Binary to 1-8 Decoder (High)

MC10162
Binary to 1-8 Decoder
(High)
The MC10162 is designed to convert three lines of input data to a
one–of–eight output. The selected output will be high while all other
outputs are low. The enable inputs, when either or both are high, force
all outputs low.
The MC10162 is a true parallel decoder. No series gating is used
internally, eliminating unequal delay times found in other decoders.
This device is ideally suited for demultiplexer applications. One of
the two enable inputs is used as the data input, while the other is used
as a data enable input.
A complete mux/demux operation on 16 bits for data distribution is
illustrated in Figure 1 of the MC10161 data sheet.
• PD = 315 ns typ/pkg (No Load)
• tpd = 4.0 ns typ
• tr, tf = 2.0 ns typ (20%–80%)
http://onsemi.com
MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620
MC10162L
AWLYYWW
1
16
PDIP–16
P SUFFIX
CASE 648
MC10162P
AWLYYWW
1
LOGIC DIAGRAM
1
E02
E115
PLCC–20
FN SUFFIX
CASE 775
6Q0
5Q1
10162
AWLYYWW
4Q2
A7
A
WL
YY
WW
3Q3
13Q4
B9
= Assembly Location
= Wafer Lot
= Year
= Work Week
12Q5
DIP PIN ASSIGNMENT
11Q6
C14
10Q7
VCC1
1
16
VCC2
E0
2
15
E1
Q3
3
14
C
Q2
4
13
Q4
Q1
5
12
Q5
Q0
6
11
Q6
A
7
10
Q7
VEE
8
9
B
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
TRUTH TABLE
INPUTS
OUTPUTS
E0
E1
C
B
A
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
L
L
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
L
X
H
L
L
L
L
H
H
H
H
X
X
L
L
H
H
L
L
H
H
X
X
L
H
L
H
L
H
L
H
X
X
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
H
L
L
 Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7
1
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables
on page 18 of the ON Semiconductor MECL Data Book
(DL122/D).
ORDERING INFORMATION
Device
Package
Shipping
MC10162L
CDIP–16
25 Units / Rail
MC10162P
PDIP–16
25 Units / Rail
MC10162FN
PLCC–20
46 Units / Rail
Publication Order Number:
MC10162/D
MC10162
ELECTRICAL CHARACTERISTICS
Test Limits
Characteristic
Symbol
Pin
Under
Test
Power Supply Drain Current
IE
8
84
IinH
14
350
Input Current
–30°C
Min
+25°C
Max
Min
+85°C
Typ
Max
Max
Unit
61
76
Min
84
mAdc
220
220
µAdc
0.5
µAdc
IinL
14
0.5
Output Voltage
Logic 1
VOH
13
–1.060
–0.890
–0.960
–0.810
–0.890
0.3
–0.700
Vdc
Output Voltage
Logic 0
VOL
13
13
–1.890
–1.890
–1.675
–1.675
–1.850
–1.850
–1.650
–1.650
–1.825
–1.825
–1.615
–1.615
Vdc
Threshold Voltage
Logic 1
VOHA
13
–1.080
Threshold Voltage
Logic 0
VOLA
13
13
–0.980
–0.910
–1.655
–1.655
Vdc
–1.630
–1.630
–1.595
–1.595
Switching Times (50Ω Load)
Propagation Delay
Vdc
ns
t14+13–
t14–13+
13
13
1.5
1.5
6.2
6.2
1.5
1.5
4.0
4.0
6.0
6.0
1.5
1.5
6.4
6.4
Rise Time
(20 to 80%)
t13+
13
1.0
3.3
1.1
2.0
3.3
1.1
3.5
Fall Time
(20 to 80%)
t13–
13
1.0
3.3
1.1
2.0
3.3
1.1
3.5
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
Characteristic
Power Supply Drain Current
Input Current
@ Test Temperature
VIHmax
VILmin
VIHAmin
VILAmax
VEE
–30°C
–0.890
–1.890
–1.205
–1.500
–5.2
+25°C
–0.810
–1.850
–1.105
–1.475
–5.2
+85°C
–0.700
–1.825
–1.035
–1.440
–5.2
Symbol
Pin
Under
Test
IE
8
IinH
14
IinL
14
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
VILmin
VIHAmin
VILAmax
14
14
VEE
(VCC)
Gnd
8
1,16
8
1,16
8
1,16
Output Voltage
Logic 1
VOH
13
14
8
1,16
Output Voltage
Logic 0
VOL
13
13
2
15
8
8
1,16
1,16
Threshold Voltage
Logic 1
VOHA
13
14
8
1,16
Threshold Voltage
Logic 0
VOLA
13
13
2
15
8
8
1,16
1,16
Pulse In
Pulse Out
–3.2 V
+2.0 V
t14+13+
t14–13–
13
13
14
14
13
13
8
8
1,16
1,16
Switching Times
(50Ω Load)
Propagation Delay
Rise Time
(20 to 80%)
t+
13
14
13
8
1,16
Fall Time
(20 to 80%)
t–
13
14
13
8
1,16
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
http://onsemi.com
2
MC10162
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180)
B
Y BRK
–N–
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
–L–
–M–
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D–D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
0.007 (0.180)
H
M
T L-M
S
N
S
K1
K
C
E
F
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L-M
S
N
S
0.007 (0.180)
M
T L-M
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
http://onsemi.com
3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
--0.025
--0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2
10 0.310
0.330
0.040
---
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
--0.64
--8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2
10 7.88
8.38
1.02
---
N
S
MC10162
–A–
16
9
1
8
–B–
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
S
T A
M
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
--0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
15 0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
--5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
15 0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
10 0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
10 0.51
1.01
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
http://onsemi.com
4
MC10162/D
Similar pages