SSOP 24 TKH

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
24‐Lead, Shrink Small Outline Package (SSOP)
6.543‐5056.1‐3
GPC
TKH
Yes
Matte Tin (Sn)
RoHS Compliant
No
e3
Green Compliant
TSPIC
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol‐F Epichlorhydrin Resin
1,4‐Bis(2,3‐epoxypropoxy)butane
Dapsone
7440‐22‐4
9003‐36‐5
2425‐79‐8
80‐08‐0
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Fused Silica
Epoxy Resin
Phenol Resin
Antimony Trioxide
Brominated Epoxy Resin
Carbon Black
60676‐86‐0
29690‐82‐2
9003‐35‐4
1309‐64‐4
40039‐93‐8
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
34.755
0.856
0.036
0.036
35.683
7.154
7.154
0.339
0.068
0.034
0.014
0.455
0.707
0.707
0.181
0.181
55.811
14.314
3.502
1.142
1.142
0.228
76.141
2.553
2.553
122.873
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
74.6
746000
14.9
149000
7.5
75000
3.0
30000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
73.3
733000
18.8
188000
4.6
46000
1.5
15000
1.5
15000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
28.29
282853
0.70
6970
0.03
290
0.03
290
29.04
290403
5.82
58219
5.82
58219
0.28
2762
0.06
552
0.03
278
0.01
111
0.37
3702
0.58
5756
0.58
5756
0.15
1474
0.15
1474
45.42
454215
11.65
116497
2.85
28505
0.93
9295
0.93
9295
0.19
1859
61.97
619666
2.08
20779
2.08
20779
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided
by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
August 24, 2015
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.