Dual 2-Input OR Gate

NL27WZ32
Dual 2-Input OR Gate
The NL27WZ32 is a high performance dual 2−input OR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ32
Chip Complexity: FET = 120
These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAM
8
8
1
L4 M G
G
US8
US SUFFIX
CASE 493
LR
M
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
A1
1
8
*Date Code orientation may vary depending upon
manufacturing location.
VCC
PIN ASSIGNMENT
B1
Y2
GND
2
7
3
6
4
5
Y1
B2
A2
Pin
Function
1
A1
2
B1
3
Y2
4
GND
5
A2
6
B2
7
Y1
8
VCC
Figure 1. Pinout
FUNCTION TABLE
IEEE/IEC
A1
B1
w1
A2
B2
Output
Y=A+B
Input
Y1
A
Y2
Figure 2. Logic Symbol
B
Y
L
L
L
L
H
H
H
L
H
H
H
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. 8
1
Publication Order Number:
NL27WZ32/D
NL27WZ32
MAXIMUM RATINGS
Symbol
Value
Units
DC Supply Voltage
−0.5 to +7.0
V
VI
DC Input Voltage
−0.5 to +7.0
V
VO
DC Output Voltage
−0.5 to +7.0
V
IIK
DC Input Diode Current
VI < GND
−50
mA
IOK
DC Output Diode Current
VO < GND
−50
mA
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
VCC
Parameter
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
FR
VESD
ILatch−Up
Moisture Sensitivity
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
> 2000
> 200
N/A
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 5)
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Units
VCC
Supply Voltage
Operating
Data Retention Only
1.65
1.5
5.5
5.5
VI
Input Voltage (Note 6)
0
5.5
V
VO
Output Voltage (HIGH or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−40
+85
°C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 1.8 V ±0.15 V
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
0
0
0
0
20
20
10
5
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
V
ns/V
NL27WZ32
DC ELECTRICAL CHARACTERISTICS
TA = +255C
VCC
(V)
Min
HIGH Level Input Voltage
1.65 to 1.95
0.75 VCC
0.7 VCC
VIL
LOW Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VOH
HIGH Level Output
Voltage
VIN = VIH
Symbol
Parameter
VIH
VOL
IIN
Condition
Low−Level Output
Voltage
VIN = VIL
Typ
TA = −405C to +855C
Max
Min
0.75 VCC
0.7 VCC
0.3 VCC
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
1.65
2.3
3.0
4.5
1.55
2.2
2.9
4.4
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.8
2.68
4.2
1.20
1.9
2.4
2.3
3.8
IOL = 100 mA
1.65
2.3
3.0
4.5
0
0
0
0
0.1
0.1
0.1
0.1
IOH = 4 mA
IOH = 8 mA
IOH = 16 mA
IOH = 24 mA
IOH = 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.1
0.15
0.22
0.22
0.24
0.3
0.4
0.55
0.55
Input Leakage Current
VIN = 5.5 V or GND
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
ICC
Quiescent Supply Current
VIN = 5.5 V or GND
Units
V
0.3 VCC
IOH = −100 mA
IOFF
Max
V
V
V
0 to 5.5
±0.1
±1.0
0
1.0
10
5.5
1.0
10
mA
mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
VCC
Symbol
tPLH
tPHL
Parameter
Propagation Delay
(Figure 3 and 4)
TA = 255C
*405C v TA v 855C
Condition
(V)
Min
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 15 pF
1.8 ± 0.15
2.5 ± 0.2
2.0
1.0
8.0
3.5
9.5
5.8
2.0
1.0
10.5
6.2
ns
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
3.3 ± 0.3
0.8
1.2
2.6
3.2
3.9
4.8
0.8
1.2
4.3
5.2
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
5.0 ± 0.5
0.5
0.8
1.9
2.5
3.1
3.7
0.5
0.8
3.3
4.0
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Units
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
9
11
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ32
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
50%
VCC
90%
50%
10%
10%
tPHL
INPUT
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
NL27WZ32USG
Package
Shipping†
US8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ32
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
A
8
−Y−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
J
DETAIL E
B
L
1
4
R
G
P
S
U
C
−T−
SEATING
PLANE
D
0.10 (0.004)
M
H
0.10 (0.004) T
K
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
SOLDERING FOOTPRINT*
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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5
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NL27WZ32/D
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