MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DSN2, 1.0x0.6, 0.575P, (0402) CASE 152AC−01 ISSUE C DATE 03 JAN 2011 SCALE 8:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.05 C A B D DIM A A1 b D E L L2 L3 E 0.05 C TOP VIEW 0.05 C A 0.05 C A1 C SIDE VIEW MILLIMETERS MIN MAX 0.25 0.31 −−− 0.05 0.45 0.55 1.00 BSC 0.60 BSC 0.85 0.95 0.35 0.45 0.20 0.30 GENERIC MARKING DIAGRAM* SEATING PLANE PIN 1 XXXX YYY 0.05 C A B L L/2 XXXX YYY b 1 0.05 C A B L2 L3 BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. CATHODE BAND MONTH CODING RECOMMENDED SOLDER FOOTPRINT* DEC 1.20 SEP 0.47 JUN PIN 1 0.60 0.60 DIMENSIONS: MILLIMETERS See Application Note AND8464/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON40464E = Specific Device Code = Year Code MAR FEB JAN NOV OCT XXXX YYY XXXX Y09 DEVICE CODE YEAR CODE (EXAMPLE) INDICATES AUG 2009 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DSN2, 1.0X0.6, 0.575P, (0402) 1 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON40464E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE. 09 JUN 2009 A CHANGED B DIMENSION MIN AND MAX TO 0.45, 0.55. REQ. BY D. TRUHITTE. 21 JUL 2009 B ADDED PIN 1 DESIGNATOR TO SOLDER FOOTPRINT. REQ. BY E. ROMERO. 18 MAR 2010 C CHANGED APPLICATION NOTE REFERENCE IN SOLDER FOOTPRINT NOTE TO AND8464/D. REQ. BY S. SHACKELL. 03 JAN 2011 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2011 January, 2011 − Rev. 01C Case Outline Number: 152AC