2007 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
First QUARTER 2008
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product BU)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
11. Technology List
10
12. Failure Rate Calculations
11
13. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
February 20, 2008
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 3 FITS (3,235K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 6 FITS (1,327K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 924 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 843K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 847 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
APG
4
LAST 4Q
0
0
632
1,040
0
0
632
1,040
0
0
259
436
0
0
259
436
321,664
537,472
40
43
0
0
71
39
ASIC
4
LAST 4Q
0
0
2,610
12,170
0
1
2,410
10,910
0
2
1,633
6,165
0
0
331
1,372
1,122,136
4,626,140
92
80
0
0
9
11
MEMORY
4
LAST 4Q
0
0
2,200
4,860
0
0
1,600
2,500
0
0
600
1,499
0
0
600
1,499
796,800
1,780,448
57
79
0
0
20
7
MCU
4
LAST 4Q
0
0
1,042
15,968
0
0
242
1,263
0
0
242
1,263
0
0
122
961
220,400
1,817,840
4
67
0
0
1,056
8
RFA
4
LAST 4Q
0
0
1,238
5,323
0
0
1,238
5,323
0
0
1,238
5,323
0
0
311
2,923
774,500
4,199,000
190
124
0
0
6
2
ATMEL
4
LAST 4Q
0
0
7,722
42,139
0
1
6,122
23,814
0
2
3,972
15,384
0
0
1,623
7,889
3,235,500
14,008,340
96
88
0
0
3
3
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
154
240,872
4
0
1,004
160
160,000
117
0
49
157
157,000
52
1,049
1,203,500
99
0
0
113
8
0
40,000
21
0
1,090
0
0
22,500
3
0
11,874
77
154
0
0
77
154
77,000
154,000
117
117
0
0
102
51
0
154
0
154
154,000
129
0
46
80
0
80
0
80
80,000
206
0
56
0
229
0
229
0
153
191,000
135
0
36
77
785
0
0
77
785
0
0
77
785
0
0
77
708
77,000
746,500
117
110
0
0
102
11
0
462
0
0
0
0
0
0
22,176
3
0
15,940
0
154
0
154
0
154
0
77
115,500
484
0
462
0
462
0
462
0
308
385,000
227
0
0
16
10
0
1,200
0
400
0
400
0
400
438,400
63
0
33
0
539
0
539
0
539
269,500
117
0
1,386
0
1,386
0
1,001
0
0
565,180
117
0
0
29
14
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
815
0
276
0
276
0
4
LAST 4Q
0
160
0
160
0
160
0
0
157
0
157
0
157
0
0
1,206
0
1,206
0
1,206
0
4
LAST 4Q
0
80
0
80
0
80
0
4
LAST 4Q
0
122
0
122
0
122
SCMOS3
4
LAST 4Q
0
0
77
154
0
0
77
154
0
0
SIGE1
4
LAST 4Q
0
154
0
154
4
LAST 4Q
0
80
0
4
LAST 4Q
0
229
BICMOS2
4
LAST 4Q
0
0
AT2F
4
LAST 4Q
Z92
UNI3
UHF
SMD
SCMOS2
SIGE2
BCDMOS
75K
63K
58.8K
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
58K
57.5K
57K
56.9K
56.8K
56K
55K
46K
44K
39K
35K
34K
19K
ATMEL
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
77
409,808
143
0
154
629,984
116
0
0
16
13
228,176
117
1,835
0
0
998,476
113
0
0
34
28
0
357
0
200
278,500
49
0
67
100
0
100
0
100
100,000
48
100
0
100
0
100
100,000
48
0
0
189
189
0
815
0
584
0
45
353,308
103
0
1,739
0
815
0
122
631,124
89
0
0
25
16
154
0
154
0
77
0
77
89,936
23
0
2,476
0
2,476
1
1,149
0
431
1,012,936
69
0
0
448
29
4
LAST 4Q
0
0
308
1,302
0
0
308
1,302
0
0
77
1,071
0
0
77,308
574,308
117
117
0
0
101
14
4
LAST 4Q
0
224
0
224
0
82
0
82
105,856
23
0
1,171
0
1,171
0
629
0
398
604,556
53
0
0
381
29
4
LAST 4Q
0
308
0
308
0
77
0
77
115,808
48
0
1,611
0
1,611
0
308
0
308
526,904
34
0
0
163
51
4
LAST 4Q
0
600
0
200
0
200
0
200
219,200
11
0
600
0
200
0
200
0
200
219,200
11
0
0
368
368
4
LAST 4Q
0
2,252
0
1,452
0
452
0
377
620,900
37
0
19,786
0
5,220
0
2,140
0
1,958
3,265,608
61
0
0
40
5
4
LAST 4Q
0
300
0
100
0
100
0
100
109,600
187
0
1,160
0
400
0
400
0
400
436,480
187
0
0
45
11
4
LAST 4Q
0
300
0
100
0
100
0
100
109,600
42
0
900
0
300
0
298
0
298
327,136
42
0
0
201
67
4
LAST 4Q
0
7,722
0
6,122
0
3,972
0
1,623
3,235,500
96
0
42,139
1
23,814
2
15,384
0
7,889
14,008,340
88
0
0
3
3
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
896
0
896
0
665
0
0
1,248
0
1,204
0
1,050
4
LAST 4Q
0
461
0
461
0
454
0
2,317
1
2,317
1
0
357
0
357
4
LAST 4Q
0
100
0
0
100
0
4
LAST 4Q
0
815
0
1,893
4
LAST 4Q
0
4
LAST 4Q
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
BU
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
ASIC
4
LAST 4Q
0
0
77
616
0
0
77
616
0
0
77
616
77,000
616,000
117
117
102
13
MEMORY
4
0
731
0
731
0
731
731,000
11
LAST 4Q
0
1,501
0
1,501
0
1,501
1,501,000
117
117
MCU
4
LAST 4Q
0
0
593
2,020
0
0
593
1,866
0
0
445
1,564
519,000
1,740,872
117
117
15
4
ATMEL
4
LAST 4Q
0
0
1,401
4,714
0
0
1,401
4,560
0
0
1,253
4,258
1,327,000
4,434,872
117
117
6
2
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
Device-Hours AF
FITS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
231
0
231
0
154
192,500
117
41
4
LAST 4Q
0
308
0
308
0
308
308,000
117
25
4
LAST 4Q
0
308
0
308
0
308
308,000
117
25
39K
4
LAST 4Q
0
0
154
231
0
0
154
231
0
0
154
231
154,000
231,000
117
117
51
34
35K
4
LAST 4Q
0
0
1,016
2,943
0
0
1,016
2,789
0
0
868
2,564
942,000
2,702,372
117
117
8
3
34K
4
LAST 4Q
0
0
77
308
0
0
77
308
0
0
77
308
77,000
308,000
117
117
102
25
56.8K
4
LAST 4Q
0
77
0
77
0
77
77,000
117
102
19K
4
LAST 4Q
0
0
77
231
0
0
77
231
0
0
77
231
77,000
231,000
117
117
102
34
58K
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
77,000
77,000
117
117
102
102
ATMEL
4
LAST 4Q
0
0
1,401
4,714
0
0
1,401
4,560
0
0
1,253
4,258
1,327,000
4,434,872
117
117
6
2
Z92
63 K
56K
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
231
0
231
0
231
0
0
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
4
LAST 4Q
0
231
0
231
0
231
0
0
0.00%
MLF / QFN
4
LAST 4Q
0
0
154
1,181
0
0
147
1,174
0
0
154
1,181
0
0
147
690
0.00%
0.00%
QFP
4
LAST 4Q
0
0
385
1,125
0
0
385
1,125
0
0
385
1,125
0
0
365
859
0.00%
0.00%
PDIP
4
LAST 4Q
0
0
77
385
0
0
77
385
0
0
77
385
0
0
77
308
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
77
539
0
0
77
539
0
0
77
539
0
0
77
385
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
154
539
0
0
154
539
0
0
154
539
0
0
154
385
0.00%
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
77
231
0
0
77
231
0
0
77
231
0
0
77
231
0.00%
0.00%
ATMEL
4
LAST 4Q
0
0
924
4,539
0
0
917
4,532
0
0
924
4,539
0
0
897
2,935
0.00%
0.00%
BCC
CASON
BGA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
HAST
Temperature Humidity Bias
Device-Hours* % Defective
168 Hours 500 Hours 1K Hours 100 Hours
500 Hours
REJ SS REJ SS REJ SS REJ SS
REJ
SS
PACKAGE
QTR
BCC
4
LAST 4Q
0
231
0
231
0
231
0
0
0
0
231,000
0.00%
4
LAST 4Q
0
231
0
231
0
231
0
0
0
0
231,000
0.00%
4
LAST 4Q
0
956
0
956
0
956
0
0
0
0
956,000
0.00%
4
LAST 4Q
0
0
385
994
0
0
385
994
0
0
68
371
0
154
0
0
226,500
990,500
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
77
308
0
0
154,000
693,000
0.00%
0.00%
4
LAST 4Q
0
187
0
187
0
0
0
0
77
385
0
0
154,000
863,500
0.00%
0.00%
4
LAST 4Q
0
151
0
151
0
77
0
0
77
231
0
0
154,000
576,000
0.00%
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
154
0
0
308,000
0.00%
77
77
0
0
154,000
154,000
0.00%
0.00%
308
1,309
0
0
0
0
842,500
5,003,000
0.00%
0.00%
BGA
MLF / QFN
QFP
PDIP
PLCC
SOIC
TSOP / VSOP
VSOP
ATMEL
4
LAST 4Q
0
0
0
0
0
0
0
0
4
LAST 4Q
0
0
385
2,827
0
0
385
2,827
0
0
68
1,943
0
0
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
77
0
77
0
77
0.0%
4
LAST 4Q
0
231
0
0
0
0
0.0%
4
LAST 4Q
0
15
0
15
0
0
0.0%
MLF / QFN
4
LAST 4Q
0
0
154
649
0
0
77
77
0
0
77
77
0.0%
0.0%
QFP
4
LAST 4Q
0
0
385
1,202
0
154
0
154
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
77
385
0
0
77
308
0
0
77
308
0.0%
0.0%
PGA
4
LAST 4Q
0
15
0
15
0
0
0.0%
PLCC
4
LAST 4Q
0
0
77
539
0
0
77
385
0
0
77
385
0.0%
0.0%
SOIC
4
LAST 4Q
0
0
77
461
0
0
77
308
0
0
77
308
0.0%
0.0%
CASON
BGA
MCGA
TSOP / VSOP
ATMEL
4
0
77
0
77
0
77
0.0%
LAST 4Q
0
231
0
231
0
231
0.0%
4
LAST 4Q
0
0
847
3,805
0
0
385
1,570
0
0
385
1,540
0.00%
0.00%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
5
19.7
EPLD
0.5
PLD
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
5
34
EPROM
0.5
EPROM
NTO
35
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
5
42
BiCMOS
0.6
GFO / CSO
43
ASIC
ASIC, TX RF
HNO
46
5
55
Logic
RFA
5
55.8
5
56
5
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
SJO
63
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
HNO
75
RFA
HNO
6UH6+BICMOS
RFA
HNO
BCDMOS
HNO
BICMOS
6BD1
HNO
BICMOS2
GFO
HCCD1
NMOS
2.5
0.8
ASIC / RFA
ASIC / RFA
RFA
CCD
GFO
HCCD3
NMOS
1.5
CCD
HNO
I²L
6IL4
2
ASIC
HNO
SCMOS3
HNO
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
HNO
UNI3
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
RFA
RFA
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12
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