2005 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
First QUARTER 2006
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product family)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
9. Failure Description Detail
10
10. Technology List
11
11. Failure Rate Calculations
12
12. Definitions
13
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
February 2, 2006
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests to
ensure that the reliability has maintained over time. Listed below are the overall results
for the last quarter.
1. High Temperature Operating Life (125° - 150°C)
Failure Rate: 5 FITS (3M device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours.
2.
Data Retention Bake (150°C)
Failure Rate: 7 FITS (492.5K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 259 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 888 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 590K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 1,244 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
FAMILY
QTR
48 Hours
168 Hours 500 Hours
REJ
SS
REJ
4
LAST 4Q
0
54
0
ASIC
4
LAST 4Q
0
0
4,594
7,597
0
2
CCD
4
LAST 4Q
0
0
45
102
0
0
45
102
0
0
4
LAST 4Q
0
23
0
23
4
LAST 4Q
0
300
0
100
4
LAST 4Q
0
0
1,055
5,475
0
0
4
LAST 4Q
0
900
0
299
4
LAST 4Q
0
900
0
4
LAST 4Q
0
299
0
4
LAST 4Q
0
0
743
5,824
0
0
4
LAST 4Q
0
36
0
36
4
LAST 4Q
0
535
0
TX RF Total
4
LAST 4Q
0
0
297
347
0
0
ATMEL
4
LAST 4Q
0
0
6,734
22,392
0
2
ADC
DEMUX
D-FLASH
EEPROM
EPLD
EPROM
FLASH
MICRO
MUXDAC
SRAM
SS REJ SS
1K Hours
Device-Hours* WAF EFR PPM
FITS
REJ
SS
0
54
54,000
78
0
218
0
0
1,070
2,120
1,810,092
3,272,388
51
97
0
0
10
13
34
52
0
0
34
52
59,848
102,400
78
78
0
196
115
0
23
0
23
46,000
78
0
255
0
100
0
100
109,600
21
0
395
200
1,100
0
0
196
1,096
299,040
1,440,000
180
147
0
17
4
0
299
0
299
327,848
78
0
36
300
0
300
0
300
328,800
348
0
8
100
0
100
0
100
109,552
21
0
395
312
1,270
0
0
312
1,038
467,688
1,521,392
76
76
0
26
8
0
36
0
36
72,000
78
0
164
228
0
225
0
90
172,740
4
0
1,225
187
237
0
0
187
237
0
0
187
237
379,280
429,280
35
33
0
0
69
64
0
0
1,799
5,545
3,015,948
7,986,000
66
103
0
0
5
5
54
0
54
2,173 0 1,135
4,616 1 2,641
700 0
2,200 0
312 0
1,385 0
3,417 0 1,868
9,680 1 6,437
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
Z92
Z91
Z86
HCCD
CMOS
HCMOS
BIP
BICMOS
61 K
58K
57K
56K
QTR
48 Hours
168 Hours
500 Hours
1K Hours Device-Hours* WAF
EFR PPM
FITS
2,034
187
REJ
SS
REJ
SS
REJ
SS
REJ
SS
0
877
0
154
0
77
0
77
124,640
4
0
2,741
0
596
0
464
0
310
512,136
10
0
0
0
400
0
93
0
90
0
45
82,740
7
0
1,675
4
LAST 4Q
0
400
0
0
0
0
0
0
19,200
3
0
710
0
50
0
50
0
50
81,680
3
0
0
17,026
4,219
4
LAST 4Q
0
45
0
45
0
34
0
34
59,848
78
0
102
0
102
0
52
0
52
102,400
78
0
0
196
115
4
LAST 4Q
0
321
0
321
0
90
0
90
218,808
110
0
456
0
456
0
225
0
225
353,808
98
0
0
38
26
4
LAST 4Q
0
45
0
45
0
45
0
45
90,000
78
0
45
0
45
0
45
0
45
90,000
78
0
0
131
131
0
90
0
90
0
90
0
90
126,000
78
0
94
0
600
0
200
0
200
0
200
419,200
42
0
600
0
200
0
200
0
200
419,200
42
0
0
52
52
4
LAST 4Q
0
299
0
100
0
100
0
100
109,552
21
0
395
4
LAST 4Q
0
307
2
307
0
228
0
77
165,772
245
0
76
4
LAST 4Q
0
730
0
317
0
317
0
317
553,824
40
0
1,092
0
679
0
679
0
362
757,324
68
0
0
41
18
4
LAST 4Q
0
1,629
0
913
0
414
0
376
513,200
59
0
4,162
0
2,283
1
1,170
0
1,054
1,389,176
91
0
0
30
16
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
55K
46K
44K
43 K
39K
37K
35K
34K
26K
19K
ATMEL
QTR
48 Hours
168 Hours
500 Hours
1K Hours Device-Hours* WAF
EFR PPM
FITS
REJ
SS
REJ
SS
REJ
SS
REJ
SS
0
608
0
608
0
304
0
227
316,572
259
0
11
4
LAST 4Q
0
87
0
87
0
87
0
87
174,000
27
0
137
0
137
0
137
0
137
224,000
26
0
0
195
159
4
LAST 4Q
0
308
0
308
0
77
0
77
115,808
35
0
308
0
308
0
77
0
77
115,808
35
0
0
225
225
4
LAST 4Q
0
210
0
100
0
100
0
100
205,280
42
0
233
0
123
0
123
0
123
251,280
49
0
0
106
75
4
LAST 4Q
0
300
0
100
0
100
0
96
107,600
348
0
900
0
300
0
300
0
296
326,800
238
0
0
24
12
0
600
0
200
0
200
0
200
219,200
213
0
20
0
1,082
0
727
0
227
0
200
314,540
96
0
5,358
0
2,004
0
1,004
0
976
1,318,992
87
0
0
30
8
0
900
0
300
0
300
0
300
328,800
348
0
8
0
100
0
100
0
100
0
100
100,000
85
0
100
0
100
0
100
0
100
100,000
85
0
0
108
108
0
2,244
0
599
0
499
0
499
594,760
94
0
16
0
6,734
0
3,417
0
1,868
0
1,799
3,015,948
66
0
22,392
2
9,680
1
6,437
0
5,545
7,986,000
103
0
0
5
5
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
FAMILY
QTR
168 Hours
REJ
ADC
SS
500 Hours
REJ
SS
1K Hours
REJ
Device-Hours
AF
FITS
259
236
SS
4
LAST 4Q
0
15
0
15
0
15
0
15,000
ASIC
4
LAST 4Q
0
0
77
344
0
0
77
344
0
0
77
344
77,000
344,000
259
259
46
10
CCD
4
LAST 4Q
0
2
0
2
0
0
0
1,000
259
259
3,538
D-FLASH
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
EEPROM
4
LAST 4Q
0
0
50
1,150
0
0
50
1,150
0
0
50
1,150
50,000
1,150,000
259
259
71
3
EPLD
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
EPROM
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
FLASH
4
LAST 4Q
0
50
0
50
0
50
0
50,000
259
259
71
MICRO
4
LAST 4Q
0
0
254
779
0
0
254
779
0
0
177
702
215,500
740,500
259
259
16
5
ATMEL
4
LAST 4Q
0
0
531
2,940
0
0
531
2,940
0
0
454
2,861
492,500
2,900,500
259
259
7
1
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours AF
FITS
Z92
4
LAST 4Q
0
0
77
154
0
0
77
154
0
0
77
154
77,000
154,000
259
259
46
23
Z91
4
LAST 4Q
0
44
0
44
0
44
44,000
259
80
4
LAST 4Q
0
2
0
2
0
0
1,000
259
3,538
4
LAST 4Q
0
15
0
15
0
15
15,000
259
236
4
LAST 4Q
0
50
0
50
0
50
50,000
259
71
56K
4
LAST 4Q
0
0
77
471
0
0
77
471
0
0
77
471
77,000
471,000
259
259
46
8
39K
4
LAST 4Q
0
0
100
350
0
0
100
350
0
0
100
350
100,000
350,000
259
259
35
10
37K
4
LAST 4Q
0
100
0
100
0
100
100,000
259
35
35K
4
LAST 4Q
0
0
177
1,354
0
0
177
1,354
0
0
100
1,277
138,500
1,315,500
259
259
26
3
34K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
19K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
ATMEL
4
LAST 4Q
0
0
531
2,940
0
0
531
2,940
0
0
454
2,861
492,500
2,900,500
259
259
7
1
HCCD
BIP
61 K
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
2K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
200
0
200
0
200
0
200
0
0
0.00%
4
LAST 4Q
0
15
0
15
0
15
0
15
0
0
0.00%
4
LAST 4Q
0
50
0
50
0
50
0
0
0
0
0.00%
MLF / QFN
4
LAST 4Q
0
0
150
200
0
0
150
200
0
0
150
200
0
0
0
0
0
0
0
0
0.00%
0.00%
PDIP
4
LAST 4Q
0
0
127
277
0
0
127
277
0
0
127
277
0
0
127
277
0
0
0
0
0.00%
0.00%
PLCC
4
LAST 4Q
0
429
0
429
0
426
0
426
0
0
0.00%
SOIC
4
LAST 4Q
0
0
199
1,228
0
0
199
1,228
0
0
199
1,228
0
0
0
798
0
0
0
0
0.00%
0.00%
SSOP
4
LAST 4Q
0
321
0
321
0
321
0
0
0
0
0.00%
QFP
4
LAST 4Q
0
0
262
511
0
0
262
511
0
0
262
511
0
0
0
204
0
0
0
0
0.00%
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
150
400
0
0
150
400
0
0
150
400
0
0
150
400
0
0
0
0
0.00%
0.00%
TSSOP
4
LAST 4Q
0
400
0
400
0
400
0
400
0
0
0.00%
4
LAST 4Q
0
0
888
4,031
0
0
888
4,031
0
0
888
4,028
0
0
277
2,720
0
0
0
0
0.00%
0.00%
BCC
CBGA
LCC
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
HAST
Temperature Humidity Bias
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
BCC
4
LAST 4Q
0
200
0
200
0
200
0
0
200,000
0.00%
4
LAST 4Q
0
50
0
50
0
0
0
0
25,000
0.00%
MLF / QFN
4
LAST 4Q
0
0
149
199
0
0
149
199
0
0
0
0
0
0
0
0
74,500
99,500
0.00%
0.00%
PDIP
4
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
77
227
154,000
454,000
0.00%
0.00%
PLCC
4
LAST 4Q
0
153
0
153
0
0
0
100
276,500
0.00%
SOIC
4
LAST 4Q
0
0
231
1,133
0
0
231
1,133
0
0
154
902
0
0
0
50
192,500
1,117,500
0.00%
0.00%
SSOP
4
LAST 4Q
0
167
0
167
1
167
0
0
167,000
0.60%
QFP
4
LAST 4Q
0
0
94
216
0
0
94
216
0
0
44
166
0
0
0
127
69,000
445,000
0.00%
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50
250
100,000
500,000
0.00%
0.00%
TSSOP
4
LAST 4Q
0
400
0
400
0
400
0
0
400,000
0.00%
4
LAST 4Q
0
0
474
2,518
0
0
474
2,518
0
1
198
1,835
0
0
127
754
590,000
3,684,500
0.00%
0.03%
LCC
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
15
0
15
0
0
0.0%
4
LAST 4Q
0
50
0
50
0
0
0.0%
MLF / QFN
4
LAST 4Q
0
0
150
200
0
0
150
150
0
0
0
0
0.0%
0.0%
QFP
4
LAST 4Q
0
0
269
518
0
172
0
127
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
127
277
0
0
127
277
0
0
127
277
0.0%
0.0%
PLCC
4
LAST 4Q
0
431
0
277
0
277
0.0%
4
LAST 4Q
0
0
308
1,266
0
650
0
350
0.0%
0.0%
4
LAST 4Q
0
0
240
484
0
90
0
0
0.0%
0.0%
TSOP / VSOP
4
LAST 4Q
0
0
150
400
0
0
150
400
0
0
150
400
0.0%
0.0%
TSSOP
4
LAST 4Q
0
400
0
400
0
200
0.0%
4
LAST 4Q
0
0
1,244
4,041
0
0
427
2,481
0
0
277
1,631
0.00%
0.00%
CBGA
LCC
SOIC
SSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Failure Description Detail
Q2-2005
a. High Temperature Operating Life, 2 failures, 168 hour read point, ASIC, AT
58A46A, LQFP-128. Root Cause: Functional Failure (RFO).
Q3-2005
a. High Temperature Operating Life, 1 failure, 500 hour read point, ASIC, AT
567A9A, LQFP-144. Root Cause: Bridging (RFO).
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
sEEPROM, MC (Intel core), MC (AVR core)
PLD
5
19.7
EPLD
0.5
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
5
34
EPROM
0.5
EPROM
5
35.5
Embedded Memory Configurator
0.35
Configurators, sEEPROM, FLASH, Microcontroller, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
BiCMOS
0.6
5
42
GFO / CSO
43
ASIC
HNO
46
5
55
Logic
0.5
ASIC
5
55.8
CMOS
0.5
ASIC
5
56
Logic
0.35
ASIC
5
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC
7
58.0
CMOS
0.18
ASIC
SJO
61
CMOS
0.18
FLASH
HNO
BCDMOS
6BD1
0.8
HNO
BICMOS
ASIC, TX RF
RF & Auto
ASIC
RF & Auto
GFO
HCCD1
NMOS
2.5
CCD
GFO
HCCD3
NMOS
1.5
CCD
HNO
I²L
6IL4
2
ASIC
HNO
SIGE1
6SG1
0.8
ASIC
HNO
UHF
6UH6
0.5
ASIC
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
NTO
Z94
CMOS + EPROM
0.5
OTP MICRO
HNO
Z95
RF & Auto
Z96
RF & Auto
HNO
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
22
RELIABILITY MONITOR -- ATMEL
PROPRIETARY
12
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
22
RELIABILITY MONITOR -- ATMEL
PROPRIETARY
13
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