2004 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
FIRST QUARTER 2005
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3-5
4. Data Retention Bake (sorted by product family)
6
5. Data Retention Bake (sorted by technology)
7
6. Temperature Cycle
7. Temperature Humidity Bias & HAST
8. Steam Pressure Pot
8-9
10
11-12
9. Failure Description Detail
13
10. Technology List
14
11. Failure Rate Calculations
15
12. Definitions
16
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
March 30, 2005
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests
to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C)1
3 Failure Rate: 5 FITS (4.7M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Also, Thermal and Voltage Acceleration are used to compute the overall acceleration
factor. Weighted acceleration factors (WAF) for a group of products are calculated by
taking the weighted average of each device’s acceleration factor multiplied by its
corresponding device hours.
2.
Data Retention Bake (150°C)
3 Failure Rate: 7 FITS (473K device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV).
Since there is no bias applied during testing and the stress temperature is fixed for all
devices at 150°C, the acceleration factor is 259 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
3 Failure Rate: 0.00% (0 failure(s) out of 1,317)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
3 Failure Rate: 0.00% (0 failure(s) out of 1.2M device-hours)
3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
3 Failure Rate: 0.00% (0 failure(s) out of 1,076)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1 junction temperatures may reach up to 200° C.
1
High Temperature Operating Life
(sorted by FAMILY)
FAMILY
QTR
48 Hours
REJ
168 Hours 500 Hours 1K Hours
SS REJ
SS
REJ
SS REJ
Device-Hours* WAF EFR PPM
FITS
SS
ASIC
4
LAST 4Q
1
1
5,044
11,031
0
2
634 0
3,277 0
557
2,640
0
1
557
2,639
781,616
3,118,708
84
80
198
91
31
21
CCD
4
LAST 4Q
0
0
83
124
0
0
83 0
149 0
44
70
0
0
44
70
50,552
86,072
78
55
0
0
232
193
D-FLASH
4
LAST 4Q
0
0
300
900
0
0
100 0
300 0
100
300
0
0
100
300
109,600
328,800
21
21
0
0
395
132
DSP
4
LAST 4Q
0
45
0
45 0
45
0
45
0
45,000
3
0
8,021
EEPROM
4
LAST 4Q
0
0
2,524
10,801
0
0
700 0
2,800 0
699
2,799
0
0
698
2,798
786,220
3,182,716
121
99
0
0
10
3
EPLD
4
LAST 4Q
0
0
300
1,200
0
0
100 0
400 0
100
400
0
0
100
400
109,600
438,400
78
145
0
0
108
14
EPROM
4
LAST 4Q
0
0
300
1,200
0
0
100 0
399 0
100
398
0
0
100
398
109,600
436,616
348
185
0
0
24
11
FLASH
4
LAST 4Q
0
0
300
1,500
0
0
100 0
490 0
100
490
0
0
100
490
109,600
538,480
21
21
0
0
395
80
RF & Auto
4
LAST 4Q
0
0
3,295
15,932
0 3,295 0
0 13,019 0
1,282
7,328
0
0
1,282
7,251
1,777,184
9,940,412
296
283
0
0
2
0
MICRO
4
LAST 4Q
0
1
1,733
11,978
0
0
453 0
1,236 0
453
1,231
0
0
299
977
437,440
1,620,456
65
86
0
83
32
15
S-CARD
4
LAST 4Q
0
0
0
0 0
0
0
0
0
SRAM
4
LAST 4Q
0
0
644
945
0
0
140 1
275 1
140
275
0
0
45
180
116,692
259,660
6
5
0
0
2,872
1,584
TX RF Total
4
LAST 4Q
0
0
279
398
1
1
279 0
398 0
278
397
0
0
278
397
278,168
397,168
31
41
0
0
124
4
LAST 4Q
0
1,763
0
460 0
415
0
340
0
447,604
4
0
572
4
LAST 4Q
1
2
14,802
57,817
0 3,603
1 16,285
4,666,272
20,840,092
167
178
68
35
5
2
VAN DLC
ATMEL
1 5,984 1 3,853
3 23,248 1 16,788
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
REJ
168 Hours
SS REJ
500 Hours
1K Hours
SS REJ
SS REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
4
LAST 4Q
0
1,577
0
177
0
100
0
100
0
180,136
259
0
20
4
LAST 4Q
0
385
0
385
0
308
0
308
0
320,936
432
0
7
Z94
4
LAST 4Q
0
0
308
408
0
0
77
177
0
0
77
177
0
0
77
77
88,088
138,088
5
4
0
0
2,080
1,515
Z92
4
LAST 4Q
0
1
380
9,542
0
0
122
514
0
0
122
509
0
0
45
357
95,884
867,184
6
8
0
105
1,593
288
Z91
4
LAST 4Q
0
0
554
900
0
0
50
230
0
0
50
230
0
0
0
180
49,192
237,160
4
4
0
0
4,983
1,052
Z86
4
LAST 4Q
0
888
0
285
0
240
0
240
0
276,504
3
0
981
UHF
4
LAST 4Q
0
0
864
3,569
0
0
864
3,569
0
0
293
1,973
0
0
293
1,973
465,928
2,553,128
304
260
0
0
6
1
TSC6
4
LAST 4Q
0
0
45
45
0
0
45
45
0
0
45
45
0
0
45
45
45,000
45,000
78
78
0
0
261
261
SIGE
4
LAST 4Q
0
0
307
1,237
0
0
307
1,237
0
0
0
699
0
0
0
699
51,576
1,023,384
275
505
0
0
65
2
4
0
0
243
1,544
0
0
243
1,621
0
0
163
1,221
0
0
163
1,221
176,440
1,751,504
273
227
0
19
LAST 4Q
0
2
4
LAST 4Q
0
0
83
124
0
0
83
149
0
0
44
70
0
0
44
70
50,552
86,072
78
55
0
0
232
193
Z96
Z95
I2L
HCCD
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
REJ
168 Hours
SS REJ
500 Hours
SS REJ
1K Hours
SS REJ
Device-Hours*
WAF
EFR PPM
FITS
SS
CMOS
4
LAST 4Q
0
0
117
162
0
0
117
162
0
0
117
162
0
0
117
162
117,000
162,000
274
215
0
0
29
26
BCDMOS
4
LAST 4Q
0
0
1,049
1,585
0
0
1,049
1,585
0
0
231
465
0
0
231
465
368,424
730,160
210
180
0
0
12
7
BICMOS
4
LAST 4Q
0
0
2,847
6,619
0
0
792
3,687
0
0
555
2,192
0
0
555
2,192
773,456
2,974,896
281
250
0
0
4
1
61 K
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
438,400
21
21
0
0
395
99
58K
4
LAST 4Q
0
0
200
999
0
1
200
998
0
0
200
696
0
1
200
695
200,000
746,284
78
78
0
0
59
54
57K
4
LAST 4Q
0
0
45
45
0
0
45
45
1
1
45
45
0
0
0
0
22,500
22,500
2
2
0
0
40,291
40,291
56K
4
LAST 4Q
1
1
3,380
7,974
0
1
434
1,851
0
0
434
1,728
0
0
357
1,651
536,908
2,004,068
77
86
296
125
49
18
55K
4
LAST 4Q
0
270
0
270
0
135
0
135
0
157,680
78
0
75
46K
4
LAST 4Q
0
0
177
2,235
1
1
177
645
0
0
99
333
0
0
99
333
112,104
535,736
50
215
0
0
359
18
43 K
4
LAST 4Q
0
0
179
578
0
0
179
498
0
0
179
498
0
0
179
498
179,000
501,840
36
37
0
0
142
49
39K
4
LAST 4Q
0
0
300
1,200
0
0
100
390
0
0
100
390
0
0
100
390
109,600
428,880
21
21
0
0
395
101
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
REJ
168 Hours
500 Hours
1K Hours
SS REJ
SS REJ
SS REJ
Device-Hours*
WAF
EFR PPM
FITS
SS
4
LAST 4Q
0
231
0
231
0
77
0
0
0
64,372
498
0
29
4
LAST 4Q
0
300
0
100
0
100
0
100
0
109,600
348
0
24
35K
4
LAST 4Q
0
0
964
4,859
0
0
300
1,298
0
0
300
1,298
0
0
300
1,298
331,872
1,468,928
123
123
0
0
22
5
34K
4
LAST 4Q
0
0
300
1,200
0
0
100
399
0
0
100
398
0
0
100
398
109,600
436,616
348
185
0
0
24
11
26K
4
LAST 4Q
0
100
0
100
0
100
0
100
0
100,000
52
0
178
24
4
LAST 4Q
0
0
100
100
0
0
100
100
0
0
100
100
0
0
100
100
100,000
100,000
93
93
0
0
98
98
19K
4
LAST 4Q
0
0
2,060
7,641
0
0
500
1,800
0
0
499
1,799
0
0
498
1,798
573,548
2,079,036
133
117
0
0
12
4
15K
4
LAST 4Q
0
300
0
300
0
300
0
300
0
300,000
93
0
33
4
LAST 4Q
1 14,802
2 57,817
0 3,603
1 16,285
4,666,272
20,840,092
167
178
68
35
5
2
38 K
37K
ATMEL
1 5,984
3 23,248
1 3,853
1 16,788
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Data Retention Bake
(sorted by FAMILY)
FAMILY
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
ASIC
4
LAST 4Q
0
0
50
100
0
0
50
100
0
0
50
100
50,000
100,000
259
259
71
253
CCD
4
LAST 4Q
0
10
0
10
0
10
10,000
259
354
D-FLASH
4
LAST 4Q
0
0
50
250
0
0
50
250
0
0
50
250
50,000
250,000
259
259
71
14
EEPROM
4
LAST 4Q
0
0
50
700
0
0
50
700
0
0
50
700
50,000
700,000
259
259
71
5
EPLD
4
LAST 4Q
0
0
50
300
0
0
50
300
0
0
50
300
50,000
300,000
259
259
71
12
EPROM
4
LAST 4Q
0
0
50
300
0
0
50
299
0
0
50
299
50,000
299,168
259
259
71
12
FLASH
4
LAST 4Q
0
0
50
250
0
0
50
250
0
0
50
250
50,000
250,000
259
259
71
14
MICRO
4
LAST 4Q
0
0
232
532
0
0
232
532
0
0
114
414
173,000
473,000
259
259
20
7
ATMEL
4
LAST 4Q
0
0
532
2,442
0
0
532
2,441
0
0
414
2,323
473,000
2,382,168
259
259
7
1
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
168 Hours
500 Hours
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
10
0
10
0
10
61 K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
56K
4
LAST 4Q
0
0
232
382
0
0
232
382
39K
4
LAST 4Q
0
0
50
300
0
0
37K
4
LAST 4Q
0
50
35K
4
LAST 4Q
0
0
34K
4
LAST 4Q
19K
15K
HCCD
ATMEL
QTR
1K Hours
Device-Hours AF FITS
10,000
259
354
50
200
50,000 259
200,000 259
71
18
0
0
114
264
173,000 259
323,000 259
20
11
50
300
0
0
50
300
50,000 259
300,000 259
71
12
0
50
0
50
50
450
0
0
50
450
0
0
0
0
50
300
0
0
50
299
4
LAST 4Q
0
0
100
650
0
0
4
LAST 4Q
0
100
4
LAST 4Q
0
0
532
2,442
50,000
259
71
50
450
50,000 259
450,000 259
71
8
0
0
50
299
50,000 259
299,168 259
71
12
100
650
0
0
100
650
100,000 259
650,000 259
35
5
0
100
0
100
100,000
259
35
0
0
532
2,441
0
0
414
2,323
473,000 259
2,382,168 259
7
1
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Cycle
PACKAGE
QTR
200 Cycles
REJ
SS
500 Cycles
1K Cycles
% Defective
REJ
SS
REJ
SS
4
LAST 4Q
0
526
0
526
0
521
0.00%
LCC
4
LAST 4Q
0
0
300
300
0
0
300
300
0
0
150
150
0.00%
0.00%
MLF / QFN
4
LAST 4Q
0
268
0
268
0
268
0.00%
PDIP
4
LAST 4Q
0
0
50
408
0
0
50
408
0
0
50
408
0.00%
0.00%
PGA
4
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
204
531
0
0
204
531
0
0
204
531
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
77
684
0
0
77
684
0
0
77
679
0.00%
0.00%
SSOP
4
LAST 4Q
0
0
199
845
0
0
199
845
0
0
77
723
0.00%
0.00%
TQFP / LQFP / VQFP
4
LAST 4Q
0
0
141
368
0
0
141
368
0
0
64
291
0.00%
0.00%
CBGA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Temperature Cycle
PACKAGE
QTR
200 Cycles
REJ
500 Cycles
SS
1K Cycles
% Defective
REJ
SS
REJ
SS
TSOP
4
LAST 4Q
0
0
100
475
0
0
100
475
0
0
100
475
0.00%
0.00%
TSSOP
4
LAST 4Q
0
77
0
77
0
77
0.00%
4
LAST 4Q
0
0
1,317
4,728
0
0
1,317
4,728
0
0
968
4,369
0.00%
0.00%
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Temperature Humidity Bias / HAST
HAST
Temperature Humidity Bias
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ
SS REJ
SS REJ
SS REJ
SS
PACKAGE
QTR
CBGA
4
LAST 4Q
0
416
0
416
0
416
0
0
416,000
0.00%
LCC
4
LAST 4Q
0
0
300
300
0
0
300
300
0
0
150
150
0
0
0
0
225,000
225,000
0.00%
0.00%
MLF / QFN
4
LAST 4Q
0
271
0
197
0
197
0
74
357,432
0.00%
PDIP
4
LAST 4Q
0
0
0
300
0
0
0
300
0
0
0
300
0
0
50
150
100,000
600,000
0.00%
0.00%
PGA
4
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
0
0
0
0
246,000
246,000
0.00%
0.00%
PLCC
4
LAST 4Q
0
0
77
304
0
0
77
304
0
0
77
304
0
0
100
200
277,000
704,000
0.00%
0.00%
SOIC
4
LAST 4Q
0
352
0
352
0
275
0
204
721,500
0.00%
SSOP
4
LAST 4Q
0
0
198
240
0
0
198
240
0
0
44
86
0
0
0
462
121,000
1,087,000
0.00%
0.00%
LQFP / TQFP / VQFP
4
LAST 4Q
0
0
77
154
0
0
77
154
0
0
77
154
0
0
0
100
77,000
354,000
0.00%
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
100
449
200,000
898,000
0.00%
0.00%
0
250
0 1,639
1,246,000
5,608,932
0.00%
0.00%
ATMEL
4
LAST 4Q
0
898
0 2,583
0
898
0 2,509
0
594
0 2,128
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
520
0
520
0
50
0.0%
LCC
4
LAST 4Q
0
0
150
150
0
0
150
150
0
0
0
0
0.0%
0.0%
TQFP / LQFP / VQFP
4
LAST 4Q
0
0
77
380
0
0
0
150
0
0
0
150
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
50
477
0
0
50
477
0
0
50
177
0.0%
0.0%
PGA
4
LAST 4Q
0
0
246
246
0
0
246
246
0
0
0
0
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
177
504
0
0
100
200
0
0
100
200
0.0%
0.0%
SOIC
4
LAST 4Q
0
0
77
607
0
0
77
177
0
0
76
176
0.0%
0.0%
SSOP
4
LAST 4Q
0
0
199
241
0
0
45
45
0
0
0
0
0.0%
0.0%
TSOP
4
LAST 4Q
0
0
100
477
0
0
100
477
0
0
100
477
0.0%
0.0%
CBGA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Steam Pressure Pot
PACKAGE
TSSOP
ATMEL
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
76
0
76
0
76
0.0%
4
LAST 4Q
0
0
1,076
3,678
0
0
768
2,518
0
0
326
1,306
0.00%
0.00%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12
Failure Description Detail
Q4-2004
a. High Temperature Operating Life, 1 failure, 48 hour read point, ASIC, AT8402,
SSOP-28. Root Cause: This was a static fail (Iddq). Corrective Action: To be
declared.
b. High Temperature Operating Life, 1 failure, 168 hour read point, TX RF,
AT84RF211S, TQFP-48. Root Cause: This was a static fail (Iddq). Corrective Action:
To be declared.
c. High Temperature Operating Life, 1 failure, 500 hour read point, SRAM, AT60142E,
MQFP-36. Root Cause: This was caused by resistive contact VIA1 to M2.
Corrective Action: We have improved the CMP process to ensure this failure will
not repeat.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
13
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µ
µ m]
TYPICAL PRODUCTS / APPLICATIONS
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
GFO / CSO
HNO
5
5
5
5
15.3
19.3
19.5
19.6
19.7
19.76
19.8
19.8
19.9
25
26
33.5
34
35.5
37
39
39.1
42
43
46
55
55.8
56
56.8
EEPROM
EEPROM
Embedded Memory Configurator
Embedded Memory
EPLD
EPLD
CMOS
Embedded Memory Configurator
Embedded Memory
BiCMOS
Logic
FLASH
EPROM
Embedded Memory Configurator
EEPROM
EEPROM
EEPROM
BiCMOS
1.8 - 2.3
1.1
1.0
0.7
0.5
0.5
0.7
0.7
0.7
1.0
0.7
0.5
0.5
0.35
0.35
0.25
0.25
0.6
sEEPROM
sEEPROM
Configurator
sEEPROM, MC (Intel core), MC (AVR core)
PLD
PLD
ASIC
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
ASIC
ASIC
Logic
CMOS
Logic
Embedded Memory
0.5
0.5
0.35
0.35
EPROM
Configurators, sEEPROM, FLASH, Microcontroller, EPLD
FLASH, PEROM, DATA FLASH, sEEPROM
DATA FLASH
FLASH, DATA FLASH
ASIC
ASIC, TX RF
RF & Auto
ASIC
ASIC
ASIC
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC
7
CMOS
CMOS
0.18
ASIC
SJO
58.0
61
0.18
FLASH
HNO
BCDMOS
6BD1
0.8
HNO
GFO
GFO
HNO
HNO
HNO
NTO
NTO
NTO
NTO
HNO
HNO
BICMOS
HCCD1
HCCD3
I²L
SIGE1
UHF
Z86
Z91
Z92
Z94
Z95
Z96
NMOS
NMOS
6IL4
6SG1
6UH6
CMOS Digital
CMOS Digital
CMOS Digital
CMOS + EPROM
2.5
1.5
2
0.8
0.5
0.8
0.6
0.5
0.5
ASIC
RF & Auto
CCD
CCD
ASIC
ASIC
ASIC
SRAM,MICRO, VAN DLC
SRAM, ASIC, MICRO
ASIC, MICRO,VAN DLC
OTP MICRO
RF & Auto
RF & Auto
RELIABILITY MONITOR -- ATMEL PROPRIETARY
14
Failure Rate Calculations
Failure Rate:
χ2
λ
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
=
α
(1 −
, 2⋅n + 2 )
100
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= e Z⋅
[ VS
− Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
15
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
16
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