BD71805MWV EN ProductBrief

PRODUCT Datasheet
BRIEF
System PMIC for
Battery Powered Systems
BD71805MWV
General Description
The BD71805MWV is a single chip power management
IC for battery-powered portable devices. It integrates 4
bucks, 3 LDOs, 2A single-cell linear charger, OVP,
Coulomb counter, RTC, 32 kHz crystal circuitry and 3
GPOs.
Four highly efficient 2.5MHz step-down converters
supply power to the application processor as well as
system peripherals such as DDR memory, wireless
modules, sensors, etc. The regulators to the processor
core supports DVS. The regulators maintain high
efficiency over a wide range of current loads by
supporting both PFM and PWM modes. High switching
frequency allows the use of smaller and cheaper
inductors and capacitors.
Features
4 programmable buck converters:
- 1A and 2A bucks supporting DVS; 0.8-2V
- 1A buck 1-2.7V and 1A buck 2.6-3.35V
3 LDOs with programmable output 0.8-3.3V
- 300mA each
LDO for DDR Reference Voltage
LDO for Secure Non-Volatile Storage (SNVS)
Single-cell Linear LIB Charger with 30V-OVP
- Selectable Charging Voltage : 3.72 to 4.34 V
- Programmable Charge Current : 100 to 2000mA
- DCIN Over Voltage Protection
- Battery Over Voltage Protection
- Support Battery Supplement Mode
- Battery Short Circuit Detection
Voltage Measurement for Thermistor
- Bias Voltage Output for External Thermistor
Embedded Coulomb Counter for Battery Fuel
Gauging
- 15-bit ∆Σ-ADC with External Current Sense Resistor
(10 mΩ, ±1%)
- 1-sec cycle, 28-bit Accumulation
- Coulomb Count while Charging/Discharging
Battery Monitoring and Alarm Output
- Under Voltage Alarm while Discharging
- Over Discharge Current Alarm
- Over/Under Temperature Alarm
- Programmable Thresholds and Time Durations
- Automatic Low Voltage Mode (Battery Protection)
3.5V Detection :
Interrupt to Processor to Ask User Plug-in
3.3V Detection :
Interrupt to Processor to Indicate Battery Critically
Low Condition
Real Time Clock with 32.768kHz Crystal Oscillator
- 32.768kHz Clock Output
(Open Drain or CMOS Output Selectable)
3 GPOs
(Open Drain or CMOS Output Selectable)
Power Control I/O
- Power On/Off Control Input
- Standby Input for Switching ON / STANDBY Mode
- Reset Input to Reset Hung PMIC
- Power On Reset Output
I2C Interface
Applications
E-Book Reader, Tablets, Media Boxes
Portable Printers, Scanners, POS
HMI, Home Automation, SBC
Key Specifications
Input Voltage Range (DCIN):
3.5V to 28V
Input Voltage Range (VIN,VSYS):
3.3V to 5.5V
Input Voltage Range (DVDD):
1.5V to 3.4V
Off Current :
25 µA (Typ)
[RTC + Coulomb counter + LDO_SNVS+ 32-kHz OSC]
Operating temperature range:
-40°C to +85°C
Package
UQFN64MV8080
W(Typ) D(Typ) H(Max)
8.0mm x 8.0mm x 1.0mm
Status of this document
The English version of this document is formal specification. A customer may use this translation version only for a reference to help
reading the formal version. If there are any differences in translation version of this document formal version takes priority.
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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Brief
BD71805MWV
Typical Applications
3.3V
GPO
SD
3.3V
eMMC
3.3V
PMIC
Touch
I/O
3.3V
WiFi
GPO
3-GPO
Xtal
3.3V
BUCK3
RTC
+
32kHz-OSC
1.425V
BUCK1
1.2V
LDO1
Power ON/OFF
Sequencer
LDO_SNVS
(ON/OFF)
Coulomb
Counter
LDO2
LDO3
BUCK4
DCIN
LIB Charger
OVP
GPO
HIGH, NVCC33_IO
ARM, SOC, PU
NVCC_1P2V
I2C
SNVS
i.MX
EPD
(i.MX6SoloLite)
3.3V
3.3V
1.8V
1.2V
BUCK2
NVCC18_IO
NVCC_DRAM
PWRON
Core1
Core2
I/O
0.6V
DVREF
(½*DVREFIN)
1.8V
1.2V
R
POWER KEY
R
DDR
(LPDDR2)
EPD
PMIC
Figure 1. Typical Applications 1 (Master Control Mode)
3.15V
GPO
eMMC
3.15V
SD
3.15V
Touch
I/O
3.15V
WiFi
PMIC
GPO
3-GPO
GPO
Xtal
RTC
+
32kHz-OSC
Power ON/OFF
Sequencer
Coulomb
Counter
BUCK 1,2
LDO1
LDO2
LDO3
1.375V
2.5V
1.8V
1.2V
3V
LDO_SNVS
(Always on)
DCIN
LIB Charger
OVP
3.15V
BUCK3
PWRON
BUCK4
DVREFIN
LDO_DVREF
HIGH, NVCC33
ARM, SOC, PU
i.MX
NVCC18
EPD
NVCC12, NVCC_DRAM
(i.MX6SoloLite)
SNVS
I2C
PMIC_ON_REQ
1.8V
1.2V
Core1
Core2
I/O
0.6V
DVREF
(½*DVREFIN)
Power ON/OFF
Control
POWER KEY
DDR
(LPDDR2)
EPD
PMIC
Figure 2. Typical Applications 2 (Slave Control Mode)
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BD71805MWV
GNDT1
GND
GND
VIN
Block Diagram
Figure 3. IC Block Diagram (Master Control Mode)
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BD71805MWV
GNDT1
GND
GND
VIN
Block Diagram - continued
Figure 4. IC Block Diagram (Slave Control Mode)
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PVIN4
CHGLED
DCIN
DCIN
VSYS
VSYS
VBAT
VBAT
TS
CHGREF
BATTP
BATTM
CHGGND
NC
PVIN3
PVIN3
Figure 5. Pin Configuration
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34
33
16
39
10
15
40
9
35
41
8
14
42
7
36
43
6
13
44
5
37
45
4
12
46
3
38
47
2
11
48
1
LX2
PVIN2
XIN32K
XOUT32K
DVDD
SCL
SDA
CLK32KOUT
GND
VOSNVS
SNVSCAP
FB1
PGND1
PGND1
LX1
LX1
BD71805MWV
Datasheet
Product
Brief
Pin Configuration
(Top View)
Product Brief
2.Jul.2015 Rev.001
Datasheet
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Brief
BD71805MWV
Pin Descriptions
Table 1. BD71805MWV Pin Description
Pin No.
Pin Name.
I/O
Function
1
PVIN4
I
Input power supply for BUCK4
2
CHGLED
O
Open-Drain Charging status Indication output
3
DCIN
I
DCIN power supply
4
DCIN
I
DCIN power supply
5
VSYS
O
System supply output
6
VSYS
O
System supply output
7
VBAT
I/O
Charger power stage output and battery voltage sense input
8
VBAT
I/O
Charger power stage output and battery voltage sense input
9
TS
I
Battery pack thermistor voltage sense
10
CHGREF
O
Internal reference for the LIB charger
11
BATTP
I
Current sense input (battery pack side)
12
BATTM
I
Current sense input (ground side)
13
CHGGND
-
Ground for Charger
14
NC
-
No Connection
15
PVIN3
I
Input power supply for BUCK3
16
PVIN3
I
Input power supply for BUCK3
17
LX3
O
Switch node connection for BUCK3
18
LX3
O
Switch node connection for BUCK3
19
PGND3
I
Power ground for BUCK3
20
PGND3
I
Power ground for BUCK3
21
FB3
I
Output voltage feedback for BUCK3
22
GNDT1
-
Ground for test
23
POR
O
Power on reset output
24
INTB
O
Open drain interrupt signal to processor
25
VINL1
I
LDO input for LDO1
26
VO1
O
LDO output for LDO1
27
VO2
O
LDO output for LDO2
28
VINL2
I
LDO input for LDO2, LDO3
29
VO3
O
LDO output for LDO3
30
VIN
I
Input power supply
31
PVIN1
I
Input power supply for BUCK1
32
PVIN1
I
Input power supply for BUCK1
33
LX1
O
Switch node connection for BUCK1
34
LX1
O
Switch node connection for BUCK1
35
PGND1
-
Power ground for BUCK1.
36
PGND1
-
Power ground for BUCK1.
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BD71805MWV
Pin Descriptions - continued
Table 2. BD71805MWV Pin Descriptions (continued)
Pin No.
Pin Name.
I/O
Function
37
FB1
I
Output voltage feedback for BUCK1
38
SNVSCAP
O
LDO output for secure non-volatile storage (requires capacitor)
39
VOSNVS
O
LDO output for secure non-volatile storage
40
GND
-
Signal ground
41
CLK32KOUT
O
32.768kHz clock output (Open drain or CMOS output selectable)
42
SDA
I/O
I2C data line (Open drain)
43
SCL
I
I2C clock
44
DVDD
I
Power supply for I2C Interface
45
XOUT32K
O
32.768kHz-Xtal output
46
XIN32K
I
32.768kHz-Xtal input
47
PVIN2
I
Input power supply for BUCK2
48
LX2
O
Switch node connection for BUCK2
49
RESETINB
I
Reset input to Shutdown BD71805MWV
50
PGND2
-
Power ground for BUCK2
51
FB2
I
Output voltage feedback for BUCK2
52
GND
-
Signal ground
53
PWRON
I
Power On/Off control input
54
STANDBY
I
Standby input signal for switching the ON and STANDBY modes
55
MSSEL
I
Master or Slave mode selector
56
GPO1
O
Output for general purpose (Open drain or CMOS output selectable)
57
GPO2
O
Output for general purpose (Open drain or CMOS output selectable)
58
GPO3
O
Output for general purpose (Open drain or CMOS output selectable)
59
VODVREF
O
LDO output for DDR-VREF
60
DVREFIN
I
LDO input for DDR-VREF
61
CPOUT
O
Charge Pump Output for OVP
62
FB4
I
Output voltage feedback for BUCK4
63
PGND4
-
Power ground for BUCK4
64
LX4
O
Switch node connection for BUCK4
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BD71805MWV
Description of Blocks
1. High Efficiency Buck Converters (BUCK1 – 4) and LDOs
BD71805MWV step down converters operate at fixed frequency of 2.5MHz and employ Pulse Width Modulation (PWM) at
moderate to heavy load current. At light load current, a converter would automatically enter Power Save Mode and operate
in Pulse Frequency Modulation (PFM).
During PWM operation, the converter uses a unique fast response voltage mode controller scheme with feed-forward input
voltage to achieve good line and load regulation, thus allowing the use of small ceramic input and output capacitors. At the
beginning of each clock cycle initiated by the clock signal, the high side MOSFET switch is turned on. The current flows
from the input capacitor via the high side MOSFET switch through the inductor to the output capacitor and load. During this
phase, the current ramps up until the PWM comparator trip causing the control logic to turn on the switch. The current limit
comparator will also turn OFF the switch in case the current limit of the high side MOSFET switch is exceeded. The low
side MOSFET rectifier is turned ON and the inductor current ramps down after a dead time preventing shoot-through
current. The current flows now from the inductor to the output capacitor and to the load. It returns back to the inductor
through the low side MOSFET rectifier. The next cycle will again be initiated by the clock signal turning off the low side
MOSFET rectifier and turning on the on the high side MOSFET switch.
When each regulators are turn off, their output capacitors are discharged via internal 600ohm resistor.
Initial output voltage of each regulators are configurable by factory OTP (One Time Programmable memory) options.
These OTP options can only be programmed by ROHM. If alternate OTP setting are desired, please contact ROHM.
Table 3. BD71805MWV Output Power Rails (Master Control Mode)
BD71805MWV i.MX6 SoloLite
Power
Initial Output
Output
Usage example
Supply
Voltage
BUCK1
BUCK2
BUCK3
BUCK4
VO1(LDO1)
VO2(LDO2)
VO3(LDO3)
VODVREF
VOSNVS
ARM/SOC/PU
Load max
PVIN1
1.425V
2000mA
Adjustable range
0.8 to 2.000V (25mV step)
[DVS]
0.8 to 2.000V (25mV step)
[DVS]
NVCC_DRAM /
LPDDR2(1.2V) / Others
HIGH / NVCC33_IO/
Wifi / eMMC / Others
NVCC18_IO /
LPDDR2(1.8V) / Others
PVIN2
1.2V
1000mA
PVIN3
3.3V
1000mA
2.6 to 3.35V (50mV step)
PVIN4
1.8V
1000mA
1.0 to 2.7V (50mV step)
NVCC_1P2V
VINL1
1.2V
300mA
0.8 to 3.3V (50mV step)
VINL2
3.3V
300mA
0.8 to 3.3V (50mV step)
VINL2
3.3V
300mA
0.8 to 3.3V (50mV step)
VIN
0.5*DVREFIN
10mA
0.4 to 1.00V
(Note1)
(DVREFIN= BUCK2)
VIN
3.0V
25mA
Fixed
Load max
Adjustable range
IO
(Default:OFF)
IO
(Default:OFF)
DDR_VREF
(Default:OFF)
SNVS
(Note1) When VODVREF is not in use, please keep DVREFIN and VODVREF open.
Table 4. BD71805MWV Output Power Rails (Slave Control Mode)
BD71805MWV i.MX6 SoloLite
Power
Initial Output
Output
Usage example
Supply
Voltage
0.8 to 2.000V (25mV step)
[DVS]
0.8 to 2.000V (25mV step)
[DVS]
BUCK1
ARM
PVIN1
1.375V
2000mA
BUCK2
SOC/PU
PVIN2
1.375V
1000mA
BUCK3
HIGH / NVCC33_IO
Peripheral, EPD
PVIN3
3.15V
1000mA
2.6 to 3.35V (50mV step)
BUCK4
LPDDR2(1.2V)
PVIN4
1.2V
1000mA
1.0 to 2.7V (50mV step)
VO1(LDO1)
Peripheral
VINL1
2.5V
300mA
0.8 to 3.3V (50mV step)
VINL2
1.8V
300mA
0.8 to 3.3V (50mV step)
VINL2
1.2V
300mA
0.8 to 3.3V (50mV step)
VO2(LDO2)
VO3(LDO3)
NVCC18_IO /
LPDDR2(1.8V)
NVCC_1P2V /
NVCC_DRAM
VODVREF
DDR_VREF
VIN
0.5*DVREFIN
10mA
0.5 to 1.35V
(DVREFIN=BUCK4)
SNVSCAP
SNVS
VIN
3.0V
25mA
Fixed
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BD71805MWV
Efficiency Curves of bucks
VBAT=4.2V, Vout=1.425V, Ta=25°C
VBAT=4.2V, Vout=1.425V, Ta=25°C
100
100
90
90
80
80
BUCK1 Efficiency : η [%]
BUCK1 Efficiency : η [%]
PFM Mode
70
60
50
40
30
70
60
50
30
20
20
10
10
0
0
0.001
PWM Mode
40
0.001
0.010
0.100
1.000
10.000
BUCK1 Output Current : Iout [A]
Figure 6. BUCK1 – Efficiency
(Auto Mode)
0.010
0.100
1.000
BUCK1 Output Curent : Io [A]
Figure 7. BUCK1 – Efficiency
(PWM Mode / PFM Mode)
VBAT=4.2V, Vout=1.2V, Ta=25°C
100
90
90
80
80
BUCK2 Efficiency : η [%]
BUCK2 Efficiency : η [%]
VBAT=4.2V, Vout=1.2V, Ta=25°C
100
70
60
50
40
30
PFM Mode
70
60
50
PWM Mode
40
30
20
20
10
10
0
0.001
10.000
0
0.010
0.100
BUCK2 Output Current : Iout [A]
1.000
0.001
Figure 8. BUCK2 – Efficiency
(Auto Mode)
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0.010
0.100
BUCK2 Output Current : Iout [A]
1.000
Figure 9. BUCK2 – Efficiency
(PWM Mode / PFM Mode)
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BD71805MWV
Efficiency Curves of bucks - continued
VBAT=4.2V, Vout=3.3V, Ta=25°C
100
90
90
80
80
PFM Mode
BUCK3 Efficiency : η [%]
BUCK3 Efficiency : η [%]
VBAT=4.2V, Vout=3.3V, Ta=25°C
100
70
60
50
40
30
70
PWM Mode
60
50
40
30
20
20
10
10
0
0
0.001
0.010
0.100
BUCK3 Output Current : Iout [A]
1.000
0.001
Figure 10. BUCK3 – Efficiency
(Auto Mode)
1.000
Figure 11. BUCK3 – Efficiency
(PWM Mode / PFM Mode)
VBAT=4.2V, Vout=1.8V, Ta=25°C
100
0.010
0.100
BUCK3 Output Current : Iout [A]
VBAT=4.2V, Vout=1.8V, Ta=25°C
100
90
80
80
BUCK4 Efficiency : η [%]
BUCK4 Efficiency : η [%]
PFM Mode
90
70
60
50
40
30
70
60
PWM Mode
50
40
30
20
20
10
10
0
0.001
0
0.010
0.100
1.000
0.001
BUCK4 Output Current : Iout [A]
Figure 12. BUCK4 – Efficiency
(Auto Mode)
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0.010
0.100
BUCK4 Output Current : Iout [A]
1.000
Figure 13. BUCK4 – Efficiency
(PWM Mode / PFM Mode)
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BD71805MWV
2. Power ON/OFF Sequence
(1) Master Control Mode
DCIN
DCIN
VBAT
iMX6
VOSNVS=3V
Battery
VSYS
VIN
SNVS_IN
VDD_ARM_IN, VDD_SOC_IN, VDD_PU_IN
BUCK1=1.425V
BUCK2=1.200V
NVCC_DRAM, LPDDR2_1V2_power
BUCK3=3.300V
VDD_HIGH_IN, NVCC_3V3_IN, NVCC_3V3IO, EPD_3V3, oters
SNVSCAP
BUCK4=1.800V
NVCC_1V8_I/O
LDO1=1.200V
NVCC_1P2
LDO2=3.300V
BD71805
LDO3=1.200V
INTB
POR
STANDBY
INTB
POR
STANDBY
SCL
SCL
MSSEL
SDA
SDA
RESETIN
PWRON
BUCK3
SW2
SW1
PWR_KEY_INT#
Battery
VSYS
UVLO
SNVSCAP
Trtc
Tfs
CLK32KOUT
more than 0.2 sec
Count by PMIC
Coulomb counter_EN
PWRON
0.2sec
RESTARTEN
(Resister)
Controled by iMX6
From iMX6
Standby
mode
STANDBY
Controled by iMX6
When T0 is less than 400 msec.,
Power ON sequence doesn’t start.
T0
T1
VOSNVS(3.0V)
for SNVS_IN
T2
BUCK1 (1.425V)
for VDD_ARM, VDD_PU, VDD_SOC
T3
BUCK2 (1.2V)
for NVCC_DRAM, LPDDR2(1.2V), others
T4
BUCK3 (3.3V)
for VDD_HIGH_IN, NVCC33_IO, Wifi, eMMC
others
T5
BUCK4 (1.8V)
for NVCC18_IO, LPDDR2(1.8V), others
T6
LDO1 (1.2V)
for NVCC_1P2V
LDO2 (3.3V)
for IO(default:off)
LDO3 (3.3V)
for IO(default:off)
VODVREF (DVREFIN*0.5 V)
T10
for DDR-VREF
T7
POR
Power state
Shut
down
ON
sequence
OFF
ON
Disable
I2C_EN
Standby
ON
Enable
OFF
sequence
Shut
down
OFF
Disable
Figure 14. Power-ON/OFF Sequence (Master control mode)
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BD71805MWV
SW1
SW2
(2) Slave Control Mode
Figure 15. Power-ON/OFF Sequence (Slave control mode)
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BD71805MWV
3. Over Voltage Protection (OVP) Block
Features
・ Single-input for the battery charger source: DCIN
・ 30V over voltage protection for DCIN input.
4. Battery Charger Block
Features
・ Supports battery insertion and removal detection
・ JEITA compliant Battery Charging Profile with thermal control of charging current and voltage settings. This is achieved
by measuring the temperature from the external thermistor (The Initial setting of BD71805MWV is adjusted to TDK
NTCG163JF103FT1S).
・ Supports battery supplement mode
・ Automatic or manual (software) control of Watch Dog Timer while Pre–charging and Fast-charging
・ Charger statuses or Error conditions are indicated on CHGLED output (for LED lighting)
VBAT
IBAT
VBATCHG
IFST
Battery Voltage
Charge Current
VPRE_HI
VPRE_LO
IPRE
ITRI
IFST_TERM
(CC)
Trickle Charge
Pre Charge
(CV)
Fast Charge
Time
Top Off
15[S]
DONE
Figure 16. Battery Charger Output Control
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BD71805MWV
5. Coulomb Counter Block
BATTP
15-bit
∆Σ-ADC
15
28-bit
Accumulator
BATTM
Interrupt
& Alarm
Control
INTB
Figure 17. Coulomb Counter Block Diagram
Features
・ 28-bit Coulomb Counter for battery fuel gauging
・ 15-bit ∆Σ-ADC measures the battery’s charge and discharge current by means of an external current sense resistor
(10mΩ, ±1%).
・ Charging/Discharging amount integration period : 1sec
・ Coulomb Counter value approaches the battery capacity when finished charging.
・ While discharging, a Half-capacity alarm and a Near-empty alarm can be output from INTB terminal
6. 12-bit ADC (SAR) Block
Features
・ 12-bit Successive Approximation Register A/D Converter
・ Conversion period: 40µs
・ Input Voltage range: 0.6 to 5.4V (VBAT for Battery voltage monitor)
・ Input Voltage range: 0.6 to 5.4V (VSYS for System input voltage monitor)
・ Input Voltage range: 0.2 to 1.3V (Vf for BD71805MWV die temperature monitor)
・ Input Voltage range: 0.2 to 1.3V (TS for Battery temperature monitor)
・ Input Voltage range: -30m to 30mV (BATTP for Battery current monitor)
・ Input Voltage range : 2 to 16V (DCIN for DCIN voltage monitor)
Figure 18. 12-bit ADC Block Diagram
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7. Real Time Clock (RTC) Block
Features
・ RTC is driven by 32.768 kHz oscillator and provides alarm and time keeping functions to the nearest second.
・ Time information in seconds, minutes, and hours.
・ Calendar information in day, month, year, and day of the week.
・ Alarm interrupt sent at the time and day which are programmed into registers.
・ Key status flags retained through reset and power cycle in RTC backup flags, e.g., reason for power-on or power-off
・ Eight bit registers have values that are retained even after the main battery resets to zero when transitioning or until
SHUTDOWN state.
・ Eight bit registers have a lock control that once written will lock the resistor until SHUTDOWN state is entered.
・ Leap year compensation up to 2099.
・ Selectable 12-hour and 24-hour modes.
・ RTC calibration support.
・ Oscillator failure detection.
・ 32.768 kHz crystal oscillator recommends SEIKO EPSON FC-135.
When above-mentioned crystal FC-135 is used, input capacitance (Cin) value and output capacitance (Cout) value
recommend 18pF. When different crystal is used, please set Cin and Cout capacitance value on enough matching
validation.
・ 32.768 kHz crystal oscillator is affected by PCB pattern, parasitic capacitance, the disturbance. To reduce the
above-mentioned influence, please place 32.768 kHz crystal connected between XIN32K terminal and XOUT32K
terminals and XIN32K input capacitance (Cin) and XOUT32K output capacitance (Cout) to the IC as close as possible.
In PCB pattern design, please be careful about the interference with other signal lines.
Figure 19. RTC Block Diagram
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BD71805MWV
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Maximum Supply Voltage 1
DCIN
VDCINMAX
30
V
Maximum Supply Voltage 2
VIN, PVIN1,2,3,4,
VINL1, VINL2
VINMAX
PVINMAX
VINL1MAX
VINL2MAX
6.0
V
Maximum Supply Voltage 3
DVDD
VDVDDMAX
4.5
V
Pd
4.16
W
Operating Temperature Range
Topr
-40 to +85
°C
Storage Temperature Range
Tstg
-55 to +125
°C
Power Dissipation
(Note1)
(Note 1) Derate by 41.6mW/°C when operating above Ta=25°C (w hen mounted in ROHM’s standard board 74.2x74.2x1.6tmm).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Limits
Unit
VDCIN
3.5 to 28
V
VIN
PVIN
3.3 to 5.5
V
Input Voltage Range 3
VINL1, VINL2
VINL1
VINL2
2.6 to 5.5
V
Input Voltage Range 4
DVDD
VDVDD
1.5 to 3.4
V
Input Voltage Range 1
DCIN
Input Voltage Range 2
VIN, PVIN1,2,3,4
(Note2)
(Note2) It is necessary to supply the same voltage to VIN, and PVIN1,2,3,4
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
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BD71805MWV
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 74.2mm x 74.2mm x 1.6tmm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 20. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over-current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD71805MWV
Ordering Information
B
D
7
1
8
Part Number
0
5
M
W
V
-
E2
Package
UQFN64MV8080
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UQFN64MV8080 (TOP VIEW)
Part Number Marking
BD71805
LOT Number
1PIN MARK
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BD71805MWV
Physical Dimension, Tape and Reel Information
Package Name
UQFN64MV8080
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
1000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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BD71805MWV
Revision History
Date
Revision
2.July.2015
001
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Changes
Initial Release
21/21
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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