40 V Schottky Barrier Diode

NSR0240P2T5G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc−dc
converter, clamping and protection applications in portable devices.
NSR0240P2 in a SOD−923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
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Features
•
Very Low Forward Voltage Drop − 460 mV @ 100 mA
Low Reverse Current − 0.2 mA @ 25 V VR
200 mA of Continuous Forward Current
Power Dissipation of 240 mW with Minimum Trace
Very High Switching Speed
Low Capacitance − CT = 7 pF
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
This is a Pb−Free Device
1
CATHODE
2
ANODE
MARKING
DIAGRAM
2
1
Typical Applications
•
•
•
•
•
40 V SCHOTTKY
BARRIER DIODE
SOD−923
CASE 514AB
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
P
•
•
•
•
•
•
•
1
MG
G
2
P = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
Markets
•
•
•
•
•
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
VR
40
V
Forward Current (DC)
IF
200
mA
Non−Repetitive Peak Forward Surge Current
IFSM
2.0
A
ESD Rating:
ESD
Human Body Model
Machine Model
Device
Package
Shipping†
NSR0240P2T5G
SOD−923
(Pb−Free)
8000 / Tape & Reel
NSVR0240P2T5G SOD−923
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Class 1C
Class A
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 3
1
Publication Order Number:
NSR0240P2/D
NSR0240P2T5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25°C
Symbol
Junction and Storage Temperature Range
Min
Typ
Max
Unit
RqJA
PD
520
240
°C/W
mW
RqJA
PD
175
710
°C/W
mW
TJ, Tstg
−55 to +150
°C
Typ
Max
Unit
0.2
0.8
0.55
5.0
0.365
0.50
0.60
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
mA
Reverse Leakage
(VR = 25 V)
(VR = 40 V)
IR
Forward Voltage (IF = 10 mA)
(IF = 100 mA)
(IF = 200 mA)
VF
0.34
0.46
0.54
Total Capacitance
(VR = 1.0 V, f = 1 MHz)
CT
7.0
pF
1.0E−02
1000
Ir, REVERSE CURRENT (A)
100
125°C
10
150°C
1
0.1
0.01
150°C
1.0E−03
1.0E−04
85°C
125°C
1.0E−05
75°C
1.0E−06
25°C
1.0E−07
1.0E−08
−40°C
1.0E−09
85°C
0.001
0
25°C
0.1
−40°C
0.2
1.0E−10
0.3
0.4
0.5
0
0.6
5
10
15
20
25
30
35
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
Figure 2. Leakage Current
14
CT, TOTAL CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
V
12
TA = 25°C
10
8
6
4
2
0
0
5
10
15
20
25
30
35
VR, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance
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2
40
45
40
45
NSR0240P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08 X Y
2
TOP VIEW
DIM
A
b
c
D
E
HE
L
L2
A
c
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
SIDE VIEW
SOLDERING FOOTPRINT*
2X
L
2X
0.36
2X
1.20
2X
0.25
L2
PACKAGE
OUTLINE
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NSR0240P2/D
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