Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Fourth QUARTER 2012 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Failure Rate Calculations 10 10. Definitions 11 RELIABILITY MONITOR REPORT Reliability Monitor Report Date: Oct 16, 2013 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) ✓ Failure Rate: 6 FITS (753,260 device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) ✓ Failure Rate: 33 FITS (240K device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * ✓ Failure Rate: 0.00% (0 failures out of 240 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * ✓ Failure Rate: 0.00% (0 failures out of 2,174K device-hours) ✓ Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * ✓ Failure Rate: 0.00% (0 failures out of 240 units) RELIABILITY MONITOR REPORT * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR APG 3 LAST 4Q 0 164 0 164 0 164 0 3 LAST 4Q 0 500 0 500 0 500 MEMORY 3 LAST 4Q 0 0 300 1,491 0 0 80 640 0 0 MCU 3 LAST 4Q 0 0 77 4,935 0 0 77 961 RFA 3 LAST 4Q 0 0 2,513 10,094 0 0 ATMEL 3 LAST 4Q 0 0 2,890 17,184 0 0 ASIC Device-Hours* WAF EFR PPM FITS 164 164,000 23 0 246 0 300 400,000 18 0 129 80 640 0 0 80 639 90,560 680,348 236 82 0 0 43 16 0 0 77 782 0 0 77 308 77,000 765,824 117 51 0 0 102 23 613 2,991 0 0 613 2,991 0 0 228 1,689 585,700 2,754,944 192 137 0 0 8 2 770 5,256 0 0 770 5,077 0 0 385 3,100 753,260 4,765,116 189 101 0 0 6 2 RELIABILITY MONITOR REPORT 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR Device-Hours* WAF EFR PPM FITS UHF6 3 LAST 4Q 0 153 0 153 0 153 0 0 76,500 42 0 287 UHF5 3 LAST 4Q 0 0 800 800 0 0 0 0 0 0 0 0 0 0 0 0 38,400 38,400 117 117 0 0 204 204 UHF 3 LAST 4Q 0 77 0 77 0 77 0 77 77,000 52 0 102 230 3 LAST 4Q 0 77 0 77 0 77 0 0 38,500 117 0 203 SAC2NV 3 LAST 4Q 0 0 154 231 0 0 154 231 0 0 154 231 0 0 0 77 77,000 154,000 117 79 0 0 102 75 SIGE1 3 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 0 0 38,500 38,500 206 206 0 0 116 116 IL4-12KC_PC 3 LAST 4Q 0 77 0 77 0 77 0 77 77,000 42 0 285 3 LAST 4Q 0 157 0 157 0 157 0 157 157,000 6 0 987 3 LAST 4Q 0 76 0 76 0 76 0 0 38,000 3 0 9,538 3 LAST 4Q 0 73 0 73 0 73 0 73 73,000 96 0 130 75K 3 LAST 4Q 0 0 154 2,044 0 0 154 764 0 0 154 764 0 0 154 692 154,000 789,440 392 293 0 0 15 4 63K 3 LAST 4Q 0 0 300 899 0 0 80 240 0 0 80 240 0 0 80 240 90,560 271,632 236 135 0 0 43 25 58K 3 LAST 4Q 0 728 0 256 0 77 0 0 91,228 3 0 3,357 3 LAST 4Q 0 245 0 245 0 245 0 200 222,500 21 0 199 3 LAST 4Q 0 210 0 210 0 210 0 100 155,000 16 0 376 3 LAST 4Q 0 164 0 164 0 164 0 164 164,000 23 0 246 3 LAST 4Q 0 154 0 154 0 154 0 0 77,000 142 0 84 3 LAST 4Q 0 0 74 151 0 0 74 151 0 0 74 151 0 0 74 151 148,000 225,000 117 110 0 0 53 37 SCMOS3 BD1-2_P BCDMOS 77K 57K 56K 46K 45.6K 45.5K RELIABILITY MONITOR REPORT 3 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 45.2K 3 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 45.1 K 3 LAST 4Q 0 77 0 77 0 77 40.2K 3 LAST 4Q 0 0 77 154 0 0 77 154 0 0 40.1K 3 LAST 4Q 0 0 1,100 1,100 0 0 0 0 40K 3 LAST 4Q 0 554 0 3 LAST 4Q 0 3,754 35.4K 3 LAST 4Q 0 0 35K 3 LAST 4Q 38.6 K 34K ATMEL Device-Hours* WAF EFR PPM FITS 0 0 38,500 38,500 104 104 0 0 228 228 0 0 38,500 42 0 571 77 154 0 0 0 0 38,500 77,000 104 111 0 0 228 108 0 0 0 0 0 0 0 0 52,800 52,800 97 97 0 0 180 180 154 0 154 0 154 173,200 117 0 45 0 231 0 231 0 231 400,104 55 0 41 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 117 117 0 0 102 102 0 4,706 0 1,204 0 1,204 0 531 1,035,596 44 0 20 3 LAST 4Q 0 292 0 100 0 100 0 99 108,716 42 0 202 3 LAST 4Q 0 0 2,890 17,184 0 0 770 5,256 0 0 770 5,077 0 0 385 3,100 753,260 4,765,116 189 101 0 0 6 2 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR REPORT 4 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours AF FITS MEMORY 3 LAST 4Q 0 0 160 557 0 0 160 557 0 0 160 557 160,000 557,000 117 117 49 14 MCU 3 LAST 4Q 0 0 80 945 0 0 80 865 0 0 80 785 80,000 838,440 117 117 98 9 ATMEL 3 LAST 4Q 0 0 240 1,502 0 0 240 1,422 0 0 240 1,342 240,000 1,395,440 117 117 33 6 RELIABILITY MONITOR REPORT 5 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 63 K 3 LAST 4Q 0 0 160 400 0 0 160 400 0 0 160 400 160,000 400,000 117 117 49 20 58K 3 LAST 4Q 0 157 0 77 0 77 90,440 117 87 3 LAST 4Q 0 80 0 80 0 80 80,000 117 98 35K 3 LAST 4Q 0 0 80 708 0 0 80 708 0 0 80 628 80,000 668,000 117 117 98 12 34K 3 LAST 4Q 0 157 0 157 0 157 157,000 117 50 3 LAST 4Q 0 0 240 1,502 0 0 240 1,422 0 0 240 1,342 240,000 1,395,440 117 117 33 6 37K ATMEL Device-Hours AF RELIABILITY MONITOR REPORT 6 FITS Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR BGA 3 LAST 4Q 0 80 0 80 0 80 0 80 0.00% 3 LAST 4Q 0 79 0 79 0 79 0 79 0.00% MLF / QFN 3 LAST 4Q 0 0 80 157 0 0 80 152 0 0 80 80 0 0 80 80 0.00% 0.00% PDIP 3 LAST 4Q 0 237 0 237 0 237 0 237 0.00% SOIC 3 LAST 4Q 0 0 160 400 0 0 160 400 0 0 160 400 0 0 160 400 0.00% 0.00% TQFP 3 LAST 4Q 0 231 0 72 0 0 0 0 0.00% 3 2 1 4 LAST 4Q 0 0 0 0 0 240 320 314 310 1,184 0 0 0 0 0 240 320 232 228 1,020 0 0 0 0 0 240 320 160 156 876 0 0 0 0 0 240 320 160 156 876 0.00% 0.00% 0.00% 0.00% 0.00% LGA ATMEL RELIABILITY MONITOR REPORT % Defective 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR MLF / QFN 3 LAST 4Q 0 693 0 693 0 693 0 0 80 4,161 160,000 9,015,000 0.00% 0.00% 3 LAST 4Q 0 77 0 77 0 77 0 616 1,309,000 0.00% 3 LAST 4Q 0 308 0 308 0 154 0 0 231,000 0.00% 3 LAST 4Q 0 0 0 1,078 0 0 0 1,078 0 0 0 924 0 0 1,087 7,108 2,174,000 15,217,000 0.00% 0.00% TQFP TRANS ATMEL RELIABILITY MONITOR REPORT 8 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR BGA 3 LAST 4Q 0 80 0 80 0 80 0.0% 3 LAST 4Q 0 80 0 80 0 80 0.0% MLF / QFN 3 LAST 4Q 0 0 80 157 0 0 80 80 0 0 80 80 0.0% 0.0% PDIP 3 LAST 4Q 0 237 0 237 0 237 0.0% SOIC 3 LAST 4Q 0 0 160 400 0 0 160 400 0 0 160 400 0.0% 0.0% TQFP 3 LAST 4Q 0 220 0 0 0 0 0.0% 3 LAST 4Q 0 0 240 1,174 0 0 240 877 0 0 240 877 0.00% 0.00% LGA ATMEL RELIABILITY MONITOR REPORT % Defective 9 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR REPORT Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR REPORT 11