MURD330T4G, SURD8330T4G SWITCHMODE Power Rectifier DPAK Surface Mount Package http://onsemi.com These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • • ULTRAFAST RECTIFIER 3 A, 300 V Low Forward Voltage Drop Low Leakage Ultra−Fast Recovery Time AEC−Q101 Qualified and PPAP Capable SURD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb−Free Package* DPAK CASE 369C 1 Mechanical Characteristics • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal MARKING DIAGRAM Leads are Readily Solderable 1 • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds MAXIMUM RATINGS Rating Symbol Value Unit Rated Reverse Voltage VR 300 V Average Rectified Forward Current (Rated VR, TC = 170°C) IF Non−Repetitive Peak Surge Current IFSM 75 A TJ, Tstg −55 to +175 °C Operating Junction and Storage Temperature Range A 3.0 U330 A Y WW G AYWW U330G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Package Shipping† MURD330T4G DPAK (Pb−Free) 2,500/Tape & Reel SURD8330T4G DPAK (Pb−Free) 2,500/Tape & Reel Device Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 4 3 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 5 1 Publication Order Number: MURD330/D MURD330T4G, SURD8330T4G THERMAL CHARACTERISTICS Characteristics Thermal Resistance − Junction−to−Case Thermal Resistance − Junction−to−Ambient (Note 1) 1. Rating applies when surface mounted on a 700 mm2, Symbol Value Unit RqJC 2 °C/W RqJA 49 °C/W Symbol Value Unit 1 oz Cu heat spreader. ELECTRICAL CHARACTERISTICS Characteristics Maximum Instantaneous Forward Voltage Drop (IF = 3 A, TJ = 25°C) (iF = 3 A, TJ = 150°C) VF Maximum Instantaneous Reverse Current (TJ = 25°C, 300 V) (TJ = 150°C, 300 V) IR Maximum Reverse Recovery Time (IF = 1 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25°C) trr V 1.15 0.92 mA 5 500 ns 50 ESD Ratings: Machine Model = C Human Body Model = 3B V > 400 > 8000 Typical Peak Reverse Recovery Current (IF = 1.0 A, di/dt = 50 A/ms) IRM 1.5 A 100.0 10.0 1.0 175°C 0.1 0.4 0.5 0.6 150°C 0.7 0.8 0.9 25°C 1.0 1.1 1.2 1.3 VF, INSTANTANEOUS VOLTAGE (V) 1.4 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) TYPICAL CHARACTERISTICS 100.0 10.0 175°C 1.0 0.1 0.4 0.5 Figure 1. Typical Forward Voltage 0.6 0.7 150°C 0.8 0.9 1.0 25°C 1.1 1.2 1.3 VF, INSTANTANEOUS VOLTAGE (V) Figure 2. Maximum Forward Voltage http://onsemi.com 2 1.4 MURD330T4G, SURD8330T4G 1.0E−02 1.0E−02 1.0E−03 1.0E−03 1.0E−04 IR, REVERSE CURRENT (A) IR, REVERSE CURRENT (A) TYPICAL CHARACTERISTICS 175°C 1.0E−05 150°C 1.0E−06 1.0E−07 25°C 1.0E−08 1.0E−09 1.0E−10 0.0 50 100 150 200 250 300 175°C 150°C 1.0E−04 1.0E−05 1.0E−06 25°C 1.0E−07 1.0E−08 1.0E−09 1.0E−10 0.0 50 100 VR, REVERSE VOLTAGE (V) C, CAPACITANCE (pF) 100 10 0 20 40 60 80 100 120 140 160 180 200 3.0 SQUARE WAVE 2.5 1.5 1.0 0.5 0 0 0.5 IF, AVERAGE FORWARD CURRENT (A) IF, AVERAGE FORWARD CURRENT (A) 5.0 DC 2.0 1.0 0 100 110 120 130 140 150 160 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 6. Power Dissipation RqJC = 2°C/W 3.0 DC 2.0 Io, AVERAGE FORWARD CURRENT 6.0 SQUARE WAVE 300 3.5 Figure 5. Typical Capacitance TJ = 175°C/W 250 4.0 VR, REVERSE VOLTAGE (VOLTS) 4.0 200 Figure 4. Maximum Reverse Voltage Po, AVERAGE POWER DISSIPATION (W) Figure 3. Typical Reverse Voltage 1.0 150 VR, REVERSE VOLTAGE (V) 170 180 6.0 RqJC = 2°C/W 5.0 TJ = 175°C/W 4.0 DC 3.0 SQUARE WAVE 2.0 1.0 0 0 TC, CASE TEMPERATURE (°C) 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Case Figure 8. Current Derating, Ambient http://onsemi.com 3 MURD330T4G, SURD8330T4G PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE D A E b3 c2 B Z D 1 L4 A 4 L3 b2 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C H DETAIL A 3 c b 0.005 (0.13) M H C L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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