NL27WZ04 Dual Inverter The NL27WZ04 is a high performance dual inverter operating from a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. http://onsemi.com Features • • • • • • • • MARKING DIAGRAMS SC−88 (SC70−6/SOT−363) DF SUFFIX CASE 419B 1 6 M • • • Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability with 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7W04 Chip Complexity: FET = 72; Equivalent Gate = 18 NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant 1 TSOP−6 DT SUFFIX CASE 318G 1 M5 M G G M5 M G G 1 M5 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) IN A1 1 6 OUT Y1 GND 2 5 VCC IN A2 3 *Date Code orientation and/or position and underbar may vary depending upon manufacturing location. PIN ASSIGNMENT OUT Y2 4 Figure 1. Pinout (Top View) IN A1 1 IN A2 1 Pin Function 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 FUNCTION TABLE OUT Y1 OUT Y2 Figure 2. Logic Symbol A Input Y Output L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2013 March, 2013 − Rev. 10 1 Publication Order Number: NL27WZ04/D NL27WZ04 MAXIMUM RATINGS Symbol VCC Characteristics DC Supply Voltage Value Units −0.5 to +7.0 V V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 VO DC Output Voltage Output in HIGH or LOW State (Note 1) −0.5 ≤ VO ≤ 7.0 IIK DC Input Diode Current IOK DC Output Diode Current IO V VI < GND −50 mA VO < GND −50 mA DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SC−88, TSOP−6 (Note 2) 200 qJA Thermal Resistance SC−88, TSOP−6 (Note 2) 333 TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C VESD ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 N/A ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 6) mW °C/W V mA ±100 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A 4. Tested to EIA/JESD22−A115−A 5. Tested to JESD22−C101−A 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Supply Voltage Operating Data Retention Only VCC Min Max 1.65 1.5 5.5 5.5 Units V Input Voltage VI 0 5.5 V Output Voltage (HIGH or LOW State) VO 0 5.5 V Operating Free−Air Temperature TA −55 +125 °C Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V Dt/DV 0 0 0 20 10 5 http://onsemi.com 2 ns/V NL27WZ04 DC ELECTRICAL CHARACTERISTICS VCC Parameter −55°C 3 TA 3 125°C Symbol (V) Min High−Level Input Voltage VIH 1.65−1.95 0.75 VCC 0.75 VCC 2.3 to 5.5 0.7 VCC 0.7 VCC Low−Level Input Voltage VIL High−Level Output Voltage VIN = VIL Low−Level Output Voltage VIN = VIH Condition TA = 25°C Typ Max Min Max V 1.65−1.95 0.25 VCC 0.25 VCC 2.3 to 5.5 0.3 VCC 0.3 VCC 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 IOH = −3 mA 1.65 1.29 1.52 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 3.8 IOH = −100 mA VOH 0.1 0.1 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 4.5 0.42 VOL IOL = 32 mA 1.65 to 5.5 V V IOL = 3 mA IOL = 100 mA Units V 0.55 0.55 VIN = 5.5 V or GND IIN 0 to 5.5 ±0.1 ±1.0 mA Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V IOFF 0 1 10 mA Quiescent Supply Current VIN = 5.5 V or GND ICC 5.5 1 10 mA Input Leakage Current AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W −55°C 3 TA 3 125°C Min Typ Max Min Max Units 1.65 1.8 2.3 9.2 1.8 11.0 ns 1.8 1.8 4.4 7.6 1.8 8.4 RL = 1 MW, CL = 15 pF 2.5 ± 0.2 1.2 3.0 5.1 1.2 5.6 RL = 1 MW, CL = 15 pF 3.3 ± 0.3 0.8 2.2 3.4 0.8 3.8 1.2 2.9 4.5 1.2 5.0 0.5 1..8 2.8 0.5 3.1 0.8 2.3 3.6 0.8 4.0 Condition Symbol RL = 1 MW, CL = 15 pF tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) TA = 25°C VCC (V) RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 ± 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Parameter Symbol Condition Typical Units Input Capacitance CIN VCC = 5.5 V, VI = 0 V or VCC 2.5 pF Power Dissipation Capacitance (Note 7) CPD 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ04 A VCC 50% GND tPLH Y tPHL 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NL27WZ04DFT1G SC−88/SC70−6/SOT−363 (Pb−Free) 3000 / Tape & Reel NL27WZ04DFT2G SC−88/SC70−6/SOT−363 (Pb−Free) 3000 / Tape & Reel NLV27WZ04DFT1G* SC−88/SC70−6/SOT−363 (Pb−Free) 3000 / Tape & Reel NLV27WZ04DFT2G* SC−88/SC70−6/SOT−363 (Pb−Free) 3000 / Tape & Reel TSOP−6 (Pb−Free) 3000 / Tape & Reel Device NL27WZ04DTT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL27WZ04 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y 2X aaa H D D A D 6 5 GAGE PLANE 4 2 L L2 E1 E 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. H DETAIL A 3 aaa C 2X bbb H D 2X 3 TIPS e B 6X ddd TOP VIEW A2 A 6X ccc C A1 SIDE VIEW DIM A A1 A2 b C D E E1 e L L2 aaa bbb ccc ddd b C M C A-B D DETAIL A SEATING PLANE END VIEW c MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 −−− 0.10 0.70 0.90 1.00 0.15 0.20 0.25 0.08 0.15 0.22 1.80 2.00 2.20 2.00 2.10 2.20 1.15 1.25 1.35 0.65 BSC 0.26 0.36 0.46 0.15 BSC 0.15 0.30 0.10 0.10 RECOMMENDED SOLDERING FOOTPRINT* 6X 6X 0.30 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES MIN NOM MAX −−− −−− 0.043 0.000 −−− 0.004 0.027 0.035 0.039 0.006 0.008 0.010 0.003 0.006 0.009 0.070 0.078 0.086 0.078 0.082 0.086 0.045 0.049 0.053 0.026 BSC 0.010 0.014 0.018 0.006 BSC 0.006 0.012 0.004 0.004 NL27WZ04 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V D H 6 E1 5 ÉÉÉ 1 NOTE 5 2 L2 4 GAUGE PLANE E 3 L b C DETAIL Z e 0.05 M A SEATING PLANE c A1 DETAIL Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. DIM A A1 b c D E E1 e L L2 M MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 6X 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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