Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2016 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product BU) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6 7. Temperature Humidity Bias & HAST 7 8. Steam Pressure Pot 8 9. Failure Rate Calculations 9 10. Definitions 10 RELIABILITY MONITOR Reliability Monitor Report Date: January 29th, 2016 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 3 FITS (1,819,008 device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 7 FITS (1,175,500 device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 1,400 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 2.096M device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 240 units) RELIABILITY MONITOR 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR ASIC 4 LAST 4Q 0 45 0 45 0 45 0 MEMORY 4 LAST 4Q 0 0 350 350 0 0 350 350 0 0 80 80 MCU 4 LAST 4Q 0 0 7,121 8,337 0 0 1,420 2,636 0 0 RFA 4 LAST 4Q 0 4,820 0 462 4 LAST 4Q 0 0 7,471 13,552 0 0 1,770 3,493 ATMEL Device-Hours* WAF EFR PPM FITS 45 45,000 213 0 95 0 0 80 80 125,360 125,360 193 193 0 0 38 38 1,420 2,636 0 0 1,420 1,955 1,693,648 2,569,148 193 199 0 0 3 2 0 462 0 462 671,184 193 0 7 0 0 1,500 3,223 0 0 1,500 2,542 1,819,008 3,410,692 193 198 0 0 3 1 RELIABILITY MONITOR 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR Device-Hours* WAF EFR PPM FITS 92K 4 LAST 4Q 0 0 330 330 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 92,000 92,000 193 193 0 0 52 52 75K 4 LAST 4Q 0 1,829 0 363 0 363 0 363 0 0 433,368 203 0 10 4 LAST 4Q 0 798 0 798 0 798 0 157 0 0 477,500 213 0 9 66K 4 LAST 4Q 0 0 888 888 0 0 79 79 0 0 79 79 0 0 79 79 0 0 0 0 117,832 117,832 193 0 40 #DIV/0! 65K 4 LAST 4Q 0 0 5,173 5,173 0 0 781 781 0 0 781 781 0 0 781 781 0 0 0 0 991,816 991,816 193 193 0 0 5 5 59.9K 4 LAST 4Q 0 40 0 40 0 40 0 0 0 0 20,000 213 0 215 59K 4 LAST 4Q 0 0 400 480 0 0 400 480 0 0 400 480 0 0 400 480 0 0 0 0 400,000 480,000 193 193 0 0 12 10 58.97K 4 LAST 4Q 0 1,600 0 154 0 154 0 154 0 0 223,408 193 0 21 58.8K 4 LAST 4Q 0 0 330 419 0 0 80 169 0 0 80 169 0 0 80 169 0 0 0 0 92,000 181,000 193 203 0 0 52 25 46K 4 LAST 4Q 0 0 270 270 0 0 270 270 0 0 0 0 0 0 0 0 0 0 0 0 45,360 45,360 193 0 105 #DIV/0! 45.2K 4 LAST 4Q 0 1,600 0 154 0 154 0 154 0 0 223,408 193 0 21 35.9K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 80,000 80,000 193 193 0 0 59 59 19.6K 4 LAST 4Q 0 45 0 45 0 45 0 45 0 0 45,000 213 0 95 4 LAST 4Q 0 0 7,471 13,552 0 0 1,770 3,493 0 0 1,500 3,223 0 0 1,500 2,542 0 0 0 0 1,819,008 3,410,692 193 197 0 0 3 1 66.2K ATMEL RELIABILITY MONITOR 3 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR ASIC 4 LAST 4Q 0 74 0 74 0 MEMORY 4 LAST 4Q 0 0 80 80 0 0 80 80 MCU 4 LAST 4Q 0 0 2,271 4,631 0 0 RFA 4 LAST 4Q 0 302 4 LAST 4Q 0 0 2,351 5,087 ATMEL Device-Hours AF FITS 0 37,000 117 212 0 0 0 0 40,000 40,000 117 117 196 196 2,271 4,631 0 0 0 995 1,135,500 2,813,000 117 117 7 3 0 302 0 302 302,000 117 26 0 0 2,351 5,087 0 0 0 1,297 1,175,500 3,192,000 117 117 7 2 RELIABILITY MONITOR 4 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 92K 4 LAST 4Q 0 160 0 160 0 160 160,000 117 49 4 LAST 4Q 0 205 0 205 0 205 205,000 117 38 66K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 0 0 40,000 40,000 117 117 196 196 65K 4 LAST 4Q 0 0 711 711 0 0 711 711 0 0 0 0 355,500 355,500 117 117 22 22 62.2K 4 LAST 4Q 0 80 0 80 0 80 80,000 117 98 4 LAST 4Q 0 40 0 40 0 0 20,000 117 392 59K 4 LAST 4Q 0 0 800 1,360 0 0 800 1,360 0 0 0 560 400,000 960,000 117 117 20 8 58.97K 4 LAST 4Q 0 90 0 90 0 90 90,000 117 87 58.8K 4 LAST 4Q 0 0 80 160 0 0 80 160 0 0 0 0 40,000 80,000 117 117 196 98 45.2K 4 LAST 4Q 0 122 0 122 0 122 122,000 117 64 35.9K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 0 0 40,000 40,000 117 117 196 196 35.4K 4 LAST 4Q 0 0 600 925 0 0 600 925 0 0 0 80 300,000 502,500 117 117 26 16 19.6K 4 LAST 4Q 0 1,074 0 1,074 0 0 537,000 117 15 4 LAST 4Q 0 0 2,351 5,087 0 0 2,351 5,087 0 0 0 1,297 1,175,500 3,192,000 117 117 7 2 75 59.9K ATMEL RELIABILITY MONITOR Device-Hours AF FITS 5 Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR CBGA 4 LAST 4Q 0 80 0 80 0 80 0 0 0.00% 4 LAST 4Q 0 80 0 80 0 80 0 0 0.00% MLF / QFN 4 LAST 4Q 0 0 1,160 2,305 0 0 1,160 2,305 0 0 1,160 2,305 0 0 1,080 2,025 0.00% 0.00% PDIP 4 LAST 4Q 0 1,250 0 1,250 0 1,250 0 1,080 0.00% 4 LAST 4Q 0 257 0 257 0 257 0 77 0.00% 4 LAST 4Q 0 80 0 80 0 80 0 0 0.00% TQFP 4 LAST 4Q 0 0 240 400 0 0 240 400 0 0 240 400 0 0 240 400 0.00% 0.00% ATMEL 4 LAST 4Q 0 0 1,400 4,452 0 0 1,400 4,452 0 0 1,400 4,452 0 0 1,320 3,582 0.00% 0.00% LQFP SOIC TFBGA RELIABILITY MONITOR % Defective 6 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 96 Hours REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CBGA 4 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 808 1,923 1,616,000 3,846,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 250 500,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 247 494,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 240 400 480,000 800,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1,048 3,060 2,096,000 6,120,000 0.00% 0.00% LQFP MLF / QFN PDIP SOIC TQFP TFBGA ATMEL RELIABILITY MONITOR Device-Hours* % Defective 7 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR MLF / QFN 4 LAST 4Q 0 0 160 160 0 0 160 160 0 0 160 160 0.0% 0.0% PDIP 4 LAST 4Q 0 80 0 80 0 80 0.0% TQFP 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0.0% 0.0% ATMEL 4 LAST 4Q 0 0 240 320 0 0 240 320 0 0 240 320 0.00% 0.00% RELIABILITY MONITOR % Defective 8 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR 9 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR 10