2.5V 7GHz / 10Gbps Differential Input to 1.8V / 2.5V 1:4 CML Clock / Data Fanout Buffer w/ Selectable Input Equalizer

NB7HQ14M
2.5V 7GHz / 10Gbps
Differential Input to 1.8V /
2.5V 1:4 CML Clock / Data
Fanout Buffer w/ Selectable
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Input Equalizer
MARKING
DIAGRAM*
Multi−Level Inputs w/ Internal Termination
16
Description
The NB7HQ14M is a high performance differential 1:4 CML fanout
buffer with a selectable Equalizer receiver. When placed in series with
a Clock /Data path operating up to 7 GHz or 10 Gb/s, respectively, the
NB7HQ14M inputs will compensate the degraded signal transmitted
across a FR4 PCB backplane or cable interconnect and output four
identical CML copies of the input signal. Therefore, the serial data rate
is increased by reducing Inter−Symbol Interference (ISI) caused by
losses in copper interconnect or long cables. The EQualizer ENable
pin (EQEN) allows the IN/IN inputs to either flow through or bypass
the Equalizer section. Control of the Equalizer function is realized by
setting EQEN; When EQEN is set Low, the IN/IN inputs bypass the
Equalizer. When EQEN is set High, the IN/IN inputs flow through the
Equalizer. The default state at start−up is LOW. As such, NB7HQ14M
is ideal for SONET, GigE, Fiber Channel, Backplane and other
Clock/Data distribution applications.
The differential inputs incorporate internal 50 W termination
resistors that are accessed through the VT pin. This feature allows the
NB7HQ14M to accept various logic level standards, such as LVPECL,
CML or LVDS. The outputs have the flexibility of being powered by
either a 2.5 V or 1.8 V supply. The 1:4 fanout design was optimized
for low output skew applications.
The NB7HQ14M is a member of the GigaComm™ family of high
performance clock products.
1
1
QFN−16
MN SUFFIX
CASE 485G
A
L
Y
W
G
NB7H
Q14M
ALYWG
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
SIMPLIFIED BLOCK DIAGRAM
EQ
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Input Data Rate > 10 Gb/s
Input Clock Frequency > 7 GHz
150 ps Typical Propagation Delay
35 ps Typical Rise and Fall Times
< 15 ps Maximum Output Skew
< 0.8 ps Maximum RMS Clock Jitter
< 10 ps pp of Data Dependent Jitter
Differential CML Outputs, 400 mV Peak−to−Peak, Typical
Selectable Input Equalization
Operating Range: VCC = 2.375 V to 2.625 V, VCCO = 1.71 V to
2.625 V
Internal Input Termination Resistors, 50 W
−40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices
© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 0
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Publication Order Number:
NB7HQ14M/D
NB7HQ14M
CML Outputs
Multi−Level Inputs
LVPECL, LVDS, CML
IN
VCC0
Q0
Q0
50 W
VT
IN
0
50 W
2:1
MUX
VREFAC
VCC
EQ
1
GND
EQEN
(Equalizer Enable)
Q1
Q1
Q2
Q2
Q3
Q3
75 kW
Figure 1. Detailed Block Diagram of NB7HQ14M
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2
NB7HQ14M
GND Q0
16
IN
1
VT
2
Q0
VCC Exposed Pad (EP)
14
13
15
EQEN
12 Q1
Function
0
IN / IN Inputs By−pass the Equalizer section
1
Inputs flow through the Equalizer
11 Q1
NB7HQ14M
VREFAC 3
IN
Table 1. EQUALIZER ENABLE FUNCTION
10 Q2
4
9
5
6
7
EQEN Q3
Q2
8
Q3 VCCO
Figure 2. QFN−16 Pinout (Top View)
Table 2. PIN DESCRIPTION
Pin
Name
I/O
Description
1
IN
LVPECL, CML,
LVDS Input
2
VT
3
VREFAC
4
IN
LVPECL, CML,
LVDS Input
Inverted Differential Input. Note 1.
5
EQEN
LVCMOS Input
Equalizer Enable Input; pin will default LOW when left open (has internal pull−down resistor)
6
Q3
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
7
Q3
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
8
VCCO
−
Non−inverted Differential Input. Note 1.
Internal 100 W Center−tapped Termination Pin for IN / IN
Output Voltage Reference for Capacitor−Coupled Inputs, only
1.8 V or 2.5 V Positive Supply Voltage for the Qn / Qn CML Outputs
9
Q2
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
10
Q2
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
11
Q1
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
12
Q1
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
13
VCC
−
14
Q0
CML Output
Inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
15
Q0
CML Output
Non−inverted Differential Output. Typically Terminated with 50 W Resistor to VCC.
16
GND
−
Negative Supply Voltage
−
EP
−
The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat−sinking
conduit. The pad is electrically connected to the die, and must be electrically and thermally connected to GND on the PC board.
2.5 V Positive Supply Voltage for the core
1. In the differential configuration when the input termination pin (VT) is connected to a common termination voltage or left open, and if no signal
is applied on IN / IN input, then, the device will be susceptible to self−oscillation.
2. All VCC, VCCO and GND pins must be externally connected to a power supply for proper operation.
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NB7HQ14M
Table 3. ATTRIBUTES
Characteristics
Value
ESD Protection
Human Body Model
Machine Model
RPD − EQEN Input Pulldown Resistor
> 2 kV
> 200V
75 kW
Moisture Sensitivity (Note 3)
16−QFN
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Level 1
UL 94 V−0 @ 0.125 in
290
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply − Core
GND = 0 V
3.0
V
VCCO
Positive Power Supply − Outputs
GND = 0 V
3.0
V
VIO
Positive Input/Output Voltage
GND = 0 V
−0.5 to VCC +
0.5
V
VINPP
Differential Input Voltage |IN − IN|
1.89
V
IIN
Input Current Through RT (50 W Resistor)
$40
mA
IOUT
Output Current Through RT (50 W Resistor)
$40
mA
IVFREFAC
VREFAC Sink/Source Current
$1.5
mA
TA
Operating Temperature Range
Tstg
Storage Temperature Range
θJA
Thermal Resistance (Junction−to−Ambient) (Note 4)
θJC
Thermal Resistance (Junction−to−Case) (Note 4)
Tsol
Wave Solder
16 QFN
0 lfpm
500 lfpm
Pb−Free
−40 to +85
°C
−65 to +150
°C
16 QFN
16 QFN
42
35
°C/W
°C/W
16 QFN
4
°C/W
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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4
NB7HQ14M
Table 5. DC CHARACTERISTICS, MULTI−LEVEL INPUTS VCC = 2.375 V to 2.625 V; VCCO = 1.71 V to 2.625 V; GND = 0 V;
TA = −40°C to 85°C (Note 5)
Characteristic
Symbol
Min
Typ
Max
Unit
2.375
2.375
1.71
2.5
2.5
1.8
2.625
2.625
1.89
V
95
65
135
85
mA
POWER SUPPLY / CURRENT
VCC
VCCO
Power Supply Voltage
VCC = 2.5 V
VCCO = 2.5 V
VCCO = 1.8 V
ICC
ICCO
Power Supply Current for VCC (Inputs and Outputs Open)
Power Supply Current for VCCO (Inputs and Outputs Open)
CML OUTPUTS (Note 6)
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VCCO = 2.5 V
VCCO = 1.8 V
VCCO – 30
2470
1770
VCCO – 10
2490
1790
VCCO
2500
1800
mV
VCCO = 2.5 V
VCCO = 1.8 V
VCCO – 550
1950
1250
VCCO – 400
2100
1400
VCCO – 300
2200
1500
mV
DIFFERENTIAL INPUT DRIVEN SINGLE−ENDED (see Figure 5 & 7) (Note 7)
VIH
Single−ended Input HIGH Voltage
Vth + 100
VCC
mV
VIL
Single−ended Input LOW Voltage
GND
Vth −100
mV
Vth
Input Threshold Reference Voltage Range (Note 8)
1100
VCC − 100
mV
VISE
Single−ended Input Voltage Amplitude (VIH − VIL)
200
2800
mV
VCC – 925
mV
VREFAC
VREFAC
Output Reference Voltage @100 mA for capacitor− coupled inputs, only
VCC – 1325
VCC – 1125
DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (see Figure 6 & 8) (Note 9)
VIHD
Differential Input HIGH Voltage
1200
VCC
mV
VILD
Differential Input LOW Voltage
0
VIHD − 100
mV
VID
Differential Input Voltage (VIHD − VILD)
100
1200
mV
VCMR
Input Common Mode Range (Differential Configuration) (Note 10)
(Figure 9)
1050
VCC − 50
mV
IIH
Input HIGH Current IN / IN, (VT Open)
−150
150
uA
IIL
Input LOW Current IN / IN, (VT Open)
−150
150
uA
CONTROL INPUTS (EQEN)
VIH
Input HIGH Voltage for Control Pins
VCC x 0.65
VCC
V
VIL
Input LOW Voltage for Control Pins
GND
VCC x 0.35
V
IIH
Input HIGH Current
−150
150
mA
IIL
Input LOW Current
−150
150
mA
TERMINATION RESISTORS
RTIN
Internal Input Termination Resistor
45
50
55
W
RTOUT
Internal Output Termination Resistor
45
50
55
W
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input parameters vary 1:1 with VCC. Output parameters vary 1:1 with VCCO.
6. CML outputs loaded with 50 W to VCCO for proper operation.
7. Vth, VIH, VIL,, and VISE parameters must be complied with simultaneously.
8. Vth is applied to the complementary input when operating in single−ended mode.
9. VIHD, VILD, VID and VCMR parameters must be complied with simultaneously.
10. VCMR min varies 1:1 with GND, VCMR max varies 1:1 with VCC. The VCMR range is referenced to the crosspoint side of the differential input
signal.
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5
NB7HQ14M
Table 6. AC CHARACTERISTICS VCC = 2.375 V to 2.625 V; VCCO = 1.71 V to 2.625 V; GND = 0 V; TA = −40°C to 85°C (Note 11)
Symbol
Characteristic
fMAX
Maximum Input Clock Frequency;
fDATAMAX
Maximum Operating Data Rate (PRBS23)
VOUTPP
Output Voltage Amplitude, EQEN = 0 or 1 (Note 15)
(See Figure 10)
tPLH,
tPHL
Propagation Delay
tSKEW
Duty Cycle Skew (Note 12)
Output – Output Within Device Skew
Device to Device Skew
tDC
Output Clock Duty Cycle (Reference Duty Cycle = 50%)
FN
Phase Noise, fin = 1 GHz
tŐFN
Integrated Phase Jitter fin = 1 GHz, 12 kHz − 20 MHz
Offset (RMS)
tJITTER
RMS Random Clock Jitter (Note 13)
Min
Typ
7
10
GHz
10
12
Gbps
fin ≤ 7GHz
200
400
mV
IN to Q
120
170
225
ps
3
15
15
50
ps
50
60
%
VOUT w 200 mV
fin v 7GHz
40
10 kHz
100 kHz
1 MHz
10 MHz
20 MHz
40 MHz
fin v 7 GHz
Peak−to−Peak Data Dependent Jitter (Note 14)
VINPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 15)
tr
tf
Output Rise/Fall Times @ 1.0 GHz
(20% − 80%)
dBc
50
fs
0.2
100
15
Unit
−135
−137
−149
−150
−150
−151
fin v 10 Gb/s
EQEN = 0 (v 3” FR4)
EQEN = 1 (12” FR4)
Qx, Qx
Max
30
0.8
ps rms
10
10
ps pk−pk
ps pk−pk
1200
mV
45
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Measured by forcing VINPP 400mV from a 50% duty cycle clock source. All loading with an external RL = 50 W to VCCO. Input edge rates
40 ps (20% − 80%).
12. Skew is measured between outputs under identical transitions and conditions @ 0.5 GHz. Duty cycle skew is measured between differential
outputs using the deviations of the sum of Tpw− and Tpw+ @ 0.5 GHz.
13. Additive RMS jitter with 50% duty cycle clock signal.
14. Additive peak−to−peak data dependent jitter with input NRZ data at PRBS23.
15. Input and output voltage swings are single−ended measurements operating in a differential mode.
OUTPUT VOLTAGE AMPLITUDE
(mV)
600
500
Q AMP (mV)
400
300
200
100
0
0
1
2
3
4
5
6
7
8
fin, CLOCK INPUT FREQUENCY (GHz)
9
10
Figure 3. CLOCK Output Voltage Amplitude (VOUTPP) vs. Input Frequency (fin) at Ambient Temperature (Typical)
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NB7HQ14M
VCC
IN
50 W
VT
50 W
IN
Figure 4. Input Structure
IN
VIH
IN
Vth
VIL
IN
IN
Vth
Figure 5. Differential Input Driven
Single−Ended
VCC
Vthmax
Figure 6. Differential Inputs
Driven Differentially
VIHmax
VILmax
Vth
IN
Vthmin
GND
VIH
Vth
VIL
IN
IN
VCMRmax
VILmin
VIHD(MAX)
Figure 8. Differential Inputs Driven Differentially
INx
VILD(MAX)
VINPP = VIH(IN) − VIL(IN)
INx
VCMR
VIHD
VID = VIHD − VILD
Q
VILD
VCMRmin
GND
VILD
VIHmin
Figure 7. Vth Diagram
VCC
VID = |VIHD(IN) − VILD(IN)|
VIHD
VOUTPP = VOH(Q) − VOL(Q)
Q
VIHD(MIN)
tPHL
tPLH
VILD(MIN)
Figure 9. VCMR Diagram
Figure 10. AC Reference Measurement
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7
NB7HQ14M
VCC
VCC
VCC
NB7HQ14M
ZO = 50 W
LVPECL
Driver
VCC
ZO = 50 W
IN
50 W
VT = VCC − 2 V
ZO = 50 W
LVDS
Driver
50 W
50 W
50 W
IN
GND/VEE
GND
GND
GND
Figure 11. LVPECL Interface
Figure 12. LVDS Interface
VCC
CML
Driver
IN
VT = Open
ZO = 50 W
IN
VCC
VCC
VCC
NB7HQ14M
ZO = 50 W
NB7HQ14M
ZO = 50 W
IN
50 W
VT = VCC
ZO = 50 W
Differential
Driver
50 W
IN
NB7HQ14M
IN
50 W
VT = VREFAC*
ZO = 50 W
50 W
IN
GND
GND
GND
GND
Figure 14. Capacitor−Coupled
Differential Interface
(VT Connected to VREFAC)
Figure 13. Standard 50 W Load CML Interface
*VREFAC bypassed to ground with a 0.01 mF capacitor
VCC
VCC
ZO = 50 W
Differential
Driver
NB7HQ14M
IN
50 W
VT = VREFAC*
50 W
IN
GND
Figure 15. Capacitor−Coupled
Single−Ended Interface
(VT Connected to VREFAC)
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8
GND
NB7HQ14M
NB7HQ14M
Receiver
VCCO
VCCO =
VCC (Receiver)
50 W
50 W
VCC (Receiver)
50 W
50 W
16 mA
GND
Figure 16. Typical CML Output Structure
and Termination
VCC
VT
Driver
FR4 − 12 Inch Backplane
Q
NB7HQ14M
EQualizer
EQEN = 1
IN
IN
Q
DJ1
DJ2
DJ3
Figure 17. Typical NB7HQ14M Equalizer Application and Interconnect with PRBS23 pattern at 6.5 Gbps, EQEN = 1
ORDERING INFORMATION
Package
Shipping†
NB7HQ14MMNG
QFN−16
(Pb−Free)
123 Units / Rail
NB7HQ14MMNHTBG
QFN−16
(Pb−Free)
100 / Tape & Reel
NB7HQ14MMNTXG
QFN−16
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
NB7HQ14M
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE D
D
ÇÇÇ
ÇÇÇ
L1
DETAIL A
PIN 1
LOCATION
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉ
ÉÉ
EXPOSED Cu
0.15 C
TOP VIEW
0.15 C
ÉÉ
ÉÉ
ÇÇ
A3
MOLD CMPD
A1
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
DETAIL B
(A3)
DETAIL B
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
L
L
A
B
ALTERNATE
CONSTRUCTIONS
A
16 X
SEATING
PLANE
0.08 C
SIDE VIEW
16X
L
A1
5
8
4
e
0.575
0.022
EXPOSED PAD
3.25
0.128
0.30
0.012
EXPOSED PAD
9
E2
K
12
1
16
16X
e
1.50
0.059
3.25
0.128
13
b
0.10 C A B
0.05 C
SOLDERING FOOTPRINT*
D2
DETAIL A
NOTE 5
16X
C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
0.00
0.15
BOTTOM VIEW
NOTE 3
0.50
0.02
0.30
0.012
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GigaComm is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NB7L14M/D
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