Application Notes

AN11299
BGA301x - 40 MHz to 1006 MHz push-pull application
Rev. 2 — 21 August 2013
Application note
Document information
Info
Content
Keywords
BGA3012, BGA3015, BGA3018, evaluation board, CATV, drop
amplifier, push-pull, wideband
Abstract
This application note describes the schematic and layout requirements
for using the BGA301x family as a wideband push-pull amplifier
between 40 MHz and 1006 MHz.
AN11299
NXP Semiconductors
BGA301x - 40 MHz to 1006 MHz push-pull application
Revision history
Rev
Date
Description
2
20130821
A correction has been made to the document title
1
20130614
First publication
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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BGA301x - 40 MHz to 1006 MHz push-pull application
1. Introduction
The customer evaluation boards OM7866, OM7867 and OM7868 enable the user to
evaluate the performance of the BGA301x wideband CATV MMIC amplifier family in a
push-pull circuit environment.
The BGA3012, BGA3015 and BGA3018 performance information is available in the
available datasheets.
This application note describes the evaluation board schematic and layout requirements
for using the BGA3012, BGA3015 or BGA3018 as a wideband push-pull amplifier
between 40 MHz and 1006 MHz. The push-pull configuration gives a significant second
order distortion improvement over a single ended solution.
The BGA301x family is fabricated in the BiCMOS process and packaged in a lead-free 3pin SOT89 package. The amplifier MMIC comprises a two stage amplifier with internal
bias network designed for a frequency range of 5 MHz to 1006 MHz with a supply
voltage between 5 V and 8 V.
2. System features





Improved OIP2 and CSO compared to single ended solution
75 Ω input and output impedance
Excellent input and output return loss
Flat gain between 40 MHz and 1006 MHz
Unconditionally stable
3. Customer evaluation kit contents
The BGA3012 evaluation kit (OM7866) contains the following items:
- ESD safe casing
- BGA3012 push-pull evaluation board
- BGA3012 SOT89 samples
The BGA3015 evaluation kit (OM7867) contains the following items:
- ESD safe casing
- BGA3015 push-pull evaluation board
- BGA3015 SOT89 samples
The BGA3018 evaluation kit (OM7868) contains the following items:
- ESD safe casing
- BGA3018 push-pull evaluation board
- BGA3018 SOT89 samples
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BGA301x - 40 MHz to 1006 MHz push-pull application
4. Application Information
For evaluation purposes an evaluation board is available. The evaluation circuit can be
seen in figure 1 and the corresponding PCB is shown in figure 2. Table 1 shows the bill
of materials.
4.1 Evaluation board circuit
Fig 1.
BGA301x Push-Pull evaluation circuit
The power supply is applied on the center pin of connector J3 and is applied to U1 and
U2 via impedance transformer T3. Capacitors C12, C13 and C8 are supply decoupling
capacitors.
At the F-connector J1 the RF input signal is applied where capacitor C1 provides DCblocking, followed by L1 for input matching (Z = 75 Ω). The single ended unbalanced 75
Ω signal then need to be converted into two 75 Ω balanced signals to supply both drop
amplifiers U1 and U2. This is done in two steps. First the 75 Ω unbalanced signal is
converted in a 75 Ω balanced signal by balun transformer T1. Second the 75 Ω balanced
signal is converted into two 75 Ω balanced signals by impedance transformer T2. Both
RF signals are supplied to the drop amplifiers U1 and U2 via DC-blocking capacitors C4
and C5.
The amplifier circuits and layout designs of U1 and U2 are identical. Resistors R1, R2,
R3 and R4 set the gain of both amplifiers. Inductors L2 and L3 give a flat gain from 40
MHz up to 1006 MHz. Capacitors C6 and C7 provide DC-blocking between the input and
output of the drop amplifiers U1 and U2.
The two 75 Ω balanced signals coming from the outputs of U1 and U2 are converted
back into one 75 Ω balanced signal by transformer T3. Balun transformer T4 converts the
75 Ω balanced signal back into the needed unbalanced 75 Ω signal, where capacitor C9
and inductor L4 provide the output matching (Z = 75 Ω). Capacitor C10 and C11 are
used for DC-blocking before the RF signal is available at F-connector J2.
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BGA301x - 40 MHz to 1006 MHz push-pull application
4.2 Evaluation board layout
The evaluation board layout is the same for BGA3012, BGA3015 and BGA3018
PCB material
PCB thickness
PCB size
εr
Copper thickness
Fig 2.
= FR4
= 1.5 mm
= 40 mm x 40 mm
= 4.6
= 35 µm
BGA301x Push-Pull evaluation board layout
For optimum distortion performance it is important to have enough ground vias
underneath and around the MMICs ground pins. This lowers the inductance to the
ground plane. The evaluation board is made with two layer FR4 material.
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BGA301x - 40 MHz to 1006 MHz push-pull application
4.3 Bill of materials (BoM)
All three drop amplifier boards use the same PCB board design, but use slightly different
component values for each drop amplifier type.
4.3.1 BGA3012 Push-Pull BoM
Table 1.
BGA3012 Push-Pull BoM
Circuit
Description Qty Mfr
Reference
Manufacturer number Supplier
Supplier part
number
U1, U2
BGA3012
1
NXP
BGA3012
NXP
BGA3012
T1, T4
Balun
2
Toko
#617DB-1655=P3
Toko
#617DB-1655=P3
T2, T3
Transformer
2
Toko
#617PS-40369=P3
Toko
#617PS40369=P3
C1, C4, C5,
10 nF
10
Murata
GRM155R71E103KA01D
Digikey
490-1312-1-ND
C3
NA
-
-
-
-
-
C9
0.82 pF
1
Phycomp 223886915827
RS
components
616-9357
L1, L4
1.8 nH
2
Murata
LQG15HS1N8S02D
Digikey
490-2613-1-ND
L2, L3
15nH
2
Murata
LQG15HS15NJ02D
Digikey
490-2625-1-ND
R1, R2
330 Ω
2
Yageo
RC0402FR-07330RL
Digikey
311-330LRCT-ND
R3, R4
180 Ohm
2
Yageo
RC0402FR-07180RL
Digikey
311-180LRCT-ND
J1, J2
75 Ω Fconnector
2
Bomar
861V509ER6
Mouser
678-861V509ER6
J3
Header 3
1
Molex
90121-0763
Digikey
WM8109-ND
C6, C7, C8,
C10, C11,
C12, C13
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BGA301x - 40 MHz to 1006 MHz push-pull application
4.3.2 BGA3015 Push-Pull BoM
Table 2.
BGA3015 Push-Pull BoM
Circuit
Description Qt Mfr
Reference
y
Manufacturer number
Supplier
Supplier part
number
U1, U2
BGA3015
1
NXP
BGA3015
NXP
BGA3015
T1, T4
Balun
2
Toko
#617DB-1655=P3
Toko
#617DB-1655=P3
T2, T3
Transformer
2
Toko
#617PS-40369=P3
Toko
#617PS40369=P3
C1, C4, C5,
10 nF
10
Murata
GRM155R71E103KA01D
Digikey
490-1312-1-ND
C3
NA
-
-
-
-
-
C9
0.82 pF
1
Phycomp 223886915827
RS
components
616-9357
L1, L4
1.8 nH
2
Murata
LQG15HS1N8S02D
Digikey
490-2613-1-ND
L2, L3
22nH
2
Murata
LQG15HS22NJ02D
Digikey
490-2627-1-ND
R1, R2
390 Ω
2
Yageo
RC0402FR-07390RL
Digikey
311-390LRCT-ND
R3, R4
220 Ohm
2
Yageo
RC0402FR-07220RL
Digikey
311-220LRCT-ND
J1, J2
75 Ω Fconnector
2
Bomar
861V509ER6
Mouser
678-861V509ER6
J3
Header 3
1
Molex
90121-0763
Digikey
WM8109-ND
C6, C7, C8,
C10, C11,
C12, C13
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BGA301x - 40 MHz to 1006 MHz push-pull application
4.3.3 BGA3018 Push-Pull BoM
Table 3.
BGA3018 Push-Pull BoM
Circuit
Description Qty Mfr
Reference
Manufacturer number Supplier
Supplier part
number
U1, U2
BGA3018
1
NXP
BGA3018
NXP
BGA3018
T1, T4
Balun
2
Toko
#617DB-1655=P3
Toko
#617DB-1655=P3
T2, T3
Transformer
2
Toko
#617PS-40369=P3
Toko
#617PS40369=P3
C1, C4, C5,
10 nF
10
Murata
GRM155R71E103KA01D
Digikey
490-1312-1-ND
C3
NA
-
-
-
-
-
C9
0.82 pF
1
Phycomp 223886915827
RS
components
616-9357
L1, L4
1.8 nH
2
Murata
LQG15HS1N8S02D
Digikey
490-2613-1-ND
L2, L3
27nH
2
Murata
LQG15HS27NJ02D
Digikey
490-2628-1-ND
R1, R2
390 Ω
2
Yageo
RC0402FR-07390RL
Digikey
311-390LRCT-ND
R3, R4
470 Ohm
2
Yageo
RC0402FR-07470RL
Digikey
311-470LRCT-ND
J1, J2
75 Ω Fconnector
2
Bomar
861V509ER6
Mouser
678-861V509ER6
J3
Header 3
1
Molex
90121-0763
Digikey
WM8109-ND
C6, C7, C8,
C10, C11,
C12, C13
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BGA301x - 40 MHz to 1006 MHz push-pull application
5. BGA301x Push-Pull measurement results
5.1 BGA301x measurement results at Vcc = 8 V
5.1.1 S-Parameters
0
‐5
(3) (2) (1) S11[dB]
‐10
‐15
‐20
‐25
‐30
40
140
240
340
440
540
640
740
840
940
1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 3.
Input matching (S11); Vcc = 8 V
0
‐5
(3) (2) (1) S22[dB]
‐10
‐15
‐20
‐25
‐30
40
140
240
340
440
540
640
740
840
940 1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 4.
AN11299
Application note
Output matching (S22); Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
20
19
18
(3)
S21[dB]
17
16
15
(2)
14
13
(1)
12
11
10
40
140
240
340
440
540
640
740
840
940
1040
740
840
940
1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 5.
Gain (S21); Vcc = 8 V
2.0
(3) (2) (1) K‐Factor
1.5
1.0
0.5
40
140
240
340
440
540
640
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 6.
AN11299
Application note
K-factor; Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.1.2 Distortion
‐70
‐72
(1) (2) (3)
‐74
CTB [dBc]
‐76
‐78
‐80
‐82
‐84
‐86
‐88
‐90
0
200
400
600
800
1000
800
1000
Frequency [MHz]
Tamb = +25 °C ; 132 channels NTSC , Vo = 30 dBmV
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 7.
Composite triple beat (CTB); Vcc = 8 V
‐80
CSO [dBc]
‐82
(1) (2) (3)
‐84
‐86
‐88
‐90
0
200
400
600
Frequency [MHz]
Tamb = +25 °C ; 132 channels NTSC , Vo = 30 dBmV
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 8.
AN11299
Application note
Composite second order (CSO); Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
‐65
‐67
XMOD [dBc]
(1) (2) (3)
‐69
‐71
‐73
‐75
0
200
400
600
800
1000
Frequency [MHz]
Tamb = +25 °C ; 132 channels NTSC , Vo = 30 dBmV
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 9.
AN11299
Application note
Cross modulation (XMOD); Vcc = 8V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.1.3 Noise figure
6.0
Noise Figure [dB]
5.5
(1) (2) (3)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
40
240
440
640
840
1040
Frequency [MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 10. Noise figure; Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.1.4 Output P1dB
28
Output P1dB [dBm]
(1) (2) (3)
27
26
25
24
23
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 11. Output P1dB; Vcc = 8V
5.1.5 Output IP2
90
Output IP2 [dBm]
85
(1) (2) (3)
80
75
70
65
60
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
f2 = f1 ± 6MHz
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 12. Output IP2; Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.1.6 Output IP3
60
Output IP3 [dBm]
55
50
(1) (2) (3)
45
40
35
30
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
f2 = f1 ± 6MHz
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 13. Output IP3; Vcc = 8 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.2 BGA301x measurement results at Vcc = 5 V
5.2.1 S-Parameters
0
‐5
(3) (2) (1) S11[dB]
‐10
‐15
‐20
‐25
‐30
40
140
240
340
440
540
640
740
840
940
1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 14. Input matching (S11); Vcc = 5 V
0
‐5
(3) (2) (1) S22[dB]
‐10
‐15
‐20
‐25
‐30
40
140
240
340
440
540
640
740
840
940 1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 15. Output matching (S22); Vcc = 5 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
20
19
18
(3)
S21[dB]
17
16
15
(2)
14
13
(1)
12
11
10
40
140
240
340
440
540
640
740
840
940
1040
740
840
940
1040
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 16. Gain (S21); Vcc = 5 V
2.0
(3) (2) (1) K‐Factor
1.5
1.0
0.5
40
140
240
340
440
540
640
Frequency[MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 17. K-factor; Vcc = 5 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.2.2 Distortion
‐70
‐72
‐74
CTB [dBc]
‐76
‐78
(1) (2) (3)
‐80
‐82
‐84
‐86
‐88
‐90
0
200
400
600
800
1000
800
1000
Frequency [MHz]
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 18. Composite triple beat (CTB); Vcc = 5 V
‐70
‐72
‐74
CSO [dBc]
‐76
(1) (2) (3)
‐78
‐80
‐82
‐84
‐86
‐88
‐90
0
200
400
600
Frequency [MHz]
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 19. Composite second order (CSO); Vcc = 5 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
‐65
XMOD [dBc]
‐67
(1) (2) (3)
‐69
‐71
‐73
‐75
0
200
400
600
800
1000
Frequency [MHz]
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 20. Cross modulation (XMOD); Vcc = 5 V
5.2.3 Noise figure
6.0
Noise Figure [dB]
5.5
(1) (2) (3)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
40
240
440
640
840
1040
Frequency [MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 21. Noise figure; Vcc = 5 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.2.4 Output P1dB
24
Output P1dB [dBm]
23
(1) (2) (3)
22
21
20
19
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 22. Output P1dB; Vcc = 5 V
5.2.5 Output IP2
90
Output IP2 [dBm]
85
(3) (2) (1)
80
75
70
65
60
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
f2 = f1 ± 6MHz
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 23. Output IP2; Vcc = 5 V
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BGA301x - 40 MHz to 1006 MHz push-pull application
5.3 Output IP3
60
Output IP3 [dBm]
55
(1) (2) (3)
50
45
40
35
30
0
200
400
600
800
1000
1200
Frequency [MHz]
Tamb = +25 °C
f2 = f1 ± 6MHz
(1) BGA3012
(2) BGA3015
(3) BGA3018
Fig 24. Output IP3; Vcc = 5 V
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6. Abbreviations
Table 2. Abbreviations
AN11299
Application note
Acronym
Description
AC
Alternating Current
CATV
Community Antenna TeleVision
DC
Direct Current
ESD
Electro Static Discharge
MMIC
Monolithic Microwave Integrated Circuit
NTSC
National Television Standards Committee
PCB
Printed Circuit Board
RF
Radio Frequency
SMD
Surface Mounted Device
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7. Legal information
7.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
7.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
AN11299
Application note
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express,
implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire
risk as to the quality, or arising out of the use or performance, of this product
remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be
liable to customer for any special, indirect, consequential, punitive or
incidental damages (including without limitation damages for loss of
business, business interruption, loss of use, loss of data or information, and
the like) arising out the use of or inability to use the product, whether or not
based on tort (including negligence), strict liability, breach of contract, breach
of warranty or any other theory, even if advised of the possibility of such
damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by
customer for the product or five dollars (US$5.00). The foregoing limitations,
exclusions and disclaimers shall apply to the maximum extent permitted by
applicable law, even if any remedy fails of its essential purpose.
7.3 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are property of their respective owners.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 August 2013
© NXP B.V. 2013. All rights reserved.
23 of 26
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BGA301x - 40 MHz to 1006 MHz push-pull application
8. List of figures
Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Fig 19. Fig 20. Fig 21. Fig 22. Fig 23. Fig 24. BGA301x Push-Pull evaluation circuit ............... 4 BGA301x Push-Pull evaluation board layout .... 5 Input matching (S11); Vcc = 8 V ....................... 9 Output matching (S22); Vcc = 8 V..................... 9 Gain (S21); Vcc = 8 V ..................................... 10 K-factor; Vcc = 8 V .......................................... 10 Composite triple beat (CTB); Vcc = 8 V .......... 11 Composite second order (CSO); Vcc = 8 V .... 11 Cross modulation (XMOD); Vcc = 8V.............. 12 Noise figure; Vcc = 8 V ................................... 13 Output P1dB; Vcc = 8V ................................... 14 Output IP2; Vcc = 8 V ..................................... 14 Output IP3; Vcc = 8 V ..................................... 15 Input matching (S11); Vcc = 5 V ..................... 16 Output matching (S22); Vcc = 5 V................... 16 Gain (S21); Vcc = 5 V ..................................... 17 K-factor; Vcc = 5 V .......................................... 17 Composite triple beat (CTB); Vcc = 5 V .......... 18 Composite second order (CSO); Vcc = 5 V .... 18 Cross modulation (XMOD); Vcc = 5 V............. 19 Noise figure; Vcc = 5 V ................................... 19 Output P1dB; Vcc = 5 V .................................. 20 Output IP2; Vcc = 5 V ..................................... 20 Output IP3; Vcc = 5 V ..................................... 21 AN11299
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 August 2013
© NXP B.V. 2013. All rights reserved.
24 of 26
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NXP Semiconductors
BGA301x - 40 MHz to 1006 MHz push-pull application
9. List of tables
Table 1. Table 2. Table 3. BGA3012 Push-Pull BoM .................................. 6 BGA3015 Push-Pull BoM .................................. 7 BGA3018 Push-Pull BoM .................................. 8 AN11299
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 August 2013
© NXP B.V. 2013. All rights reserved.
25 of 26
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NXP Semiconductors
BGA301x - 40 MHz to 1006 MHz push-pull application
10. Contents
1. 2. 3. 4. 4.1 4.2 4.3 4.3.1 4.3.2 4.3.3 5. 5.1 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 5.2 5.2.1 5.2.2 5.2.3 5.2.4 5.2.5 5.3 6. 7. 7.1 7.2 7.3 8. 9. 10. Introduction ......................................................... 3 System features................................................... 3 Customer evaluation kit contents ...................... 3 Application Information ...................................... 4 Evaluation board circuit ...................................... 4 Evaluation board layout ...................................... 5 Bill of materials (BoM) ........................................ 6 BGA3012 Push-Pull BoM ................................... 6 BGA3015 Push-Pull BoM ................................... 7 BGA3018 Push-Pull BoM ................................... 8 BGA301x Push-Pull measurement results ........ 9 BGA301x measurement results at Vcc = 8 V ..... 9 S-Parameters ..................................................... 9 Distortion .......................................................... 11 Noise figure ...................................................... 13 Output P1dB..................................................... 14 Output IP2 ........................................................ 14 Output IP3 ........................................................ 15 BGA301x measurement results at Vcc = 5 V ... 16 S-Parameters ................................................... 16 Distortion .......................................................... 18 Noise figure ...................................................... 19 Output P1dB..................................................... 20 Output IP2 ........................................................ 20 Output IP3 ........................................................ 21 Abbreviations .................................................... 22 Legal information .............................................. 23 Definitions ........................................................ 23 Disclaimers....................................................... 23 Trademarks ...................................................... 23 List of figures..................................................... 24 List of tables ...................................................... 25 Contents ............................................................. 26 Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP B.V. 2013.
All rights reserved.
For more information, visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 August 2013
Document identifier: AN11299
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