC SQUARE WAVE SUPPLY CURRENT, IVCC + IDVCC (mA) 3.0 MAX1840/1-05 VCC (V) MAX1840/1-04 FREQUENCY (MHz) 2.5 3.5 4.5 5.5 -40 -15 VCC (V) FREQUENCY (MHz) CIN TO CLK OR RIN TO RST WAVEFORM (3V TO 5V) 10 35 60 85 TEMPERATURE (°C) CIN TO CLK OR RIN TO RST WAVEFORM (3V TO 1.8V) MAX1840/1-07 CIN TO CLK OR RIN TO RST WAVEFORM (1.8V TO 1.8V) MAX1840/1-08 fCIN = 5MHz MAX1840/1-06 SUPPLY CURRENT, IVCC + IDVCC (mA) 3.0 MAX1840/1-01 TOTAL OPERATING SUPPLY CURRENT vs. CLOCK FREQUENCY (DATA STATIC) SUPPLY CURRENT, IVCC + IDVCC (mA) MAX1840/MAX1841 Low-Voltage SIM/Smart Card Level Translators in µMAX MAX1840/1-09 fCIN = 5MHz fCIN = 5MHz 3V CIN OR RIN 3V 2V/div CIN OR RIN 1.8V 2V/div 0 0 0 1.8V CLK OR RST 2V/div CLK OR RST 1.8V 1V/div 0 0 CIN OR RIN 1V/div 5V 0 20ns/div 4 20ns/div _______________________________________________________________________________________ CLK OR RST 1V/div 20ns/div Low-Voltage SIM/Smart Card Level Translators in µMAX (Circuit of Figure 1, DVCC = 3.0V, VCC = +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.) UNDERVOLTAGE SHUTDOWN WAVEFORM DDRV TO IO AND DATA WAVEFORM (MAX1841 ONLY) MAX1840/1-10 MAX1840/1-11 3V DDRV 2V/div 1.5V VCC 0.5V/div 0 3V DATA 2V/div 0 5V 0 1V IO 2V/div CLK, RST, OR IO 0.5V/div 0 0 1µs/div 1ms/div Pin Description PIN NAME FUNCTION 1 DATA System Controller Data Input/Output. An open-drain IO with a 20kΩ pull-up resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output capable of sinking 1mA while pulling DATA low. If the controller is not open-drain, use DDRV to send data and DATA to receive data. 2 2 DVCC Supply Voltage for System Controller Digital Pins. Set at +1.4V to +5.5V. 3 3 CIN System Controller Clock Input 4 4 RIN System Controller Reset Input — 5 DDRV Optional System Controller Data Input. Connect to controllers without an open-drain output. When not used, connect DDRV to DVCC. 5 — SHDN Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than 1µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate between DATA and IO is disabled. When not used, connect SHDN to DVCC. 6 6 GND System Controller and Card Ground 7 7 RST Reset Output to Card. Actively pulled low during shutdown. 8 8 CLK Clock Output to Card. Actively pulled low during shutdown. 9 9 VCC Supply Voltage for Card-Side Digital Pins. Set at +1.7V to +5.5V. Proper supply bypassing is required to meet ±10kV ESD specifications. 10 10 IO Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to VCC. For bidirectional data transfer, connect to an open-drain card output capable of sinking 1mA while pulling IO low. Actively pulled low during shutdown. MAX1840 MAX1841 1 _______________________________________________________________________________________ 5 MAX1840/MAX1841 Typical Operating Characteristics (continued) MAX1840/MAX1841 Low-Voltage SIM/Smart Card Level Translators in µMAX Detailed Description The MAX1840/MAX1841 provide the necessary level translation for interfacing with SIMs and smart cards in multivoltage systems. These devices operate with logic supply voltages between +1.4V and +5.5V on the controller side (DVCC) and between +1.7V and +5.5V on the card side (VCC). The total supply current (IDVCC + IVCC) is 1µA while operating in an idle state (see Electrical Characteristics). Figure 1 shows the MAX1840/MAX1841 test circuit. The Typical Application Circuit appears at the end of this data sheet. MAX1840 MAX1841 +1.8V DVCC +1.8V, +3.0V, OR +5.0V VCC SHDN* RST RIN CIN DDRV* DATA CLK IO 30pF 30pF 30pF 30pF GND Level Translation The MAX1840/MAX1841 provide level translators for a clock input, a reset input, and a bidirectional data IO. The clock and reset inputs (CIN and RIN) are level shifted from the controller-side supply rails (DVCC to GND) to the card-side supply rails (VCC to GND). When connected to an open-drain controller output, DATA and IO provide bidirectional level translation. All level translation is valid for DV CC ≥ V CC or DV CC ≤ V CC . The MAX1840/MAX1841 contain internal pull up resistors from DATA to the controller-side supply (DVCC) and from IO to the card-side supply (VCC). For push-pull controller outputs, see the Data Driver section for bidirectional data translation. Data Driver (MAX1841 Only) When using a microcontroller (µC) without an open-drain output, use the data driver (DDRV) input to send data to the SIM/smart card, while DATA provides the controllerside output for bidirectional data transfer. When not used, connect DDRV to DVCC to reduce total supply current. Shutdown Mode For the MAX1840, drive SHDN low to activate shutdown. Connect SHDN to DVCC or drive high for normal operation. To allow for card insertion and removal, shutdown mode actively pulls CLK, RST, and IO low; it also disconnects the internal 10kΩ pull up resistor from VCC to prevent excessive current draw. Shutdown mode reduces the total supply current (I DVCC + I VCC ) to 0.01µA. SIM/Smart Card Insertion/Removal The SIM/smart card specifications require that the cardside pins (VCC, CLK, RST, IO) be at ground potential prior to inserting the SIM/smart card. For applications using the MAX1686H (Figure 3), the easiest way to achieve this is by shutting down the MAX1686H or by 6 * SHDN FOR MAX1840 ONLY; DDRV FOR MAX1841 ONLY. NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF TEST PROBES AND BOARD LAYOUT. Figure 1. MAX1840/MAX1841 Test Circuit driving SHDN (MAX1840 only) low. If specific sequencing is desired, pull IO low by driving either DATA or DDRV (MAX1841 only) low, and pull CLK and RST low by driving CIN and RIN low, respectively. ESD Protection As with all Maxim devices, ESD-protection structures on all pins protect against ESDs encountered during handling and assembly. For further protection during card insertion and removal, the pins that connect to the card socket (CLK, RST, IO, VCC, and GND) provide protection against ±10kV of ESD. The ESD structures withstand high ESD in all states: normal operation, shutdown, and power-down. After an ESD event, the MAX1840/MAX1841 continue working without latchup. A 1µF bypass capacitor from VCC to GND is required to exceed ±10kV ESD specifications. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report documenting test setup, test methodology, and test results. Applications Information SIM/Smart Card Interface To provide 5V when interfacing with a 5V SIM/smart card, +3V systems require a DC-DC converter. The MAX1686H +5V regulating charge pump for SIM cards provides _______________________________________________________________________________________ Low-Voltage SIM/Smart Card Level Translators in µMAX CXN CXP 3.0V OR 5.0V DVCC MAX1686H SHDN SYSTEM CONTROLLER OUT MAX8867 MAX8860 PGND SHDN SIM OR SMART CARD SYSTEM CONTROLLER SET PGND SPI/QSPI/ MICROWIRE SYSTEM MAX1840 MAX1841 DVCC VCC VCC DVCC VCC VCC RIN RST RST RIN RST CS CIN CLK CLK CIN CLK SCLK IO DOUT DATA OPTIONAL IN GND MAX1840 MAX1841 OPTIONAL +3.3V DVCC IN MAX1686 OUT 3/5 GND MAX1840/MAX1841 +5.0V +3.0V IO DATA IO OPTIONAL SHDN* DDRV* GND GND * SHDN FOR MAX1840 ONLY; DDRV FOR MAX1841 ONLY. OPTIONAL GND SHDN* DDRV* DIN GND GND * SHDN FOR MAX1840 ONLY; DDRV FOR MAX1841 ONLY. Figure 2. Using MAX1840/MAX1841 and MAX1686/MAX1686H Charge Pump for SIM Card Applications Figure 3. MAX1840/MAX1841 with SPI/QSPI/MICROWIRE Interfaces 0V/3V/5V for full compatibility with SIM/smart-card specifications. Figure 2 shows the charge pump for SIM card applications. Alternatively, the MAX619 generates a regulated 5V from input voltages as low as 2V. level shifters transfer chip select and clock signals to the slave device(s), while the bidirectional level shifter transfers data. SPI/QSPI/MICROWIRE Interface ___________________Chip Information The MAX1840/MAX1841 are also useful as 3V/5V level shifters in SPI, QSPI, and MICROWIRE applications (Figure 3). On the slave side, connect CLK to SCLK, RST to CS, and IO to DOUT and DIN. The unidirectional TRANSISTOR COUNT: 211 _______________________________________________________________________________________ 7 Typical Application Circuit VCC DVCC DVCC DVCC VCC RIN RST 1µF VCC RST 1µF CLK CIN SYSTEM CONTROLLER 20k OPTIONAL SHDN* OPTIONAL DDRV* SIM OR SMART CARD 10k IO DATA IO SHUTDOWN CONTROL GND MAX1840 MAX1841 GND CLK GND * SHDN FOR MAX1840 ONLY; DDRV FOR MAX1841 ONLY. Packaging Information 10LUMAX.EPS MAX1840/MAX1841 Low-Voltage SIM/Smart Card Level Translators in µMAX Note: The MAX1840/MAX1841 do not have an exposed pad. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.