2006 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
First QUARTER 2007
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product family)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
11. Technology List
10
12. Failure Rate Calculations
11
13. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
March 19, 2007
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests to
ensure that the reliability has maintained over time. Listed below are the overall results
for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 7 FITS (4,168K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 15 FITS (524K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 462 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 847K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 385 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours 500 Hours
REJ
SS
REJ
SS REJ SS
Device-Hours*
WAF
EFR PPM
FITS
REJ
SS
100
300
0
0
100
300
109,600
328,752
42
131
0
0
201
21
APG
4
LAST 4Q
0
0
300
899
0
0
100
300
ASIC
4
LAST 4Q
0
0
652
2,984
0
0
652 0
2,855 0
344
1,386
0
0
254
1,020
350,744
1,455,984
31
37
0
0
84
17
MEMORY
4
LAST 4Q
0
0
900
3,105
0
0
299 0
1,004 0
299
989
0
0
299
944
327,848
1,069,868
104
202
0
0
27
4
MCU
4
LAST 4Q
1
1
25,872
29,598
0
0
177
861
177
860
0
0
100
532
1,371,860
2,075,544
45
41
39
34
33
24
RFA
4
LAST 4Q
0
0
1,700
1,810
0
0
1,700 0 1,340
1,810 0 1,398
0
0
1,340
1,398
1,400,480
1,467,216
94
91
0
0
7
7
SERIAL EE
ATMEL
0
0
1K Hours
0
0
4
0
2,200
0
2,100
0
300
0
300
607,200
48
0
31
LAST 4Q
0
4,600
0
3,600
0
900
0
900
1,401,600
57
0
12
4
LAST 4Q
1
1
31,624
42,996
0
0
5,028 0 2,560
10,430 0 5,833
0
0
2,393
5,094
4,167,732
7,798,964
65
65
32
23
7
4
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
Z96
Z92
Z91
UHF
6UH6+BICMOS
SIGE2
CMOS
BCDMOS
BICMOS
63K
58K
57.5K
57K
56.9K
56.8K
56K
46K
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
154
154,000
117
154
154,000
117
0
0
51
51
498,036
12
542,728
12
100
98
333
313
45
81,900
10
0
1,160
0
152
186,440
90
152
0
152
186,440
90
0
0
55
55
0
80
0
80
80,000
117
0
80
0
80
80,000
117
0
0
98
98
80
0
80
0
80
80,000
206
80
0
80
0
80
80,000
206
0
0
56
56
0
154
0
154
0
0
77,000
117
0
102
79
0
79
0
79
0
79
79,000
117
79
0
79
0
79
0
79
79,000
117
0
0
99
99
0
325
0
325
0
325
0
325
325,000
117
0
325
0
325
0
325
0
325
325,000
117
0
0
24
24
0
600
0
199
0
199
0
199
218,248
63
0
1,500
0
499
0
499
0
499
547,048
76
0
0
67
22
4
LAST 4Q
0
314
0
314
0
313
0
313
313,168
21
0
914
0
391
0
390
0
313
376,772
18
0
0
139
134
4
LAST 4Q
0
154
0
154
25,872
117
0
154
0
154
0
0
0
0
25,872
117
0
0
302
302
4
LAST 4Q
0
100
0
100
0
100
0
100
100,000
23
0
315
0
315
0
300
0
300
302,520
24
0
0
403
127
0
100
0
100
0
100
0
100
100,000
48
0
189
0
154
0
154
0
77
0
77
89,936
48
0
1,253
0
1,030
0
254
0
177
356,572
38
0
0
210
67
0
12
0
12
0
12
0
12
12,000
260
0
294
0
157
0
157
0
157
0
157
157,000
85
0
157
0
157
0
157
0
157
157,000
85
0
0
69
69
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
154
0
154
0
154
0
0
154
0
154
0
154
0
4
LAST 4Q
1
9,952
0
45
0
45
1
10,158
0
122
0
122
0
0
0
390
0
90
0
90
0
4
LAST 4Q
0
357
0
357
0
152
0
357
0
357
0
4
LAST 4Q
0
80
0
80
0
80
0
80
4
LAST 4Q
0
80
0
0
80
0
0
154
4
LAST 4Q
0
0
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
44K
43 K
39K
35K
34K
26K
19K
ATMEL
QTR
4
LAST 4Q
4
LAST 4Q
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
77
115,808
23
0
231
347,424
23
0
0
348
116
58
0
58
66,736
42
0
327
REJ
SS
REJ
SS
REJ
SS
REJ
SS
0
308
0
308
0
77
0
0
924
0
924
0
231
0
110
0
110
0
4
LAST 4Q
0
300
0
300
0
100
0
100
133,600
48
0
1,200
0
600
0
400
0
400
462,400
74
0
142
27
4
LAST 4Q
0
17,910
0
2,022
0
422
0
300
1,392,424
58
0
22,580
0
3,897
0
1,396
0
1,132
2,580,952
50
0
0
11
7
4
LAST 4Q
0
300
0
100
0
100
0
100
109,600
187
0
1,200
0
400
0
400
0
400
438,400
161
0
0
45
13
0
200
0
200
0
200
0
200
200,000
36
0
129
4
LAST 4Q
0
300
0
100
0
100
0
100
109,600
42
0
600
0
200
0
200
0
200
219,200
175
0
0
201
24
4
LAST 4Q
1
31,624
0
5,028
0
2,560
0
2,393
4,167,732
65
1
42,996
0
10,430
0
5,833
0
5,094
7,798,964
65
32
23
7
4
4
LAST 4Q
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
FAMILY
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
APG
4
LAST 4Q
0
0
77
177
0
0
77
177
0
0
77
177
77,000
177,000
117
117
102
44
ASIC
4
LAST 4Q
0
0
0
231
0
0
0
231
0
0
0
231
0
231,000
117
117
34
MEMORY
4
LAST 4Q
0
0
231
585
0
0
231
585
0
0
231
585
231,000
585,000
117
117
34
13
MCU
4
LAST 4Q
0
0
254
1,197
0
0
254
1,197
0
0
177
1,119
215,500
1,158,000
117
117
36
7
SERIAL EE
4
LAST 4Q
0
0
0
408
0
0
0
408
0
0
0
408
0
408,000
117
117
19
4
LAST 4Q
0
0
562
2,598
0
0
562
2,598
0
0
485
2,520
523,500
2,559,000
117
117
15
3
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
Device-Hours AF
FITS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
77
0
77
0
77
77,000
117
102
63 K
4
LAST 4Q
0
0
154
358
0
0
154
358
0
0
154
358
154,000
358,000
117
117
51
22
56K
4
LAST 4Q
0
154
0
154
0
154
154,000
117
51
4
LAST 4Q
0
227
0
227
0
227
227,000
117
35
35K
4
LAST 4Q
0
0
254
1,120
0
0
254
1,120
0
0
177
1,042
215,500
1,081,000
117
117
36
7
34K
4
LAST 4Q
0
0
77
254
0
0
77
254
0
0
77
254
77,000
254,000
117
117
102
31
56.8K
4
LAST 4Q
0
231
0
231
0
231
231,000
117
34
19K
4
LAST 4Q
0
0
77
127
0
0
77
127
0
0
77
127
77,000
127,000
117
117
102
62
58K
4
LAST 4Q
0
50
0
50
0
50
50,000
117
157
4
LAST 4Q
0
0
562
2,598
0
0
562
2,598
0
0
485
2,520
523,500
2,559,000
117
117
15
3
Z92
39K
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
2K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
154
0
154
0
154
0
154
0
0
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
77
0
0
0.00%
4
LAST 4Q
0
154
0
154
0
154
0
139
0
0
0.00%
4
LAST 4Q
0
0
77
589
0
0
77
589
0
0
154
666
0
0
154
577
0
0
0.00%
0.00%
4
LAST 4Q
0
0
77
227
0
0
77
227
0
0
77
224
0
0
77
224
0
0
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
77
535
0
0
77
535
0
0
77
535
0
0
77
304
0
0
0
0
0.00%
0.00%
SAP
4
LAST 4Q
0
77
0
77
0
77
0
77
0
0
0.00%
SOIC
4
LAST 4Q
0
154
0
154
0
154
0
148
0
0
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
154
508
0
0
154
508
0
0
154
508
0
0
154
508
0
0
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
77
0
0
0.00%
4
LAST 4Q
0
0
385
2,552
0
0
385
2,552
0
0
462
2,626
0
0
462
2,285
0
0
0
0
0.00%
0.00%
BCC
CBGA
MLF / QFN
QFP
PDIP
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
HAST
Temperature Humidity Bias
Device-Hours* % Defective
168 Hours 500 Hours 1K Hours 100 Hours
500 Hours
REJ SS REJ SS REJ SS REJ SS
REJ
SS
PACKAGE
QTR
BCC
4
LAST 4Q
0
154
0
154
0
154
0
0
0
0
154,000
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
0
0
77,000
0.00%
4
LAST 4Q
0
154
0
154
0
154
0
0
0
0
154,000
0.00%
4
LAST 4Q
0
0
154
502
0
0
154
502
0
0
0
229
0
0
77
154
0
0
204,188
673,500
0.00%
0.00%
4
LAST 4Q
0
0
0
50
0
0
0
50
0
0
0
50
0
0
77
227
0
0
716,800
504,000
0.00%
0.00%
4
LAST 4Q
0
0
0
314
0
0
0
314
0
0
0
237
0
0
77
304
0
0
109,600
883,500
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
0
0
77,000
0.00%
4
LAST 4Q
0
154
0
154
0
154
0
77
0
0
308,000
0.00%
4
LAST 4Q
0
159
0
159
0
159
0
0
0
0
159,000
0.00%
4
LAST 4Q
0
0
0
150
0
0
0
150
0
0
0
150
0
0
154
508
0
0
218,248
1,166,000
0.00%
0.00%
4
LAST 4Q
0
77
0
77
0
77
0
0
0
0
77,000
0.00%
4
LAST 4Q
0
0
154
1,868
0
0
154
1,868
0
0
0
1,518
0
0
385
1,270
0
0
0
0
847,000
4,233,000
0.00%
0.00%
CBGA
MLF / QFN
QFP
PDIP
PLCC
SAP
SOIC
SSOP
TSOP / VSOP
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
77
0
77
0
0
0.0%
4
LAST 4Q
0
154
0
0
0
0
0.0%
QFP
4
LAST 4Q
0
0
77
503
0
0
77
154
0
0
77
154
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
77
227
0
0
77
227
0
0
77
227
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
77
535
0
0
77
304
0
0
76
303
0.0%
0.0%
SAP
4
LAST 4Q
0
77
0
77
0
0
0.0%
4
LAST 4Q
0
231
0
77
0
0
0.0%
SSOP
4
LAST 4Q
0
77
0
0
0
0
0.0%
TSOP / VSOP
4
0
154
0
154
0
154
0.0%
LAST 4Q
0
508
0
508
0
508
0.0%
4
LAST 4Q
0
77
0
77
0
0
0.0%
4
LAST 4Q
0
0
385
2,466
0
0
385
1,501
0
0
384
1,192
0.00%
0.00%
CBGA
MLF / QFN
SOIC
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
5
19.7
EPLD
0.5
PLD
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
5
34
EPROM
0.5
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
5
42
BiCMOS
0.6
GFO / CSO
43
EPROM
ASIC
ASIC, TX RF
HNO
46
5
55
Logic
RFA
5
55.8
5
56
5
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
HNO
BCDMOS
6BD1
0.8
ASIC / RFA
HNO
BICMOS
HNO
6UH6+BICMOS
GFO
HCCD1
NMOS
2.5
ASIC / RFA
RFA
CCD
GFO
HCCD3
NMOS
1.5
CCD
HNO
I²L
6IL4
2
ASIC
HNO
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
SRAM,MICRO, VAN DLC
NTO
Z86
CMOS Digital
0.8
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
22
RELIABILITY MONITOR -- ATMEL
PROPRIETARY
11
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
22
RELIABILITY MONITOR -- ATMEL
PROPRIETARY
12
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