ULLGA8 1.95x1.0, 0.5P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ULLGA8, 1.95x1.0, 0.5P
CASE 613AC-01
ISSUE A
DATE 13 FEB 2008
1
SCALE 8:1
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÏÏÏÏ
ÏÏÏÏ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
MILLIMETERS
MIN
MAX
--0.40
0.00
0.05
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
A
8X
0.05 C
SEATING
PLANE
SIDE VIEW
A1
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
C
7X
0.49
e/2
e
7X
L
8X
0.30
NOTE 4
4
1
L1
1.24
8
5
8X
BOTTOM VIEW
DOCUMENT NUMBER:
98AON24014D
b
0.10 C A B
0.05 C
NOTE 3
0.53
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
ULLGA8, 1.95X1.0, 0.5P
DESCRIPTION:
October, 2002
- Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON24014D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. PETRUES.
05 MAR 2007
A
CORRECTED SOLDERING FOOTPRINT. REQ. BY M. PETRUES.
13 FEB 2008
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 01A
Case Outline Number:
613AC