Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2014 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product BU) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6 7. Temperature Humidity Bias & HAST 7 8. Steam Pressure Pot 8 9. Failure Rate Calculations 9 10. Definitions 10 RELIABILITY MONITOR Reliability Monitor Report Date: May 5, 2014 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) ✓ Failure Rate: 14 FITS (270,296 device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) ✓ Failure Rate: 14 FITS (556K device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * ✓ Failure Rate: 0.00% (0 failures out of 480 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * ✓ Failure Rate: 0.00% (0 failures out of 960K device-hours) ✓ Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * ✓ Failure Rate: 0.00% (0 failures out of 160 units) RELIABILITY MONITOR 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR MCU 4 LAST 4Q 0 0 891 1,879 0 0 239 787 0 0 239 787 0 0 RFA 4 LAST 4Q 0 2,785 0 385 0 385 4 LAST 4Q 0 0 891 4,664 0 0 239 1,172 0 0 239 1,172 ATMEL Device-Hours* WAF EFR PPM FITS 239 787 270,296 880,712 236 236 0 0 14 4 0 385 500,200 119 0 15 0 0 239 1,172 270,296 1,380,912 236 194 0 0 14 3 RELIABILITY MONITOR 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR Device-Hours* WAF EFR PPM FITS UHF6 4 LAST 4Q 0 800 0 0 0 0 0 0 38,400 142 0 168 4 LAST 4Q 0 877 0 77 0 77 0 77 115,400 117 0 68 4 LAST 4Q 0 80 0 80 0 80 0 80 80,000 236 0 49 4 LAST 4Q 0 69 0 69 0 69 0 69 69,000 236 0 56 58K 4 LAST 4Q 0 0 79 158 0 0 79 158 0 0 79 158 0 0 79 158 79,000 158,000 236 236 0 0 49 25 45.5K 4 LAST 4Q 0 77 0 77 0 77 0 77 77,000 117 0 102 4 LAST 4Q 0 77 0 77 0 77 0 77 77,000 117 0 102 4 LAST 4Q 0 77 0 77 0 77 0 77 77,000 117 0 102 37K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 236 236 0 0 49 49 35.9K 4 LAST 4Q 0 300 0 80 0 80 0 80 90,560 236 0 43 35.4K 4 LAST 4Q 0 0 732 2,069 0 0 80 397 0 0 80 397 0 0 80 397 111,296 477,256 236 207 0 0 35 9 ATMEL 4 LAST 4Q 0 0 891 4,664 0 0 239 1,172 0 0 239 1,172 0 0 239 1,172 270,296 1,339,616 236 192 0 0 14 4 75K 66K 63K 45.2K 40K RELIABILITY MONITOR 3 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR MCU 4 LAST 4Q 0 0 556 1,433 0 0 556 1,433 0 0 ATMEL 4 LAST 4Q 0 0 556 1,433 0 0 556 1,433 0 0 RELIABILITY MONITOR Device-Hours AF FITS 556 1,433 556,000 1,433,000 117 117 14 5 556 1,433 556,000 1,433,000 117 117 14 5 4 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 66K 4 LAST 4Q 0 0 80 240 0 0 80 240 0 0 80 240 80,000 240,000 117 117 98 33 63 K 4 LAST 4Q 0 77 0 77 0 77 77,000 117 102 58K 4 LAST 4Q 0 0 76 156 0 0 76 156 0 0 76 156 76,000 156,000 117 117 103 50 56K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 37K 4 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 35.9K 4 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 80,000 160,000 117 117 98 49 35.4K 4 LAST 4Q 0 0 160 560 0 0 160 560 0 0 160 560 160,000 560,000 117 117 49 14 35K 4 LAST 4Q 0 80 0 80 0 80 80,000 117 98 4 LAST 4Q 0 0 556 1,433 0 0 556 1,433 0 0 556 1,433 556,000 1,433,000 117 117 14 5 ATMEL RELIABILITY MONITOR Device-Hours AF FITS 5 Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR MLF / QFN 4 LAST 4Q 0 0 160 319 0 0 160 319 0 0 160 319 0 0 160 319 0.00% 0.00% PDIP 4 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 0 0 80 160 0.00% 0.00% SOIC 4 LAST 4Q 0 0 160 319 0 0 160 319 0 0 160 319 0 0 160 319 0.00% 0.00% TQFP 4 LAST 4Q 0 0 80 320 0 0 80 320 0 0 80 320 0 0 80 320 0.00% 0.00% ATMEL 4 LAST 4Q 0 0 480 1,118 0 0 480 1,118 0 0 480 1,118 0 0 480 1,118 0.00% 0.00% RELIABILITY MONITOR % Defective 6 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR MLF / QFN 4 LAST 4Q 0 0 0 0 0 0 0 0 160 472 320,000 944,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 160 320 320,000 640,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 80 320 160,000 640,000 0.00% 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 480 1,346 960,000 2,692,000 0.00% 0.00% SOIC TQFP ATMEL RELIABILITY MONITOR 7 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR MLF / QFN 4 LAST 4Q 0 160 0 160 0 160 0.0% PDIP 4 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 0.0% 0.0% SOIC 4 LAST 4Q 0 0 80 240 0 0 80 240 0 0 80 240 0.0% 0.0% TQFP 4 LAST 4Q 0 80 0 80 0 80 0.0% 4 LAST 4Q 0 0 160 640 0 0 160 640 0 0 160 640 0.00% 0.00% ATMEL RELIABILITY MONITOR % Defective 8 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR 9 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR 10