PDIP28, 600 mils

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP−28, 600 mils
CASE 646AE−01
ISSUE A
DATE 18 MAR 2009
SYMBOL
MIN
NOM
A
E1 E
D
6.35
A1
0.39
A2
3.18
4.95
b
0.36
0.55
b1
0.77
1.77
c
0.21
0.38
D
35.10
39.70
E
15.24
15.87
E1
12.32
14.73
e
TOP VIEW
A2
A1
b1
e
MAX
2.54 BSC
eB
15.24
17.78
L
2.93
5.08
A
L
b
c
eB
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MS-011.
DOCUMENT NUMBER:
STATUS:
98AON34197E
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
PDIP−28, 600 MILS
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON34197E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM POD #PDIP28−043−02 TO ON
SEMICONDUCTOR. REQ. BY B. BERGMAN.
19 DEC 2008
A
CORRECTED DESCRIPTION FROM 300 MILS TO 600 MILS AND ADDED PIN ONE
IDENTIFIER.
18 MAR 2009
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 01A
Case Outline Number:
646AE