Dual Inverter

NL27WZ04
Dual Inverter
The NL27WZ04 is a high performance dual inverter operating from
a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
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Features
•
•
•
•
•
•
•
•
MARKING
DIAGRAMS
SC−88
(SC70−6/SOT−363)
DF SUFFIX
CASE 419B
1
6
M
•
•
•
Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible − Interface Capability with 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7W04
Chip Complexity: FET = 72; Equivalent Gate = 18
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
1
TSOP−6
DT SUFFIX
CASE 318G
1
M5 M G
G
M5 M G
G
1
M5
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
IN A1
1
6
OUT Y1
GND
2
5
VCC
IN A2
3
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
PIN ASSIGNMENT
OUT Y2
4
Figure 1. Pinout (Top View)
IN A1
1
IN A2
1
Pin
Function
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
FUNCTION TABLE
OUT Y1
OUT Y2
Figure 2. Logic Symbol
A Input
Y Output
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
March, 2013 − Rev. 10
1
Publication Order Number:
NL27WZ04/D
NL27WZ04
MAXIMUM RATINGS
Symbol
VCC
Characteristics
DC Supply Voltage
Value
Units
−0.5 to +7.0
V
V
VI
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
VO
DC Output Voltage
Output in HIGH or LOW State (Note 1)
−0.5 ≤ VO ≤ 7.0
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
V
VI < GND
−50
mA
VO < GND
−50
mA
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6 (Note 2)
200
qJA
Thermal Resistance
SC−88, TSOP−6 (Note 2)
333
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
N/A
ILATCHUP
Latchup Performance Above VCC and Below GND at 125°C (Note 6)
mW
°C/W
V
mA
±100
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
3. Tested to EIA/JESD22−A114−A
4. Tested to EIA/JESD22−A115−A
5. Tested to JESD22−C101−A
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Supply Voltage
Operating
Data Retention Only
VCC
Min
Max
1.65
1.5
5.5
5.5
Units
V
Input Voltage
VI
0
5.5
V
Output Voltage (HIGH or LOW State)
VO
0
5.5
V
Operating Free−Air Temperature
TA
−55
+125
°C
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
Dt/DV
0
0
0
20
10
5
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2
ns/V
NL27WZ04
DC ELECTRICAL CHARACTERISTICS
VCC
Parameter
−55°C 3 TA 3 125°C
Symbol
(V)
Min
High−Level Input
Voltage
VIH
1.65−1.95
0.75 VCC
0.75 VCC
2.3 to 5.5
0.7 VCC
0.7 VCC
Low−Level Input
Voltage
VIL
High−Level Output
Voltage
VIN = VIL
Low−Level Output
Voltage
VIN = VIH
Condition
TA = 25°C
Typ
Max
Min
Max
V
1.65−1.95
0.25 VCC
0.25 VCC
2.3 to 5.5
0.3 VCC
0.3 VCC
1.65 to 5.5
VCC − 0.1
VCC
VCC − 0.1
IOH = −3 mA
1.65
1.29
1.52
1.29
IOH = −8 mA
2.3
1.9
2.1
1.9
IOH = −12 mA
2.7
2.2
2.4
2.2
IOH = −16 mA
3.0
2.4
2.7
2.4
IOH = −24 mA
3.0
2.3
2.5
2.3
IOH = −32 mA
4.5
3.8
4.0
3.8
IOH = −100 mA
VOH
0.1
0.1
1.65
0.08
0.24
0.24
IOL = 8 mA
2.3
0.20
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
4.5
0.42
VOL
IOL = 32 mA
1.65 to 5.5
V
V
IOL = 3 mA
IOL = 100 mA
Units
V
0.55
0.55
VIN = 5.5 V or GND
IIN
0 to 5.5
±0.1
±1.0
mA
Power Off
Leakage Current
VIN = 5.5 V or
VOUT = 5.5 V
IOFF
0
1
10
mA
Quiescent Supply
Current
VIN = 5.5 V or GND
ICC
5.5
1
10
mA
Input Leakage Current
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
−55°C 3 TA 3 125°C
Min
Typ
Max
Min
Max
Units
1.65
1.8
2.3
9.2
1.8
11.0
ns
1.8
1.8
4.4
7.6
1.8
8.4
RL = 1 MW, CL = 15 pF
2.5 ± 0.2
1.2
3.0
5.1
1.2
5.6
RL = 1 MW, CL = 15 pF
3.3 ± 0.3
0.8
2.2
3.4
0.8
3.8
1.2
2.9
4.5
1.2
5.0
0.5
1..8
2.8
0.5
3.1
0.8
2.3
3.6
0.8
4.0
Condition
Symbol
RL = 1 MW, CL = 15 pF
tPLH
tPHL
Parameter
Propagation Delay
(Figure 3 and 4)
TA = 25°C
VCC
(V)
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 ± 0.5
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Parameter
Symbol
Condition
Typical
Units
Input Capacitance
CIN
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
Power Dissipation
Capacitance (Note 7)
CPD
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
9
11
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ04
A
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL27WZ04DFT1G
SC−88/SC70−6/SOT−363
(Pb−Free)
3000 / Tape & Reel
NL27WZ04DFT2G
SC−88/SC70−6/SOT−363
(Pb−Free)
3000 / Tape & Reel
NLV27WZ04DFT1G*
SC−88/SC70−6/SOT−363
(Pb−Free)
3000 / Tape & Reel
NLV27WZ04DFT2G*
SC−88/SC70−6/SOT−363
(Pb−Free)
3000 / Tape & Reel
TSOP−6
(Pb−Free)
3000 / Tape & Reel
Device
NL27WZ04DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZ04
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
A
D
6
5
GAGE
PLANE
4
2
L
L2
E1
E
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
H
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
ddd
TOP VIEW
A2
A
6X
ccc C
A1
SIDE VIEW
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
b
C
M
C A-B D
DETAIL A
SEATING
PLANE
END VIEW
c
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
RECOMMENDED
SOLDERING FOOTPRINT*
6X
6X
0.30
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
MIN
NOM MAX
−−−
−−− 0.043
0.000
−−− 0.004
0.027 0.035 0.039
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
NL27WZ04
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
D
H
6
E1
5
ÉÉÉ
1
NOTE 5
2
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
A
SEATING
PLANE
c
A1
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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For additional information, please contact your local
Sales Representative
NL27WZ04/D
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