2002 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
FIRST QUARTER 2003
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product family)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product family)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7. Temperature Humidity Bias & HAST
7-8
9
8. Steam Pressure Pot
10-11
9. Failure Description Detail
12-13
10. Technology List
14
11. Failure Rate Calculations
15
12. Definitions
16
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
March 31, 2003
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process or package family and performing a series of reliability tests
to ensure that the reliability has not deteriorated over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C)
3 Failure Rate: 89 FITS (3.1M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV).
Also, Thermal and Voltage Acceleration are used to compute the overall acceleration
factor. Weighted acceleration factors (WAF) for a group of products are calculated by
taking a weighted average of each device’s AF multiplied by the corresponding sample
size. See page 10 for a more detailed description of the FIT rate calculation methodology.
2.
Data Retention Bake (150°C)
3 Failure Rate: 2 FITS (1.5M device-hours)
3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV).
Since there is no bias applied during testing and the stress temperature is fixed for all
devices at 150°C, the acceleration factor is 259 for all groupings.
3.
Temperature Cycle (-65°C to 150°C)
3 Failure Rate: 0.0% (0 failures out of 1,984)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH)
3 Failure Rate: 0.0% (2.0M device-hours)
3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH)
3 Failure Rate: 0.04% (1 failure out of 2,377)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
1
High Temperature Operating Life
(sorted by FAMILY)
FAMILY
QTR
ASIC
4
LAST 4Q
0
0
1,200
5,415
2
2
1,000
4,343
1
2
200
3,064
1
3
200
2,233
344,000
2,914,828
D-FLASH
4
LAST 4Q
0
600
0
200
0
200
0
198
4
LAST 4Q
0
11
0
11
0
11
0
EEPROM
4
LAST 4Q
0
0
22,282
31,386
0
0
700
2,500
0
0
700
2,500
EPLD
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
EPROM
4
LAST 4Q
0
0
300
1,200
0
0
100
400
FLASH
4
LAST 4Q
0
0
600
2,650
0
0
MICRO
4
LAST 4Q
1
3
5,600
43,556
S-CARD
4
LAST 4Q
0
4
LAST 4Q
VAN DLC
ATMEL
DSP
SRAM
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours WAF
EFR PPM
FITS
45
68
0
0
338
42
218,200
141
0
30
11
11,000
149
0
559
0
0
500
2,000
1,635,936
3,636,528
25
42
0
0
22
6
99
399
0
0
99
399
108,768
437,568
24
38
0
0
351
55
0
0
100
400
0
0
100
400
109,600
438,400
146
251
0
0
57
8
200
1,099
0
0
200
897
0
0
200
897
219,200
1,005,384
139
153
0
0
30
6
0
0
267
2,886
0
0
267
2,416
0
0
97
1,839
437,984
4,158,620
17
116
179
69
272
9
360
0
360
0
224
0
180
224,848
115
0
35
0
0
200
1,513
0
0
50
590
0
0
50
470
0
419
32,200
508,964
3
102
0
0
9,485
18
4
LAST 4Q
1
1
594
1,523
0
0
150
630
0
0
150
475
0
0
145
470
168,812
541,404
3
32
1,684
657
3,993
116
4
LAST 4Q
2
4
31,076
89,414
2
2
2,567
13,419
1
2
1,766
11,056
1
3
1,341
9,046
3,056,500
14,095,744
27
87
64
45
89
9
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
Z94
4
LAST 4Q
0
449
0
245
0
245
0
145
204,792
Z92
4
LAST 4Q
2
3
5,190
39,420
0
0
100
1,119
0
0
100
909
0
0
100
905
Z91
4
LAST 4Q
0
0
200
1,224
0
0
50
501
0
0
50
381
0
Z86
4
LAST 4Q
0
0
347
1,067
0
0
50
520
0
0
50
365
Z83
4
LAST 4Q
0
300
0
100
0
4
LAST 4Q
0
0
600
1,896
2
2
600
1,894
4
LAST 4Q
0
582
0
56K
4
LAST 4Q
0
1
870
4,789
55K
4
LAST 4Q
0
0
4
LAST 4Q
37K
35K
58K
57K
39K
34K
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours WAF
EFR PPM
FITS
395
0
11
344,320
2,780,728
7
115
385
76
1288
13
330
32,200
410,364
3
127
0
0
9485
18
0
0
45
360
61,756
414,796
2
57
0
0
7419
39
100
0
100
109,600
3
0
2787
0
1,090
0
693
100,800
1,026,668
51
83
0
0
604
36
582
0
582
1
579
580,500
99
0
35
0
0
470
2,197
1
2
270
1,860
1
2
200
1,444
287,800
1,833,032
35
33
0
209
308
104
100
1,065
0
0
100
1,065
0
0
100
531
0
200
50,000
455,212
35
114
0
0
524
18
0
600
0
200
0
200
0
198
218,200
141
0
30
4
LAST 4Q
0
0
300
1,200
0
0
100
599
0
0
100
400
0
0
100
400
109,600
462,280
139
132
0
0
60
15
4
LAST 4Q
0
0
2,456
3,756
0
0
200
500
0
0
200
500
0
0
208,288
406,288
26
48
0
0
169
47
4
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
438,400
146
251
0
0
57
8
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
33K
4
LAST 4Q
0
550
0
200
0
197
0
196
213,804
4
LAST 4Q
0
300
0
100
0
100
0
0
4
LAST 4Q
0
100
0
100
0
100
0
19K
4
LAST 4Q
0
0
15,989
24,500
0
0
597
2,597
0
0
596
2,596
15K
4
LAST 4Q
0
0
4,724
6,416
0
0
200
500
0
0
ATMEL
4
LAST 4Q
2
4
31,076
89,414
2
2
2,567
13,419
1
2
26K
25K
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours WAF
EFR PPM
FITS
172
0
25
59,600
41
0
375
0
50,000
41
0
447
0
0
596
2,596
1,334,984
3,647,512
29
56
0
0
24
4
200
500
0
0
200
500
417,152
783,968
24
30
0
0
92
39
1,766
11,056
1
3
1,341
9,046
3,056,500
14,095,744
27
87
64
45
89
9
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
FAMILY
QTR
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
Device-Hours
AF
FITS
D-FLASH
4
LAST 4Q
0
0
50
249
0
0
50
249
0
0
50
249
50,000
249,000
259
259
71
14
EEPROM
4
LAST 4Q
0
0
900
3,300
0
0
900
3,300
0
0
900
3,300
900,000
3,300,000
259
259
4
1
EPLD
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
199
50,000
199,500
259
259
71
18
EPROM
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
FLASH
4
LAST 4Q
0
0
200
550
0
0
200
549
0
0
200
549
200,000
549,168
259
259
18
6
MICRO
4
LAST 4Q
0
0
150
587
0
0
150
587
0
0
150
498
150,000
542,500
259
259
24
7
RF
4
LAST 4Q
0
0
100
100
0
0
100
100
0
0
100
100
100,000
100,000
259
259
35
35
ATMEL
4
LAST 4Q
0
0
1,500
5,186
0
0
1,500
5,185
0
0
1,500
5,095
1,500,000
5,140,168
259
259
2
1
RELIABILITY MONITOR -- ATMEL PROPRIETARY
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
Device-Hours
AF
FITS
56K
4
LAST 4Q
0
0
150
337
0
0
150
337
0
0
150
250
150,000
293,500
259
259
24
12
55K
4
LAST 4Q
0
0
50
50
0
0
50
50
0
0
50
50
50,000
50,000
259
259
71
71
39K
4
LAST 4Q
0
0
50
249
0
0
50
249
0
0
50
249
50,000
249,000
259
259
71
14
37K
4
LAST 4Q
0
0
150
300
0
0
150
300
0
0
150
300
150,000
300,000
259
259
24
12
35K
4
LAST 4Q
0
0
300
500
0
0
300
500
0
0
300
500
300,000
500,000
259
259
12
7
34K
4
LAST 4Q
0
0
50
200
0
0
50
200
0
0
50
200
50,000
200,000
259
259
71
18
33K
4
LAST 4Q
0
150
0
149
0
149
149,168
259
24
19K
4
LAST 4Q
0
0
550
2,600
0
0
550
2,600
0
0
550
2,597
550,000
2,598,500
259
259
6
1
15K
4
LAST 4Q
0
0
200
800
0
0
200
800
0
0
200
800
200,000
800,000
259
259
18
4
ATMEL
4
LAST 4Q
0
0
1,500
5,186
0
0
1,500
5,185
0
0
1,500
5,095
1,500,000
5,140,168
259
259
2
1
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
200 Cycles
REJ
SS
1K Cycles
REJ
SS
% Defective
BQFP
4
LAST 4Q
0
0
77
77
0
0
77
77
0.0%
0.0%
CBGA
4
LAST 4Q
0
0
308
358
0
0
308
358
0.0%
0.0%
CPGA
4
LAST 4Q
0
0
77
154
0
0
77
154
0.0%
0.0%
CQFP
4
LAST 4Q
0
0
77
154
0
0
77
154
0.0%
0.0%
DBGA
4
LAST 4Q
0
154
0
77
0.0%
ICMOD
4
LAST 4Q
0
0
77
231
0
0
77
231
0.0%
0.0%
LQFP / VQFP
4
LAST 4Q
0
0
154
358
0
0
154
279
0.0%
0.0%
PDIL
4
LAST 4Q
0
0
50
199
0
0
50
199
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
177
681
0
0
173
599
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
200
1,175
0
1
150
997
0.0%
0.1%
PQFP
4
LAST 4Q
0
0
154
308
0
0
154
308
0.0%
0.0%
SOIC
4
LAST 4Q
0
0
429
1,418
0
0
379
1,291
0.0%
0.0%
SSOP
4
LAST 4Q
0
0
50
249
0
1
50
249
0.0%
0.4%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Cycle
PACKAGE
QTR
TQFP
4
LAST 4Q
0
50
0
50
0.0%
4
LAST 4Q
0
250
0
249
0.0%
TSSOP
4
LAST 4Q
0
0
154
308
0
0
154
308
0.0%
0.0%
ATMEL
4
LAST 4Q
0
0
1,984
6,124
0
2
1,880
5,580
0.00%
0.03%
TSOP
200 Cycles
REJ
SS
1K Cycles
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Temperature Humidity Bias / HAST
Temperature Humidity Bias
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
HAST
100 Hours
REJ
SS
PACKAGE
QTR
Device-Hours
% Defective
BQFP
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77,000
77,000
0.0%
0.0%
4
LAST 4Q
0
0
308
308
0
0
308
308
0
0
308
308
0
0
308,000
308,000
0.0%
0.0%
4
LAST 4Q
0
177
0
177
0
177
0
0
177,000
0.0%
4
LAST 4Q
0
0
77
277
0
0
77
277
0
0
77
277
0
0
77,000
277,000
0.0%
0.0%
4
LAST 4Q
0
0
154
404
0
0
154
404
0
0
154
403
0
0
154,000
403,500
0.0%
0.0%
4
LAST 4Q
0
145
0
145
0
145
0
0
145,000
0.0%
PDIP
4
LAST 4Q
0
0
100
300
0
0
100
300
0
0
100
300
0
0
100
450
300,000
1,200,000
0.0%
0.0%
PLCC
4
LAST 4Q
0
0
50
791
0
0
50
791
0
691
0
0
150
400
325,000
1,541,000
0.0%
0.0%
4
LAST 4Q
0
0
154
354
0
0
154
354
0
0
154
354
0
0
154,000
354,000
0.0%
0.0%
SOIC
4
LAST 4Q
0
0
352
1,402
0
0
352
1,402
0
0
302
1,352
0
0
50
98
427,000
1,573,000
0.0%
0.0%
SSOP
4
LAST 4Q
0
0
50
250
0
0
50
250
0
0
50
250
0
0
50,000
250,000
0.0%
0.0%
4
LAST 4Q
0
0
0
0
0
0
0
248
496,000
0.0%
4
LAST 4Q
0
0
154
354
0
0
154
354
0
0
154
354
0
0
154,000
354,000
0.0%
0.0%
4
LAST 4Q
0
0
1,476
4,839
0
0
1,476
4,839
0
0
1,376
4,688
0
0
300
1,196
2,026,000
7,155,500
0.0%
0.0%
CBGA
DBGA
ICMOD
LQFP / VQFP
PDIL
PQFP
TSOP
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Steam Pressure Pot
PACKAGE
QTR
96 Hours
REJ
SS
168 Hours
REJ
SS
% Defective
BQFP
4
LAST 4Q
0
0
100
100
0
0
100
100
0.0%
0.0%
CBGA
4
LAST 4Q
0
0
400
450
0
0
400
450
0.0%
0.0%
CPGA
4
LAST 4Q
0
0
100
100
0
0
100
100
0.0%
0.0%
CQFP
4
LAST 4Q
0
0
100
100
0
0
100
100
0.0%
0.0%
DBGA
4
LAST 4Q
0
154
0
77
0.0%
ICMOD
4
LAST 4Q
0
0
100
100
0
0
100
100
0.0%
0.0%
LQFP / VQFP
4
LAST 4Q
0
0
200
427
0
0
200
277
0.0%
0.0%
PDIL
4
LAST 4Q
0
0
50
200
0
0
0.0%
0.0%
PDIP
4
LAST 4Q
0
0
177
681
0
0
177
604
0.0%
0.0%
PLCC
4
LAST 4Q
0
3
200
1,100
0
0
150
650
0.0%
0.3%
PQFP
4
LAST 4Q
0
0
200
400
0
0
200
400
0.0%
0.0%
SOIC
4
LAST 4Q
1
1
500
1,426
0
0
350
927
0.2%
0.1%
SSOP
4
LAST 4Q
0
0
50
100
0
0
0.0%
0.0%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Steam Pressure Pot
PACKAGE
QTR
TQFP
4
LAST 4Q
0
50
0
50
0.0%
4
LAST 4Q
0
250
0
250
0.0%
TSSOP
4
LAST 4Q
0
0
200
354
0
0
200
354
0.0%
0.0%
ATMEL
4
LAST 4Q
1
4
2,377
5,992
0
0
2,077
4,439
0.04%
0.07%
TSOP
96 Hours
REJ
SS
168 Hours
REJ
SS
% Defective
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Failure Description Detail
Q1 - 2002
a.
b.
High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, Z92,
PLCC 44: Passivation crack.
High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 57K,
CBGA 280: Root cause investigation currently in progress.
Q2 - 2002
a.
b.
c.
d.
e.
High Temperature Operating Life, 1 failure, 500-hour read point, ASIC, 56K, FBGA
280: Root cause investigation currently in progress.
High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K,
FBGA 280: Root cause investigation currently in progress.
Temperature Cycle, 1 failure, 1000-cycle read point, SRAM, Z91, SSOP 44:
Passivation crack.
Temperature Cycle, 1 failure, 1000-cycle read point, MICRO, 56K, PLCC 44: Lifted
ball bond with cratering. Wiring process optimized.
Steam Pressure Pot, 1 failure, 96-hour read point, MICRO, 56K, PLCC 44: Lifted
ball bond with cratering. Dry packing (downgrading from MSL1 to MSL3).
Q3 - 2002
a.
b.
High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, 56K,
SOIC 28: Metal scratch. Inspection reinforced.
Steam Pressure Pot, 2 failures, 96-hour read point, MICRO, 56K, PLCC 44: Lifted
ball bond (metal peeling). Dry packing (downgrading from MSL1 to MSL3).
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12
Failure Description Detail
Q4 - 2002
a.
b.
c.
d.
e.
f.
High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, Z92,
PLCC 44: Poly spacer defect. Process modul optimized.
High Temperature Operating Life, 1 failure, 48-hour read point, VAN DLC, Z92,
SOIC 28: Implant damage. Implant tilt angle modified from 7° to 0° and N+ PR
strip optimized.
High Temperature Operating Life, 2 failures, 168-hour read point, ASIC, 58K,
LQFP 100: Root cause investigation currently in progress.
High Temperature Operating Life, 1 failure, 500-hour read point, ASIC, 56K, FBGA
280: Root cause investigation currently in progress.
High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K,
FBGA 280: Root cause investigation currently in progress.
Steam Pressure Pot, 1 failure, 96-hour read point, MICRO, 56K, SOIC 28: Lifted ball
bond (metal peeling). Dry packing (downgrading from MSL1 to MSL3).
RELIABILITY MONITOR -- ATMEL PROPRIETARY
13
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µ
µ m]
TYPICAL PRODUCTS / APPLICATIONS
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
15.3
19.3
19.5
19.6
19.7
EEPROM
EEPROM
Embedded Memory Configurator
Embedded Memory
EPLD
19.76
19.8
19.9
25
26
33.5
34
35.5
37
39
39.1
EPLD
Embedded Memory Configurator
Embedded Memory
BiCMOS
Logic
FLASH
EPROM
Embedded Memory Configurator
EEPROM
EEPROM
EEPROM
sEEPROM
sEEPROM
Configurator
sEEPROM, MC (Intel core), MC (AVR core)
PLD
PLD
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
ASIC
ASIC
42
55
BiCMOS
Logic
56
56.8
57.5
Z86
Z92
Logic
Embedded Memory
CMOS
CMOS Digital
CMOS Digital
Z94
CMOS + EPROM
1.8 - 2.3
1.1
1.0
0.7
0.5
0.5
0.7
0.7
1.0
0.7
0.5
0.5
0.35
0.35
0.25
0.25
0.6
0.5
0.35
0.35
0.21
0.8
0.5
0.5
5
5
5
5
7
NTO
NTO
NTO
EPROM
Configurators, sEEPROM, FLASH, Microcontroller, EPLD
FLASH, PEROM, DATA FLASH, sEEPROM
DATA FLASH
FLASH, DATA FLASH
ASIC
ASIC
ASIC
ASIC
Watchdog, Processor
Memories, Microcontrollers
Micro OTP, EPROM
RELIABILITY MONITOR -- ATMEL PROPRIETARY
14
Failure Rate Calculations
Failure Rate:
χ2
λ
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
=
α
(1 −
, 2⋅n + 2 )
100
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= e Z⋅
[ VS
− Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
15
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage
(commonly 30% above nominal), and dynamic bias conditions. Readouts at
various time points are taken to determine the Early Failure Rate (EFR) and
Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million
(DPPM) and IFR is expressed in Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
16
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