Quad Array for ESD Protection

MSQA6V1W5T2G,
SZMSQA6V1W5T2G
Quad Array
for ESD Protection
ESD Protection Diodes with Low
Clamping Voltage
http://onsemi.com
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
1
Features
2







Low Clamping Voltage
Stand Off Voltage 3 V
Low Leakage < 1 mA @ 3 V
SC−88A Package Allows Four Separate Unidirectional
Configurations
IEC1000−4−2 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Package is Available*
Mechanical Characteristics:




Void Free, Transfer−Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
SC−88A/SOT−323
CASE 419A
5
3
4
MARKING DIAGRAM
61 M G
G
61 = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MSQA6V1W5T2G
SC−88A
(Pb−Free)
3,000 /
Tape & Reel
SZMSQA6V1W5T2G
SC−88A
(Pb−Free)
3,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*T2 Suffix Devices are Packaged with Pin 1 Opposing
Sprocket Hole.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. 7
1
Publication Order Number:
MSQA6V1W5T2/D
MSQA6V1W5T2G, SZMSQA6V1W5T2G
MAXIMUM RATINGS
Rating
Symbol
Peak Power Dissipation @ 20 ms
@TA  25C (Note 1)
Ppk
Steady State Power − 1 Diode (Note 2)
PD
Value
Unit
150
W
385
mW
325
3.1
C/W
mW/C
Thermal Resistance
Junction−to−Ambient
Above 25C, Derate
RqJA
Maximum Junction Temperature
TJmax
150
C
Operating Junction and Storage Temperature Range
TJ Tstg
−55 to +150
C
ESD Discharge
MIL STD 883C − Method 3015−6
IEC1000−4−2, Air Discharge
IEC1000−4−2, Contact Discharge
VPP
Lead Solder Temperature (10 s duration)
kV
16
16
9
TL
260
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current per Figure 5. Derate per Figure 10.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR−4 board with min pad.
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted)
I
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
Working Peak Reverse Voltage
VC VBR VRWM
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation
C
IF
V
IR VF
IT
IPP
Uni−Directional TVS
Capacitance @ VR = 0 and f = 1.0 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
ELECTRICAL CHARACTERISTICS
Breakdown Voltage
VBR @ 1 mA (Vo)
(Note 3)
Device*
MSQA6V1W5T2G
Min
Nom
Max
Leakage Current
IRM @ VRWM = 3 V
(mA)
6.1
6.6
7.2
1.0
Capacitance
@ 0 V Bias
(pF)
Max
VF @ IF = 200
mA
(V)
90
1.25
3. VBR is measured with a pulse test current IT at an ambient temperature of 25C.
4. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
*Include SZ-prefix devices where applicable.
http://onsemi.com
2
VC
Per IEC61000−4−2
(Note 4)
Figures 1 and 2
See Below
MSQA6V1W5T2G, SZMSQA6V1W5T2G
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV Contact per IEC61000−4−2
IEC61000−4−2 Waveform
IEC 61000−4−2 Spec.
Ipeak
Level
Test
Voltage
(kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 3. IEC61000−4−2 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 4. Diagram of ESD Test Setup
http://onsemi.com
3
MSQA6V1W5T2G, SZMSQA6V1W5T2G
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
% OF PEAK PULSE CURRENT
100
PEAK VALUE IRSM @ 8 ms
tr
90
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
t, TIME (ms)
60
Figure 5. 8 X 20 ms Pulse Waveform
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4
80
MSQA6V1W5T2G, SZMSQA6V1W5T2G
100
Ipp, PEAK PULSE CURRENT (AMPS)
IF , FORWARD CURRENT (A)
1.0
0.1
0.01
0.001
0.7
0.8
0.9
1.0
1.1
2.5 ms SQUARE WAVE
1.0
1.2
0
10
20
15
25
VC, CLAMPING VOLTAGE (VOLTS)
Figure 6. Forward Voltage
Figure 7. Clamping Voltage versus Peak
Pulse Current (Reverse Direction)
100
30
1000
10
1.0
2.5 ms SQUARE WAVE
100
10
NOTE: Non−Repetitive Surge.
0.1
1
0
2.0
4.0
6.0
8.0
12
10
100
VC, FORWARD CLAMPING VOLTAGE (VOLTS)
Figure 9. Pulse Width
100
90
90
80
70
60
50
40
30
20
10
0
10
Figure 8. Clamping Voltage versus Peak
Pulse Current (Forward Direction)
100
0
1
t, TIME (ms)
TYPICAL CAPACITANCE (pF)
1 MHz FREQUENCY
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25  C
5.0
VF, FORWARD VOLTAGE (VOLTS)
Ppk , PEAK SURGE POWER (WATTS)
Ipp, PEAK FORWARD PULSE CURRENT (AMPS)
0.6
10
25
50
75
100
125
150
175
200
80
70
60
50
40
30
20
10
0
0
TA, AMBIENT TEMPERATURE (C)
1.0
2.0
3.0
BIAS VOLTAGE (VOLTS)
Figure 10. Pulse Derating Curve
Figure 11. Capacitance
http://onsemi.com
5
1000
4.0
5.0
MSQA6V1W5T2G, SZMSQA6V1W5T2G
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
C
H
K
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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6
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MSQA6V1W5T2/D