3 LF BG A2 2 SOT1322-1 plastic low profile fine-pitch ball grid array package; 223 balls 8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code LFBGA223 Package type industry code LFBGA223 Package style descriptive code LFBGA (low profile fine-pitch ball grid array) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MO-205 Mounting method type S (surface mount) Issue date 25-1-2012 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 11.9 - 12 12.1 mm E package width 11.9 - 12 12.1 mm A seated height 1.2 - 1.3 1.45 mm A2 package height 0.95 - 1 1.1 mm e nominal pitch - - 0.65 - mm n2 actual quantity of termination - - 223 - 2. Package outline Fig. 1. Package outline LFBGA223 (SOT1322-1) SOT1322-1 NXP Semiconductors plastic low profile fine-pitch ball grid array package; 223 balls 3. Soldering Footprint information for reflow soldering of LFBGA223 package SOT1322-1 Hx P P Hy see detail X1 see detail X2 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area SL solder resist SP SP CU CU SR SR detail X1 detail X2 DIMENSIONS in mm P SL SP CU SR Hx Hy 0.65 0.125 0.30 0.35 0.45 12.25 12.25 sot1322-1_fr Fig. 2. Reflow soldering footprint for LFBGA223 (SOT1322-1) SOT1322-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/4 SOT1322-1 NXP Semiconductors plastic low profile fine-pitch ball grid array package; 223 balls 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1322-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/4 SOT1322-1 NXP Semiconductors plastic low profile fine-pitch ball grid array package; 223 balls 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 1 3. Soldering....................................................................... 2 4. Legal information......................................................... 3 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT1322-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/4