EIAJ 8 STN NPG

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
Nickel‐Palladium‐Gold (Ni‐Pd‐Au)
RoHS Compliant
e4
Green Compliant
Amkor Philippines
REACH Compliant
STN
Yes
Yes
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Gold (Au)
7440‐57‐5
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
29690‐82‐2
Proprietary
1333‐86‐4
Nickel (Ni)
Palladium (Pd)
Gold (Au)
7440‐02‐0
7440‐05‐3
7440‐57‐5
Sub‐Total
Total
Weight (mg)
24.169
0.596
0.025
0.025
24.814
2.710
2.710
0.147
0.012
0.012
0.010
0.009
0.005
0.005
0.001
0.201
0.055
0.055
81.300
7.330
3.046
3.046
0.476
95.199
0.439
0.031
0.004
0.473
123.452
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
85.4
854000
7.7
77000
3.2
32000
3.2
32000
0.5
5000
100.0
1000000
92.7
927000
6.5
65000
0.8
8000
100.0
1000000
Package
Percentage
ppm
19.58
195777
0.48
4824
0.02
201
0.02
201
20.10
201003
2.19
21949
2.19
21949
0.12
1189
0.01
98
0.01
98
0.01
85
0.01
75
0.00
37
0.00
37
0.00
8
0.16
1627
0.04
445
0.04
445
65.86
658556
5.94
59378
2.47
24677
2.47
24677
0.39
3856
77.11
771143
0.36
3554
0.02
249
0.00
31
0.38
3833
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this
declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract
or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
February 29, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
Nickel‐Palladium‐Gold (Ni‐Pd‐Au)
RoHS Compliant
e4
Green Compliant
Amkor Philippines
REACH Compliant
STN
Yes
Yes
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Gold (Au)
7440‐57‐5
Silica Fused
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
1333‐86‐4
Nickel (Ni)
Palladium (Pd)
Gold (Au)
7440‐02‐0
7440‐05‐3
7440‐57‐5
Sub‐Total
Total
Weight (mg)
24.169
0.596
0.025
0.025
24.814
2.710
2.710
0.147
0.012
0.012
0.010
0.009
0.005
0.005
0.001
0.201
0.055
0.055
85.679
3.427
3.427
2.475
0.190
95.199
0.439
0.031
0.004
0.473
123.452
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
90.0
900000
3.6
36000
3.6
36000
2.6
26000
0.2
2000
100.0
1000000
92.7
927000
6.5
65000
0.8
8000
100.0
1000000
Package
Percentage
ppm
19.58
195777
0.48
4824
0.02
201
0.02
201
20.10
201003
2.19
21949
2.19
21949
0.12
1189
0.01
98
0.01
98
0.01
85
0.01
75
0.00
37
0.00
37
0.00
8
0.16
1627
0.04
445
0.04
445
69.40
694029
2.78
27761
2.78
27761
2.00
20050
0.15
1542
77.11
771143
0.36
3554
0.02
249
0.00
31
0.38
3833
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this
declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract
or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
February 29, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ)
8S2
GPC
Nickel‐Palladium‐Gold (Ni‐Pd‐Au)
RoHS Compliant
e4
Green Compliant
Amkor Philippines
REACH Compliant
STN
Yes
Yes
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
Polyglycidyl Ester
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Copper Oxide
gamma‐Butyrolactone
Poly(oxypropylene)diamine
1,4‐Bis(2,3‐epoxypropoxy)butane
7440‐22‐4
9003‐36‐5
68475‐94‐5
Proprietary
1317‐38‐0
96‐48‐0
Proprietary
2425‐79‐8
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica Fused
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon Black
60676‐86‐0
Proprietary
Proprietary
29690‐82‐2
1333‐86‐4
Nickel (Ni)
Palladium (Pd)
Gold (Au)
7440‐02‐0
7440‐05‐3
7440‐57‐5
Sub‐Total
Total
Weight (mg)
24.169
0.596
0.025
0.025
24.814
2.710
2.710
0.147
0.012
0.012
0.010
0.009
0.005
0.005
0.001
0.201
0.025
0.001
0.026
82.347
5.236
5.236
2.094
0.286
95.199
0.439
0.031
0.004
0.473
123.422
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.1
731000
6.0
60000
6.0
60000
5.2
52000
4.6
46000
2.3
23000
2.3
23000
0.5
5000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
86.5
865000
5.5
55000
5.5
55000
2.2
22000
0.3
3000
100.0
1000000
92.7
927000
6.5
65000
0.8
8000
100.0
1000000
Package
Percentage
ppm
19.58
195823
0.48
4825
0.02
201
0.02
201
20.11
201050
2.20
21954
2.20
21954
0.12
1190
0.01
98
0.01
98
0.01
85
0.01
75
0.00
37
0.00
37
0.00
8
0.16
1628
0.02
202
0.00
5
0.02
207
66.72
667197
4.24
42423
4.24
42423
1.70
16969
0.23
2314
77.13
771326
0.36
3554
0.02
249
0.00
31
0.38
3834
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this
declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract
or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
February 29, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
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