3.0 A, 400 V Ultrafast Power Rectifier

MURD340T4G,
NRVUD340T4G
SWITCHMODE
PowerRectifier
DPAK Surface Mount Package
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These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features






ULTRAFAST RECTIFIER
3 A, 400 V
Low Forward Voltage Drop
Low Leakage
Ultra−Fast Recovery Time
AEC−Q101 Qualified and PPAP Capable
NRVUD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
Pb−Free Package*
DPAK
CASE 369C
1
Mechanical Characteristics
 Case: Epoxy, Molded
 Weight: 0.4 gram (approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal
MARKING DIAGRAM
Leads are Readily Solderable
1
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VR
400
V
Average Rectified Forward Current
IF(AV)
3
A
Nonrepetitive Peak Surge Current
IFSM
75
A
TJ, Tstg
−55 to +175
C
Peak Reverse Voltage
Operating Junction and Storage
Temperature Range
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
4
3
U340
A
Y
WW
G
AYWW
U340G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
MURD340T4G
DPAK
(Pb−Free)
2,500 /
Tape & Reel
NRVUD340T4G
DPAK
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 2
1
Publication Order Number:
MURD340/D
MURD340T4G, NRVUD340T4G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Thermal Resistance − Junction−to−Case
Thermal Resistance − Junction−to−Ambient (Note 1)
1. Rating applies when surface mounted on a 700
mm2,
Value
Unit
RqJC
2
C/W
RqJA
49
C/W
Symbol
Value
Unit
1 oz Cu heat spreader.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage
(IF = 3.0 A, TJ = 25C)
(IF = 3.0 A, TJ = 150C)
VF
Maximum Instantaneous Reverse Current (Rated VR)
(TJ = 25C, 400 V)
(TJ = 150C, 400 V)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25C)
trr
V
1.15
0.92
mA
5
500
ns
50
ESD Ratings:
Machine Model = C
Human Body Model = 3B
V
> 400
> 8000
100.0
10.0
1.0
175C
0.1
0.4 0.5
0.6
150C
0.7
0.8
0.9
25C
1.0
1.1
1.2
1.3
VF, INSTANTANEOUS VOLTAGE (V)
1.4
IF, INSTANTANEOUS FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
100.0
10.0
175C
1.0
0.1
0.4 0.5
Figure 1. Typical Forward Voltage
0.6
0.7
150C
0.8
0.9
1.0
25C
1.1
1.2
1.3
VF, INSTANTANEOUS VOLTAGE (V)
Figure 2. Maximum Forward Voltage
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2
1.4
MURD340T4G, NRVUD340T4G
1.0E−02
1.0E−02
1.0E−03
1.0E−03
1.0E−04
IR, REVERSE CURRENT (A)
IR, REVERSE CURRENT (A)
TYPICAL CHARACTERISTICS
175C
1.0E−05
150C
1.0E−06
1.0E−07
25C
1.0E−08
1.0E−09
1.0E−10
0.0
50
100
150
200
250
300
175C
150C
1.0E−04
1.0E−05
1.0E−06
25C
1.0E−07
1.0E−08
1.0E−09
1.0E−10
0.0
50
100
VR, REVERSE VOLTAGE (V)
10
IF, AVERAGE FORWARD CURRENT (A)
20
40
60
80
100
120 140 160 180 200
3.0
SQUARE
WAVE
2.5
DC
2.0
1.5
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Figure 6. Power Dissipation
RqJC = 2C/W
5.0
TJ = 175C/W
SQUARE
WAVE
3.0
DC
2.0
1.0
0
110
3.5
Figure 5. Typical Capacitance
4.0
120
130
140
150
160
300
4.0
Io, AVERAGE FORWARD CURRENT
6.0
100
250
VR, REVERSE VOLTAGE (VOLTS)
IF, AVERAGE FORWARD CURRENT (A)
C, CAPACITANCE (pF)
100
0
200
Figure 4. Maximum Reverse Voltage
Po, AVERAGE POWER DISSIPATION (W)
Figure 3. Typical Reverse Voltage
1.0
150
VR, REVERSE VOLTAGE (V)
170
180
4.5
6.0
RqJC = 2C/W
5.0
TJ = 175C/W
4.0
DC
3.0
SQUARE
WAVE
2.0
1.0
0
0
TC, CASE TEMPERATURE (C)
20
40
60
80
100
120
140
160
180 200
TA, AMBIENT TEMPERATURE (C)
Figure 7. Current Derating, Case
Figure 8. Current Derating, Ambient
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3
5.0
MURD340T4G, NRVUD340T4G
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
SEATING
PLANE
A1
L1
DETAIL A
ROTATED 905 CW
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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4
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For additional information, please contact your local
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MURD340/D
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