Dual 2-Bit Dual-Supply Non-Inverting

NLSV22T244
Dual 2-Bit Dual-Supply
Non-Inverting Level
Translator
The NLSV22T244 is a dual 2−bit configurable dual−supply bus
buffer level translator. The input ports A and the output ports B are
designed to track two different power supply rails VCCA and VCCB.
Both supply rails are configurable from 1.6 V to 3.6 V allowing
universal low−voltage translations from the input port A to the output
B port.
Features
•
•
•
•
•
•
•
•
1
PIN ASSIGNMENT
OE
• Mobile Phones, PDAs, Other Portable Devices
VCCB
VCCA
1
IN_A1
11
VCCB
2
10
OUT_B1
IN_A2
3
9
OUT_B2
OUT_A3
4
8
IN_B3
OUT_A4
5
7
IN_B4
OUT_B1
IN _A2
12
6
GND
(Top View)
OUT_B2
OE
VCCB
ORDERING INFORMATION
VCCA
Device
NLSV22T244MUTAG
IN _B3
OUT_A3
IN _B4
OUT_A4
OE
OE
WEMG
G
WE = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applications
IN _A1
MARKING
DIAGRAM
UQFN12
MU SUFFIX
CASE 523AE
Wide VCCA and VCCB Operating Range: 1.6 V to 3.6 V
High−Speed w/ Balanced Propagation Delay
Inputs and Outputs have OVT Protection to 5.5 V
Non−preferential VCCA and VCCB Sequencing
Outputs at 3−State until Active VCC is reached
Power−Off Protection
Ultra−Small packaging: 1.7mm x 2.0 mm UQFN−12
This is a Pb−Free Device
VCCA
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Package
Shipping†
UQFN12
3000
(Pb−Free) / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
GND
Figure 1. Logic Diagram
© Semiconductor Components Industries, LLC, 2009
June, 2009 − Rev. 3
1
Publication Order Number:
NLSV22T244/D
NLSV22T244
Module B
(2.8V)
2.8V
USB D+
USB D−
VCCB
VCCB
VCCA
VCCA
IN_B3
OUT_A3
IN_B4
OUT_A4
1.8V
USB Rx_D+
USB Rx_D−
OE
1.8V
OE
Tx/Rx
Module A
(1.8V)
NLU1G50
Tx/Rx
OE
OUT_B1
IN_A1
OUT_B2
IN_A2
VCCB
USB Tx_D+
USB Tx_D−
VCCA
OE = High, Module B Transmits, Module A Receives = B → A
OE = Low, Module A Transmits, Module B Receives = A → B
Figure 2. Typical Application Bi−Directional to Uni−Directional Logic Level Translator
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2
Uni−Directional I/O Ports
Bi−Directional I/O Port
NLSV22T244
NLSV22T244
PIN ASSIGNMENT
Pin
Function
Inputs
VCCA
A DC Power Supply
VCCB
B DC Power Supply
GND
Ground
IN_A1, IN_A2, IN_B3, IN_B4
Inputs
OUT_B1, OUT_B2, OUT_A3, OUT_A4
OE
IN_B3,
IN_B4
OUT_B1,
OUT_B2
OUT_A3
OUT_A4
H
X
L
3−State
L
L
H
H
L
X
L
3−State
L
Outputs
OE
Outputs
IN_A1
IN_A2
H
Output Enable
H
MAXIMUM RATINGS
Symbol
VCCA, VCCB
VI
VC
VO
Rating
Value
DC Supply Voltage
DC Input Voltage
IN_Xn
Control Input
OE
DC Output Voltage
Condition
Unit
−0.5 to +5.5
V
−0.5 to +5.5
V
−0.5 to +5.5
V
(Power Down) OUT_Xn
−0.5 to +5.5
(Active Mode) OUT_Xn
−0.5 to +5.5
(Tri−State Mode) OUT_Xn
−0.5 to +5.5
VCCA = VCCB = 0
V
IIK
DC Input Diode Current
−20
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Source/Sink Current
±50
mA
ICCA, ICCB
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCCA, VCCB
Parameter
Positive DC Supply Voltage
VI
Bus Input Voltage
VC
Control Input
VIO
Bus Output Voltage
TA
Dt / DV
Min
Max
Unit
1.6
3.6
V
GND
3.6
V
OE
GND
3.6
V
(Power Down Mode) OUT_Xn
GND
3.6
V
(Active Mode) OUT_Xn
GND
3.6
V
(Tri−State Mode) OUT_Xn
GND
3.6
V
−40
+85
°C
0
10
nS
Operating Temperature Range
Input Transition Rise or Rate
VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V
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3
NLSV22T244
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Symbol
VIH
Parameter
Test Conditions
Input HIGH Voltage
VCCA (V)
VCCB (V)
Min
Max
Unit
2.7 − 3.6
1.6 − 3.6
2.0
−
V
1.6
−
0.65 * VCCA
−
−
0.8
−
0.7
2.3 − 2.7
1.4 − 2.3
VIL
Input LOW Voltage
2.7 − 3.6
1.6 − 3.6
2.3 − 2.7
1.6 − 2.3
VOH
Output HIGH Voltage
IOH = −100 mA; VI = VIH
−
0.35 * VCCA
1.6 − 3.6
1.6 − 3.6
VCCB − 0.2
−
1.6
1.6
1.25
−
2.3
2.3
2.0
−
2.3
2.3
1.8
−
2.7
2.7
2.2
−
2.3
2.3
1.7
−
3.0
3.0
2.4
−
IOH = −6 mA; VI = VIH
IOH = −12 mA; VI = VIH
IOH = −18 mA; VI = VIH
VOL
Output LOW Voltage
IOH = −24 mA; VI = VIH
3.0
3.0
2.2
−
IOL = 100 mA; VI = VIL
1.6 − 3.6
1.6 − 3.6
−
0.2
IOL = 6 mA; VI = VIL
1.6
1.6
−
0.3
IOL = 12 mA; VI = VIL
2.3
2.3
−
0.4
2.7
2.7
−
0.4
2.3
2.3
−
0.6
3.0
3.0
−
0.5
IOL = 18 mA; VI = VIL
IOL = 24 mA; VI = VIL
V
V
V
3.0
3.0
−
0.6
Input Leakage Current
VI = VCCA or GND
1.6 − 3.6
1.6 − 3.6
−1.0
+1.0
mA
IOZ
I/O Tri−State Output Leakage
Current
TA = 25°C, OE = GND
1.6 − 3.6
1.6 − 3.6
−
2.0
mA
ICCA
Quiescent Supply Current
VI = VCCA or GND;
IO = 0
1.6 − 3.6
1.6 − 3.6
−
2.0
mA
ICCB
Quiescent Supply Current
VI = VCCA or GND;
IO = 0
1.6 − 3.6
1.6 − 3.6
−
2.0
mA
ICCA + ICCB Quiescent Supply Current
VI = VCCA or GND;
IO = 0
1.6 − 3.6
1.6 − 3.6
−
4.0
mA
II
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB)
−405C to +855C
VCCB (V)
3.6
NOTE:
Max
Min
1.6
Max
Unit
3.6
2
2
2
mA
2.8
<1
<1
< 0.5
mA
1.6
<1
<1
< 0.5
mA
VCCA (V)
Min
2.8
Max
Min
Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up
sequence of VCCA and VCCB will not damage the IC.
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4
NLSV22T244
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
VCCB (V)
3.6
Symbol
Parameter
tPLH,
tPHL
Propagation Delay,
An to Bn
tPZH,
tPZL
Output Enable,
OE to OUT_Xn
tPHZ,
tPLZ
Output Disable,
OE to OUT_Xn
tOSHL,
tOSLH
Output−to−Output Skew,
Data−to−Output
VCCA (V)
Min
2.8
Max
Min
1.6
Max
Min
Max
Unit
nS
3.6
3.4
3.6
3.8
2.8
3.6
3.8
4.0
1.6
3.9
4.0
4.5
3.6
5.8
6.0
6.2
2.8
6.0
6.2
6.4
1.6
8.2
8.4
8.6
3.6
5.8
6.0
6.2
2.8
6.0
6.2
6.4
1.6
8.2
8.4
8.6
3.6
0.15
0.15
0.15
2.8
0.15
0.15
0.15
1.6
0.15
0.15
0.15
nS
nS
nS
1. Propagation delays defined per Figure 3.
CAPACITANCE
Symbol
Parameter
Test Conditions
Typ (Note 2)
Unit
CIN
Control Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
3.5
pF
CI/O
I/O Pin Input Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B
5.0
pF
CPD
Power Dissipation Capacitance
VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz
10
pF
2. Typical values are at TA = +25°C.
3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching.
VCC
Pulse
Generator
RL
DUT
CL
RL
Figure 3. AC (Propagation Delay) Test Circuit
Test
Switch
tPLH, tPHL
OPEN
tPLZ, tPZL
VCCO x 2 at VCCB = 3.0 V − 3.6 mV, 2.3 V − 2.7 V, 1.6 V −
1.95 V
tPHZ, tPZH
GND
CL = 15 pF or equivalent (includes probe and jig capacitance)
RL = 2 kW or equivalent
ZOUT of pulse generator = 50 W
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5
VCCO x 2
OPEN
GND
NLSV22T244
VIH
Input (An)
Vm
Vm
tPLH
tPHL
Output (Bn)
Vm
0V
VOH
Vm
VOL
Waveform 1 − Propagation Delays
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VIH
OEn
Vm
Vm
tPZH
Output (Bn)
tPHZ
Vm
0V
VOH
VY
≈0V
tPZL
Output (Bn)
tPLZ
Vm
≈ VCC
VX
VOL
Waveform 2 − Output Enable and Disable Times
tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 4. AC (Propagation Delay) Test Circuit Waveforms
VCC
Symbol
3.0 V – 3.6 V
VmA
VCCA/2
VmB
VCCB/2
VX
VOL x 0.1
VY
VOH x 0.9
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6
NLSV22T244
0.7
In_Ax
or In_Bx
0.6
ICCA OR ICCB (mA)
0.5
0.4
0.3
0.2
0.1
0.0
−0.1
0
0.5
1
1.5
2
2.5
3
Vin, INPUT VOLTAGE (V)
Figure 5. Delta ICC
Increase in ICC per Input Voltage, Other Inputs at VCCA / VCCB or GND
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7
3.5
NLSV22T244
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
ÉÉ
ÉÉ
ÉÉ
D
PIN 1 REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
L1
DETAIL A
E
NOTE 5
TOP VIEW
DIM
A
A1
A3
b
D
E
e
K
L
L1
L2
DETAIL B
A
0.05 C
12X
0.05 C
A1
A3
8X
C
SIDE VIEW
SEATING
PLANE
K
5
7
DETAIL A
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
e
1
12X
DETAIL B
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.70 BSC
2.00 BSC
0.40 BSC
0.20
---0.45
0.55
0.00
0.03
0.15 REF
11
L
2.00
12X
L2
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
1
NOTE 3
0.32
2.30
0.40
PITCH
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NLSV22T244/D
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