Powermite Surface Mount Power Packages ( 2.84 MB )

The Powermite
Family
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Introduction
Powermite® is Microsemi’s patented low-profile architecture
for packaging surface mount devices with the industry's
highest power density in the smallest possible footprint.
The current portfolio includes:
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1A through 10A Schottky Rectifiers to 200V
1A through 8A Ultrafast Rectifiers to 800V
150W (10x1000) and 1500 W (10x1000) TVS diodes
2.5W PIN diodes to 400V
Low Noise Zener Diodes 1.8V to 200V
3W Zener Diodes 3.3V to 200V
High Speed Silicon Controlled Rectifiers
N Channel MOSFET’s 500V and 1000V
Outperforms Conventional SMT
With no wire bonds and non-magnetic materials,
Powermite reduces high frequency losses and provides dramatically higher surge ratings compared to conventional
wire bonded SMT packages. With a large, full-metal bottom, all Powermite ® devices deliver superior heat dissipation and thermal capabilities. Mechanical strength is excellent due to a metal lock design that permanently bonds
metal electrodes to the plastic housing.
• Reduced High Frequency Losses
• Built-in heatsink, superior heat dissipation
• High Mechanical Strength
• 1/3 the size of comparably rated products
Contents
Overview
Powermite 1
Transient Voltage Suppressors
1W Zener Diodes
3W Zener Diodes
UltraFast Rectifiers
PIN Diodes
Schottkys
Powermite 3
Mosfet (N-channel)
Schottkys
Quality/Reliability Data
Cross Reference
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Powermite 1
The original 2-lead Powermite package provides a
breakthrough high density design for handheld and
thermally sensitive power supply and battery charging
applications. In addition to its unique full-metal bottom
that provides an optimal path for dissipating junction
heat, the Powermite package’s patented wrap-around
interlocking construction allows solder fillets to form
during the surface mount reflow process for superior
heat dissipation and mechanical strength. Measuring
less than 1mm high and 2mm square, Powermite
packaging provides a dramatic one-third reduction in
size compared with two-leaded devices in conventional SMA packages. Compared with similarly-sized
SOT-23 devices, Powermite delivers superior thermal
and power handling capability.
Powermite 1
• 1mm high x 2mm square
• 1/3 smaller than SMA
• Superior performance compared to SOT-23
Transient Voltage Suppressors
Note: R equals Reverse Polarity
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Powermite 1
1W Zener Diodes, Low Noise
Note 1: Product shown has a standard tolerance of ±5% on the nominal zener voltage. Also available in 2% and 1% tolerance with suffix C and D respectively. VZ is measured at IZT with TC (TAB 1) at 30ºC.
Note 2: Zener impedance is derived by superimposing on IZT a 60 Hz rms ac current equal to 10% of IZT (25µA ac).
Note 3: Based upon 1W maximum power dissipation. Allowance has been made for the higher voltage associated with operation at higher currents and temperature. For
determination of voltage change with current deviations from IZT see MicroNote 202.
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Powermite 1
3W Zener Diodes
Note 1: Product shown has a standard tolerance of ±5% on the nominal zener voltage. Also available in 2% and 1% tolerance with suffix C and D respectively. VZ is measured at IZT
with TC (TAB 1) at 30ºC. Voltage measurement to be performed 20 seconds after application.
Note 2: Zener impedance is derived by superimposing on IZT a 60 Hz rms ac current equal to 10% of IZT.
Note 3: Based upon 1W maximum power dissipation. Allowance has been made for the higher voltage associated with operation at higher currents and temperature. For determination
of voltage change with current deviations from IZT see MicroNote 202.
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Powermite 1
Ultra Fast Rectifiiers
Powermite 1
PIN Diodes, 2.5W
Powermite 1
Schottkys
UPS120-140
UPS120E-140E
Low VF 1A, 20-40V Schottky
Low IR 1A, 20-40V Schottky
Both Series Feature:
• Ultra Low profile (<1.1mm high)
• Low thermal resistance
• 1/3 the size of competing products
UPS120-140 Series Feature:
• Ultra Low VF of 0.45V at 1A
• Ideal for efficient power supplies
UPS 120E and 140E Series Feature:
• Ultra Low IR of 400µA at 20 Volts
• Ideal for portable battery chargers
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Powermite 1 Specifications
TAB 1 CATHODE
TAB 2 ANODE
C
D
ANNEALED
MATTE-TIN
B
A
ANNEALED
MATTE-TIN
J
K
F
DIM
Powermite1
mm
A
B
C
D
E
F
G
H
J
K
L
M
N
O
P
MIN
MAX
1.73
1.73
1.73
1.73
0.889 NOM
1.83 NOM
1.73
1.73
0.178 NOM
1.73
1.73
1.73
1.73
0.178 NOM
1.73
1.73
1.73
1.73
1.73
1.83
1.73
1.73
1.73
1.73
1.73
1.73
Dimensions
G
E
H
N
O
L
P
M
Pad Layout
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Powermite 3:
Small Size, Greater Power
Actual Footprint
Powermite 3
With three leads and a slightly larger footprint,
Microsemi's new Powermite 3 package provides
all of the thermal impedance and thermal resistance advantages of the original Powermite in a
1.1mm x 5.3mm x 4.8mm design having power
capabilities previously available only in much
larger D-PAK and TO-220 devices.
Powermite 3 devices include 8 Amp Power
Schottkys and UltraFast Rectifiers, 500 and 1000
Volt 1 Amp MOSFETs, High Speed Silicon
Controlled Rectifiers, and 1500W Zener Diodes.
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®
SMC
UPS1040 High Density 10 Amp Power Schottky
Features:
• 10 Amp, 40 V Schottky
barrier rectifier
• Low 1.1mm profile (max)
• 16.51 mm2 footprint
• Low VF for higher efficiency
• Low thermal resistance
• Patented heat sink design
Applications:
• DC-DC converters
• Battery charge regulation
• Low voltage/high frequency
inverters
• Free wheeling and steering diodes
Powermite 3
Mosfet (N-Channel)
Powermite 3
Schottkys
DPak
The Powermite 3 Performance Advantage
UPGA301 and UPGA350 Series
High Speed Silicon Controlled Rectifier
The UPGA301 and UPGA350 Series are
nanosecond SCR switches designed for
narrow pulse switching applications where
size and curent handling capability are
critical. They may be triggered using low
power logic drivers (+0.8 V at 200mA).
The Powermite 3 package provides high
reliability and wire bond connections able
to deliver high current surge capability.
Epoxy packaged, oxide passivated planar
SCR chips with metallurgic bonds on both
sides to achieve high reliability. Internal wire
bond connection allows high current surge
capability for narrow pulse applications.
Features:
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Small mechanical outline
High speed switching
Logic drive capability
Small 16.51 mm2 footprint
Supplied in 6K-unit 16mm surface mount
tape and reel
• Choice of 60 V or 125 V repetitive peak
off-state voltage
• Available in 16mm Tape and Reel,
6000 units/reel
Applications
• Laser Range finders
• Photo-flash circuits
• Automotive collision avoidance systems
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Powermite3
Internal Configurations
SOLDER
PIN 1
DIE
PIN 3
Bottom Side
Heat Sink
FRAME
CLIP (QTY 2)
PIN 3
Bottom Side
Heat Sink
PIN 2
LEAD (QTY 2)
Single
Single die, dual clip construction
SOLDER
APPROX
MAX DIE
DIE
FRAME
CLIP (QTY 2)
LEAD (QTY 2)
Dual die, dual clip construction
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Dual, Common Cathode
Cross Reference
Schottky
3W Zener Diodes
Powermite3
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Microsemi Powermite Products
8700 East Thomas Road
Scottsdale, AZ
Phone: (480) 947-6300
Fax: (480) 947-1503
www.microsemi.com
© 2006 Microsemi Corporation. All trademarks of Microsemi Corporation.