NL27WZ08 Dual 2-Input AND Gate The NL27WZ08 is a high performance dual 2−input AND Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ08 Chip Complexity: FET = 124 These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable http://onsemi.com MARKING DIAGRAM 8 8 1 L2 M G G US8 US SUFFIX CASE 493 1 L2 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. A1 B1 Y2 GND 8 1 2 7 3 6 4 5 PIN ASSIGNMENT VCC Y1 B2 A2 Pin Function 1 A1 2 B1 3 Y2 4 GND 5 A2 6 B2 7 Y1 8 VCC FUNCTION TABLE Figure 1. Pinout Y = AB Output Inputs B Y L L L L H L H L L H H H A IEEE/IEC A1 B1 & A2 B2 Y1 Y2 H = HIGH Logic Level L = LOW Logic Level Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. 10 1 Publication Order Number: NL27WZ08/D NL27WZ08 MAXIMUM RATINGS Symbol Value Units DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage −0.5 to VCC + 0.5 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range VCC Parameter −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR VESD ILatch−Up Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V > 2000 > 200 N/A Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) mA ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC Supply Voltage Operating Data Retention Only 1.65 1.5 5.5 5.5 VI Input Voltage (Note 6) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 °C Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 20 10 5 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 V ns/V NL27WZ08 DC ELECTRICAL CHARACTERISTICS Condition TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC Symbol Parameter VIH High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 165 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 IIN Input Leakage Current VIN = 5.5 V or GND ICC Quiescent Supply Current IOFF Power Off Leakage Current −555C 3 TA 3 1255C Typ Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.5 2.1 2.4 2.7 2.5 4.0 Units V 0.25 0.3 VCC VCC − 0.1 1.5 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 ±0.1 ±1.0 mA VIN = 5.5 V or GND 5.5 1.0 10 mA VIN = 5.5 V or VOUT = 5.5 V 0 1.0 10 mA 0.08 0.20 0.22 0.28 0.38 0.42 2.3 2.7 3.0 3.0 4.5 AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns TA = 255C VCC Symbol tPLH tPHL Condition (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns 2.5 ± 0.2 1.0 3.5 5.8 2.0 6.2 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 ± 0.3 0.8 1.2 2.6 3.2 3.9 4.8 0.8 1.2 4.3 5.2 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 ± 0.5 0.5 0.8 1.9 2.5 3.1 3.7 0.5 0.8 3.3 4.0 Parameter Propagation Delay (Figure 3 and 4) −555C 3 TA 3 1255C CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 4 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 25 30 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ08 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC VCC 90% 50% 10% 10% tPHL GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Type Shipping† NL27WZ08USG US8 (Pb−Free) 3000 / Tape & Reel NLV27WZ08USG* US8 (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL27WZ08 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R G P S U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E SOLDERING FOOTPRINT* DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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