TSOP 28 TBB

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
28‐Lead, 8 x 13.4 mm, Plastic Thin Small Outline Package, Type I (TSOP)
28T
GPC
TBB
Yes
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Lingsen
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
7440‐22‐4
9003‐36‐5
3101‐60‐8
112‐07‐2
92‐88‐6
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous) A
Silica (Amorphous) B
Epoxy Resin
Phenol Resin
Carbon Black
60676‐86‐0
7631‐86‐9
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
45.905
1.432
0.286
0.095
47.718
7.645
7.645
0.376
0.102
0.034
0.004
0.004
0.002
0.522
0.770
0.770
0.311
0.311
119.701
24.390
15.741
12.282
0.865
172.979
2.159
2.159
232.104
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
72.1
721000
19.5
195000
6.5
65000
0.8
8000
0.8
8000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
69.2
692000
14.1
141000
9.1
91000
7.1
71000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
19.78
197777
0.62
6168
0.12
1234
0.04
411
20.56
205589
3.29
32936
3.29
32936
0.16
1621
0.04
439
0.01
146
0.00
18
0.00
18
0.00
7
0.22
2249
0.33
3318
0.33
3318
0.13
1341
0.13
1341
51.57
515724
10.51
105083
6.78
67819
5.29
52914
0.37
3726
74.53
745266
0.93
9301
0.93
9301
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted
chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary
and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users
of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless
otherwise provided by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 19, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury
(Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP),
Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for
Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09%
(900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine
(Cl) in any homogeneous material.