Dual Unbuffered Inverter

NL27WZU04
Dual Unbuffered Inverter
The NL27WZU04 is a high performance dual unbuffered inverter
operating from a 1.65 to 5.5 V supply. These devices are well suited
for use as oscillators, pulse shapers, and in many other applications
requiring a high−input impedance amplifier. For digital applications,
the NL27WZ04 is recommended.
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Features
•
•
•
Designed for 1.65 V to 5.5 V VCC Operation
Unbuffered for Crystal Oscillator and Analog Applications
LVCMOS Compatible
Source/Sink ±16 mA @ 4.5 V VCC
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
These Devices are Pb−Free and are RoHS Compliant
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
IN A1
1
6
OUT Y1
GND
2
5
VCC
MARKING
DIAGRAMS
6
M
•
•
•
•
•
SC−88/SOT−363/SC−70
DF SUFFIX
CASE 419B
M6 M G
G
1
6
TSOP−6
DT SUFFIX
CASE 318G
M6
M
G
M6 M G
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
IN A2
3
OUT Y2
4
PIN ASSIGNMENT
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
Figure 2. Logic Symbol
Pin
Function
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
FUNCTION TABLE
A Input
Y Output
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. 9
1
Publication Order Number:
NL27WZU04/D
NL27WZU04
MAXIMUM RATINGS
Symbol
VCC
Characteristics
Value
Units
−0.5 to +7.0
V
−0.5 ≤ VI ≤ VCC
V
−0.5 to +7.0
V
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
VI < GND
−50
IOK
DC Output Diode Current
VO < GND
VO > VCC
−50
+50
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6
200
qJA
Thermal Resistance
SC−88, TSOP−6
333
TL
Lead Temperature, 1 mm from Case for 10 s
260
°C
TJ
Junction Temperature under Bias
+150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
> 2000
> 200
N/A
ILatchup
Latchup Performance
Above VCC and Below GND at 85°C (Note 4)
mA
mA
mW
°C/W
V
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
Min
Max
1.65
1.5
5.5
5.5
Units
V
VI
Input Voltage
0
5.5
V
VO
Output Voltage (High or LOW State)
0
5.5
V
TA
Operating Free−Air Temperature
−55
+125
°C
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ± 0.2 V
VCC = 3.0 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
0
0
0
20
10
5
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2
ns/V
NL27WZU04
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
VIH
High−Level Input Voltage
TA = 25°C
Min
1.65 to 1.85
0.85 VCC
0.85 VCC
2.3 to 5.5
0.8 VCC
0.8 VCC
Typ
1.65 to 1.85
VIL
Low−Level Input Voltage
VOH
High−Level Output
Voltage
VIN = VIL
IOH = −100 mA
VIN = GND
Max
IIN
Min
Max
Units
V
0.15 VCC
2.3 to 5.5
VOL
−55°C 3 TA 3 125°C
VCC
(V)
0.15 VCC
0.2 VCC
V
0.2 VCC
1.65 to 5.5
VCC−0.1
VCC−0.1
IOH = −3 mA
1.65
1.29
1.52
1.29
IOH = −4 mA
2.3
1.9
2.1
1.9
IOH = −6 mA
2.7
2.2
2.3
2.2
IOH = −8 mA
3.0
2.4
2.6
2.4
IOH = −12 mA
3.0
2.3
2.5
2.3
IOH = −16 mA
4.5
3.8
4.2
Low−Level Output
Voltage
VIN = VIH
IOL = 100 mA
1.65 to 5.5
VIN = VCC
IOL = 3 mA
1.65
IOL = 4 mA
IOL = 6 mA
V
3.8
0.1
0.1
0.08
0.24
0.24
2.3
0.12
0.3
0.3
2.7
0.20
0.4
0.4
IOL = 8 mA
3.0
0.24
0.4
0.4
IOL = 12 mA
3.0
0.26
0.55
0.55
IOL = 16 mA
4.5
0.31
0.55
0.55
0 to 5.5
±0.1
±1.0
mA
0
1
10
mA
5.5
1.0
10
mA
Input Leakage Current
VIN = 5.5 V or GND
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
ICC
Maximum Quiescent
Supply Current
VIN = 5.5 V or GND
V
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPLH
tPHL
Condition
VCC (V)
Min
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 50 pF
1.8 ± 0.15
1.5
5.5
1.8
1.5
11.0
ns
RL = 1 MW, CL = 15 pF
2.5 ± 0.2
1.2
3.3
5.7
1.2
6.3
RL = 1 MW, CL = 15 pF
3.3 ± 0.3
0.8
2.7
4.1
0.8
4.5
1.2
4.0
6.4
1.2
7.0
0.5
2.2
3.3
0.5
3.6
0.8
3.4
5.6
0.8
6.2
Parameter
Propagation Delay
Input A to Y
(Figure 3 and 4)
*55°C 3 TA 3 125°C
RL = 500 W, CL = 50 pF
RL = 1 MW, CL = 15 pF
5.0 ± 0.5
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance (Note 5)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
25
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZU04
A or B
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. Switching Waveforms
VCC
PULSE
GENERATOR
DUT
RT
CL
RL
CL = 50 pF or equivalent (includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NL27WZU04DFT2G
SC−88 / SOT−363 / SC−70
(Pb−Free)
3000 / Tape & Reel
NLV27WZU04DFT2G*
SC−88 / SOT−363 / SC−70
(Pb−Free)
3000 / Tape & Reel
TSOP−6
(Pb−Free)
3000 / Tape & Reel
Device
NL27WZU04DTT1G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZU04
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL27WZU04
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
D
H
6
5
ÉÉ
E1
1
NOTE 5
2
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
A
SEATING
PLANE
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NL27WZU04/D
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