2014 AEC Workshop Agenda

Automotive Electronics Council
Component Technical Committee
Agenda
(subject to change)
2014 - Sixteenth Annual
Automotive Electronics
Reliability Workshop
April 22, 23, & 24
Novi, MI
Sheraton Detroit Novi Hotel
Page 1
Tuesday, April 22, 2014
7:30 am - 8:00 am
Continental Breakfast (provided)
8:00 am - 8:30 am
Workshop Introductions
1.1
8:30 am - 9:00 am
Jayson Young
KEMET
Polymer Tantalum Capacitors for Automotive Applications
1.2
9:00 am - 9:30 am
Reiner Kuehl
Vishay BC Components
Stability of Components During Biased Humidity Testing and
Application
1.3
9:30 am - 10:00 am
Peter Blais
KEMET
SMD and Leaded Ceramic Capacitors For High Temperature
Applications
1.4
10:00 am - 10:30 am
Charles Pothier
Vishay Intertechnology
New Tantalum Capacitor Technologies Ensure Reliability in the Next
Generation of Automotive Electronics
Session 1:
Passive/Discrete Component
Technology
8:30 am - 10:30 am
10:30 am - 11:00 am
Workshop Session - W.1
11:00 am - 12:00 pm
12:00 pm - 1:30 pm
Workshop Session - W.2
1:30 pm - 3:00 pm
3:00 pm - 3:30 pm
Workshop Session - W.3
3:30 pm - 5:00 pm
5:00 PM
BREAK: Coffee, drinks, snacks (provided)
LED Qualification Review & Discussion
Moderator: Ludger Kappius, Hella KGaA
LUNCH (on own)
Q200 Document Revision Status & Discussion
Moderator: AEC Q200 Technical Committee
BREAK: coffee, drinks, snacks (provided)
Q101 Document Status & Discussion
Moderator: AEC Q101 Technical Committee
SESSION CLOSE
Page 2
Wednesday, April 23, 2014
7:30 am - 8:00 am
Session 2:
Semiconductor Technology
- Part 1
8:00 am - 11:00 am
Continental Breakfast (provided)
2.1
8:00 am - 8:30 am
Wolfgang Reinprecht
AMS
Advanced Latch-up Testing of HV Automotive IC’s
2.2
8:30am - 9:00am
Warren Chen
Macronix International
NAND Flash Qualification Challenges for Automotive Applications
2.3
9:00 am - 9:30 am
Sebastiano Russo
STMicroelectronics
Reliability of New Pb-Free Die Attach Materials for Power Devices
9:30 am - 10:00 am
BREAK: Coffee, drinks, snacks (provided)
2.4
10:00 am - 10:30 am
Shin Low
Xilinx
High Performance Flip Chip Packaging for High Reliability
Semiconductor Devices
2.5
10:30 am - 11:00 am
Eric Lei
Global Foundries
Evaluation of 40LP SRAM HTOL 150degC for Automotive Grade 0
Application
11:00 am - 12:00 pm
Robustness Validation and Failure Rates - “Sample Sizes in Reliability Testing”
Moderator: Werner Kanert, Infineon Technologies
Session 2: (Continued)
Workshop Session - W.4
12:00 pm - 1:30 pm
LUNCH (on own)
Page 3
Wednesday, April 23, 2014 (continued)
3.1
1:30 pm - 2:00 pm
Ludger Kappius
Hella KGaA
ZVEI Delta Qualification Matrix
3.2
2:00 pm - 2:30 pm
Joop Verwijst
NXP Semiconductors
Parameter Shift Analysis
3.3
2:30 pm - 3:00 pm
Anil Gandhi
Qualicent Analytics
Advanced Analytics for Automotive Zero Defect
3.4
3:00 pm - 3:30 pm
Tim Haifley
Altera
A Complete Lifetime Distribution
Session 3:
Semiconductor Technology
- Part 2
1:30 pm - 5:00 pm
3:30 pm - 4:00 pm
Session 3: (Continued)
3.5
4:00 pm - 4:30 pm
Weiyen Kuo
TSMC
Cpk Challenges in Nanometer Semiconductor Technology
3.6
4:30 pm - 5:00 pm
Megan Smitter
GE Aviation
Collaborative Approach For Practical Modeling of Microcircuit Failures
in High-Reliability Applications
3.7
5:00 pm - 5:30 pm
Tim Haifley
Altera
Combining Data From Similar Tests: A Bayesian Approach
5:30 pm - 7:30 pm
Workshop Session - W.5
BREAK: Coffee, drinks, snacks (provided)
7:30 pm - 9:30 pm
DINNER (on own)
Q100 Document Review & Discussion
Moderator: AEC Q100 Technical Committee
Page 4
Thursday, April 24, 2014
7:30 am - 8:00 am
Continental Breakfast provided
Workshop Session - W.6
8:00 am - 9:00 am
Known Good Die / Multi-Chip Module
Moderator: Tom Lawler, Lattice Semiconductor
Workshop Session - W.7
9:00 am - 10:00 am
MEMS
Moderator: Earl Fischer, Autoliv
COFFEE (provided)
10:00 am - 10:30 am
BREAK: Coffee, drinks, snacks (provided)
Workshop Session - W.8
10:30 am - 11:00 am
Touch Systems
Moderator: Joe Lucia, John Deere Electonic Solutions
Workshop Session - W.9
11:00 am - 11:30 am
System-Level ESD
Moderator: TBD
Workshop Session - W.10
11:30 am - 12:00 pm
PC Board Qualification
Moderator: James McLeish, DfR Solutions
WRAP-UP
12:00 pm - 12:30 pm
AEC Technical Committee
Closing Statements & Workshop Adjourned
Page 5
Similar pages