Dual 2-Input NOR Gate

NL27WZ02
Dual 2-Input NOR Gate
The NL27WZ02 is a high performance dual 2−input NOR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ02
Chip Complexity: FET = 112
These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAM
8
L3 M G
G
US8
US SUFFIX
CASE 493
L3
M
G
1
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
A1
B1
1
8
2
7
VCC
PIN ASSIGNMENT
Y1
Y2
3
6
B2
GND
4
5
A2
Pin
Function
1
A1
2
B1
3
Y2
4
GND
5
A2
6
B2
7
Y1
8
VCC
Figure 1. Pinout
FUNCTION TABLE
A1
B1
w1
A2
Output
Y1
Input
A
Y2
B2
Figure 2. Logic Symbol
Y=A+B
B
Y
L
L
H
L
H
L
H
L
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
March, 2013 − Rev. 12
1
Publication Order Number:
NL27WZ02/D
NL27WZ02
MAXIMUM RATINGS
Symbol
Value
Units
DC Supply Voltage
−0.5 to +7.0
V
VI
DC Input Voltage
−0.5 to +7.0
V
VO
DC Output Voltage
−0.5 to +7.0
V
IIK
DC Input Diode Current
VI < GND
−50
mA
IOK
DC Output Diode Current
VO < GND
−50
mA
VCC
Parameter
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
> 2000
> 200
N/A
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
mA
±100
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
1.65
1.5
5.5
5.5
0
5.5
Units
Supply Voltage
Operating
Data Retention Only
VCC
Input Voltage (Note 6)
VI
Output Voltage (HIGH or LOW State)
VO
0
5.5
V
Operating Free−Air Temperature
TA
−55
+125
°C
Input Transition Rise or Fall Rate
VCC = 1.8 V ±0.15 V
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
Dt/DV
0
0
0
0
20
20
10
5
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
V
V
ns/V
NL27WZ02
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
TA = 255C
VCC
(V)
Min
0.75 VCC
0.7 VCC
VIH
High−Level Input
Voltage
1.65
2.3 to 5.5
VIL
Low−Level Input
Voltage
1.65
2.3 to 5.5
VOH
High−Level Output
Voltage
VIN = VIL or VIH
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VOL
Low−Level Output
Voltage
VIN = VIH or VOH
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
Input Leakage
Current
VIN = 5.5 V or GND
IOFF
Power Off
Leakage Current
VIN = 5.5 V or
VOUT = 5.5 V
ICC
Quiescent Supply
Current
VIN = 5.5 V or GND
IIN
Typ
−555C 3 TA 3 1255C
Max
Min
Max
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.5
2.1
2.4
2.7
2.5
4.0
0.0
0.08
0.20
0.22
0.28
0.38
0.42
Units
V
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.90
2.20
2.40
2.30
3.80
V
V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
0 to 5.5
±0.1
±1.0
mA
0
1
10
mA
5.5
1
10
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
TA = 255C
VCC
−555C 3 TA 3 1255C
Parameter
Condition
Symbol
(V)
Min
Typ
Max
Min
Max
Propagation Delay
(Figure 3 and 4)
RL = 1 MW, CL = 15 pF
tPLH
tPHL
1.8 ± 0.15
2.0
7.4
9.5
2.0
9.7
Units
ns
2.5 ± 0.20
1.2
3.3
5.4
1.2
5.8
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 ± 0.30
0.8
1.2
2.6
3.2
3.9
4.8
0.8
1.2
4.3
5.2
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
5.0 ± 0.50
0.5
0.8
1.9
2.5
3.1
3.7
0.5
0.8
3.3
4.0
CAPACITIVE CHARACTERISTICS
Parameter
Condition
Symbol
Typical
Units
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CIN
2.5
pF
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
CPD
9.0
11.0
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ02
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
90%
50%
10%
10%
tPHL
INPUT
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NL27WZ02USG
Package
Shipping†
US8
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ02
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
K
D
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
N
R 0.10 TYP
0.10 (0.004)
M
T X Y
V
M
F
DETAIL E
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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For additional information, please contact your local
Sales Representative
NL27WZ02/D
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