Dual 2-Input NAND Gate

NL27WZ00
Dual 2-Input NAND Gate
The NL27WZ00 is a high performance dual 2−input NAND Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ00
Chip Complexity: FET = 112
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAM
8
L1 M G
G
US8
US SUFFIX
CASE 493
L1
M
G
1
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
PIN ASSIGNMENT
A1
8
1
VCC
B1
2
7
Y1
Y2
3
6
B2
GND
4
5
Pin
Function
1
A1
2
B1
3
Y2
4
GND
5
A2
6
B2
7
Y1
8
VCC
A2
FUNCTION TABLE
Y = AB
Inputs
Figure 1. Pinout
IEEE/IEC
A1
B1
&
A2
B2
Y1
Y2
Output
A
B
Y
L
L
H
L
H
H
H
L
H
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 12
1
Publication Order Number:
NL27WZ00/D
NL27WZ00
MAXIMUM RATINGS
Parameter
Symbol
Value
Units
VCC
−0.5 to +7.0
V
DC Input Voltage
VI
−0.5 to +7.0
V
DC Output Voltage
VO
−0.5 to +7.0
V
VI < GND
IIK
−50
mA
VO < GND
IOK
−50
mA
DC Supply Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
IO
±50
mA
DC Supply Current per Supply Pin
ICC
±100
mA
DC Ground Current per Ground Pin
IGND
±100
mA
Storage Temperature Range
TSTG
−65 to +150
°C
Lead Temperature, 1 mm from Case for 10 Seconds
TL
260
°C
Junction Temperature under Bias
TJ
+150
°C
Thermal Resistance (Note 1)
qJA
250
°C/W
Power Dissipation in Still Air at 85°C
PD
250
mW
MSL
Level 1
FR
UL 94 V−0 @ 0.125 in
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
VESD
Latchup Performance
Above VCC and Below GND at 85°C (Note 5)
V
> 2000
> 200
N/A
ILatchup
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
1.65
1.5
5.5
5.5
Units
Supply Voltage
Operating
Data Retention Only
VCC
Input Voltage (Note 6)
VI
0
5.5
V
Output Voltage (HIGH or LOW State)
VO
0
5.5
V
Operating Free−Air Temperature
TA
−55
+125
°C
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
Dt/DV
0
0
0
20
10
5
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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2
V
ns/V
NL27WZ00
DC ELECTRICAL CHARACTERISTICS
Parameter
Condition
Symbol
TA = 255C
VCC
(V)
Min
0.75 VCC
0.7 VCC
High−Level Input
Voltage
VIH
1.65
2.3 to 5.5
Low−Level Input
Voltage
VIL
1.65
2.3 to 5.5
High−Level Output
Voltage
VIN = VIL or VIH
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
VOH
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
Low−Level Output
Voltage
VIN = VIH or VOH
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
VOL
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
Input Leakage
Current
VIN = 5.5 V or GND
IIN
Quiescent Supply
Current
VIN = 5.5 V or GND
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
Typ
−555C 3 TA 3 1255C
Max
Min
Max
0.75 VCC
0.7 VCC
V
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.5
2.1
2.4
2.7
2.5
4.0
0.0
0.08
0.20
0.22
0.28
0.38
0.42
Units
0.25
0.3 VCC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
0 to 5.5
±0.1
±1.0
mA
ICC
5.5
1.0
10
mA
IOFF
0
1.0
10
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
TA = 255C
VCC
Condition
Symbol
(V)
Min
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 15 pF
tPLH
tPHL
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
ns
2.5 ± 0.2
1.2
3.2
5.3
1.2
5.7
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 ± 0.3
0.8
1.2
2.4
3.0
3.7
4.6
0.8
1.2
4.0
4.9
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
5.0 ± 0.5
0.5
0.8
1.9
2.4
2.9
3.6
0.5
0.8
3.2
3.9
Parameter
Propagation Delay
(Figure 3 and 4)
−555C 3 TA 3 1255C
CAPACITIVE CHARACTERISTICS
Parameter
Condition
Symbol
Typical
Units
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CIN
2.5
pF
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
CPD
9
11
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ00
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
VCC
90%
50%
10%
10%
tPHL
GND
RL
CL *
tPLH
VOH
OUTPUT Y
OUTPUT
INPUT
*CL includes all probe and jig capacitances.
A 1−MHz square input wave is recommended
for propagation delay tests.
50%
50%
VOL
Figure 3. Switching Waveform
CAVITY
TAPE
TOP TAPE
Figure 4. Test Circuit
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
COMPONENTS
TAPE LEADER
NO COMPONENTS
400 mm MIN
DIRECTION OF FEED
Figure 5. Tape Ends for Finished Goods
TAPE DIMENSIONS mm
4.00
2.00
4.00
Ğ1.50 TYP
1.75
3.50 $ 0.25
0.30
8.00 +
− 0.10
1
Ğ1.00 ± 0.25 TYP
DIRECTION OF FEED
Figure 6. US8 Reel Configuration/Orientation
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4
NL27WZ00
t MAX
1.5 mm MIN
(0.06 in)
A
13.0 mm $0.2 mm
(0.512 in $0.008 in)
50 mm MIN
(1.969 in)
20.2 mm MIN
(0.795 in)
FULL RADIUS
G
Figure 7. Reel Dimensions
REEL DIMENSIONS
Tape Size
T and R Suffix
A Max
G
t Max
8 mm
US
178 mm
(7 in)
8.4 mm, + 1.5 mm, −0.0
(0.33 in + 0.059 in, −0.00)
14.4 mm
(0.56 in)
DIRECTION OF FEED
BARCODE LABEL
POCKET
HOLE
Figure 8. Reel Winding Direction
ORDERING INFORMATION
Package
Shipping†
NL27WZ00USG
US8
(Pb−Free)
3000 / Tape & Reel
NLV27WZ00USG*
US8
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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5
NL27WZ00
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
K
D
N
0.10 (0.004)
M
R 0.10 TYP
T X Y
V
M
F
DETAIL E
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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PUBLICATION ORDERING INFORMATION
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NL27WZ00/D
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