Application Notes

AN11295
BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier
application
Rev. 1 — 14 February 2013
Application note
Document information
Info
Content
Keywords
BGA3018, Evaluation board, CATV, Drop amplifier
Abstract
This application note describes the schematic and layout requirements
for using the BGA3018 as a CATV reverse amplifier.
AN11295
NXP Semiconductors
BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
Revision history
Rev
Date
Description
1
First publication
20130214
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
AN11295
Application note
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
1. Introduction
The BGA3018 customer evaluation board enables the user to evaluate the performance
of the wideband CATV MMIC amplifier BGA3018.
The BGA3018 performance information is available in the BGA3018 datasheet.
This application note describes the evaluation board schematic and layout requirements
for using the BGA3018 as a CATV return path amplifier between 5 MHz and 300 MHz.
The BGA3018 is fabricated in the BiCMOS process and packaged in a lead-free 3-pin
SOT89 package. The BGA3018 is surface-mounted on an evaluation board with element
matching and DC decoupling circuitry. The amplifier MMIC comprises a two stage
amplifier with internal bias network and operates over a frequency range of 5 MHz to
1003 MHz with a supply voltage between 5 V and 8 V.
2. System features
•
•
•
•
•
•
•
•
18 dB gain
Internally biased
Flat gain between 5 MHz and 300 MHz
Noise figure of 2.2 dB
High linearity with an IP3O of 40 dBm and IP2O of 60 dBm
75 Ω input and output impedance
Unconditionally stable
Excellent input and output return loss
3. Customer evaluation kit contents
The evaluation kit contains the following items:
• ESD safe casing
• BGA3018 evaluation board
• BGA3018 SOT89 samples
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
4. Application Information
For evaluation purposes an evaluation board is available. The evaluation circuit can be
seen in figure 1 and the corresponding PCB is shown in figure 2. Table 1 shows the bill
of materials.
4.1 Evaluation board circuit
Fig 1.
BGA3018 evaluation circuit
The power supply is applied on the center pin of connector J3 and is applied to the MMIC
via choke L2 which provides RF blocking to the supply line. Capacitors C4 and C5 are
supply decoupling capacitors.
At the F-connector J1 the RF input signal is applied where capacitor C1 provides DCblocking. Resistors R1 and R2 are used as feedback resistors to set the gain and slope.
Two resistors are used to lower the influence of the parasitic capacitance from the circuit
board. Capacitor C2 provides DC-blocking between the input and output of the MMIC.
Capacitor C3 provides DC-blocking before the RF signal is available at F-connector J2.
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
4.2 Evaluation board layout
PCB material
PCB thickness
PCB size
εr
Copper thickness
Fig 2.
= FR4
= 1.5 mm
= 40 mm x 40 mm
= 4.6
= 35 µm
BGA3018 evaluation board layout
For optimum distortion performance it is important to have enough ground vias
underneath and around the MMICs ground pins. This lowers the inductance to the
ground plane. The evaluation board is made with two layer FR4 material.
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
4.3 Bill of materials
Table 1.
Evaluation board BoM
Circuit
Description Qty Mfr
Reference
Manufacturer number
Supplier Supplier part
number
U1
BGA3018
1
NXP
BGA3018
NXP
BGA3018
C1, C2,
10 nF
4
Murata
GRM155R71E103KA01D
Digikey
490-1312-1-ND
C5
100 pF
1
Murata
GRM1555C1H101JZ01D
Digikey
490-3458-1-ND
L2
22uH
1
Murata
LQH31CN220K03L
Digikey
LQH31CN220K03L-ND
R1
470 Ω
1
Yageo
RC0402FR-07470RL
Digikey
311-470LRCT-ND
R2
300 Ω
1
Yageo
RC0402FR-07300RL
Digikey
311-300LRCT-ND
J1, J2
75 Ω Fconnector
2
Bomar
861V509ER6
Mouser
678-861V509ER6
J3
Header 3
1
Molex
90121-0763
Digikey
WM8109-ND
C3, C4
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
5. Measurement results at Vcc = 8 V
-10
-12
-14
S11[dB]
-16
-18
-20
-22
(1) (2) (3)
-24
-26
-28
-30
5
55
105
155
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 3.
Input matching (S11); Vcc = 8 V
-10
-12
-14
S22[dB]
-16
-18
-20
-22
(1) (2) (3)
-24
-26
-28
-30
5
55
105
155
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 4.
AN11295
Application note
Output matching (S22): Vcc = 8 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
21
(1) (2) (3)
20
S21[dB]
19
18
17
16
15
5
55
105
155
205
255
305
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 5.
Gain (S21); Vcc = 8 V
1.3
1.2
K-Factor
1.1
1
(1) (2) (3)
0.9
0.8
0.7
5
55
105
155
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 6.
AN11295
Application note
K-factor; Vcc = 8 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
3.0
2.8
(1)
Noise figure [dB]
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0
50
100
150
200
250
300
Frequency [MHz]
(1) Tamb = +25 °C
Fig 7.
AN11295
Application note
Noise figure; Vcc = 8 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
Table 2.
Symbol
NF
PL(1dB)
IP3O
IP2O
[1]
Measurement results at Vcc = 8 V
Conditions
-40 °C
+25 °C
+85 °C
At 10 MHz
1.8
2.1
2.1
dB
At 300 MHz
1.9
2.2
2.3
dB
At 40 MHz
Unit
24.5
24.5
24.5
dBm
At 34 MHz
[1]
46.5
45.0
44.0
dBc
At 74 MHz
[1]
46.5
45.5
44.0
dBc
At 114 MHz
[1]
47.0
45.5
44.0
dBc
At 154 MHz
[1]
47.0
44.5
43.0
dBc
At 194 MHz
[1]
45.5
43.5
41.5
dBc
At 234 MHz
[1]
44.5
42.5
40.5
dBc
At 274 MHz
[1]
44.0
42.0
40.0
dBc
At 86 MHz
[2]
63.0
61.0
60.0
dBc
At 166 MHz
[2]
63.0
61.0
59.0
dBc
At 246 MHz
[2]
63.0
61.0
59.0
dBc
The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation
product (IM3) is 2 x f2 – f1, where f2 = f1 ± 6 MHz. Input power Pi = -20 dBm.
[2]
The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation
product (IM20 is |f2 – f1|, with 40 MHz < |f1 – f2| < 300 MHz. Input power Pi = -20 dBm.
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
6. Measurement results at Vcc = 5V
-10
-12
-14
S11[dB]
-16
-18
-20
-22
(1) (2) (3)
-24
-26
-28
-30
5
55
105
155
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 8.
Input matching (S11); Vcc = 5 V
-10
-12
-14
S22[dB]
-16
-18
-20
-22
(1) (2) (3)
-24
-26
-28
-30
5
55
105
155
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 9.
AN11295
Application note
Output matching (S22): Vcc = 5 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
21
(1) (2) (3)
20
S21[dB]
19
18
17
16
15
5
55
105
155
205
255
305
205
255
305
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 10. Gain (S21); Vcc = 5 V
1.3
1.2
K-Factor
1.1
1
(1) (2) (3)
0.9
0.8
0.7
5
55
105
155
Frequency[MHz]
(1) Tamb = -40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 11. K-factor; Vcc = 5 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
3.0
2.8
Noise figure [dB]
2.6
(1)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0
50
100
150
200
250
300
Frequency [MHz]
(1) Tamb = +25 °C
Fig 12. Noise figure; Vcc = 5 V
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
Table 3.
Symbol
NF
PL(1dB)
IP3O
IP2O
[1]
Measurement results at Vcc = 5 V
Conditions
-40 °C
+25 °C
+85 °C
Unit
At 10 MHz
1.8
1.9
1.9
dB
At 300 MHz
2.0
2.0
2.1
dB
At 40 MHz
19.5
19.0
19.5
dBm
At 34 MHz
[1]
41.0
40.0
39.0
dBc
At 74 MHz
[1]
41.0
40.5
39.0
dBc
At 114 MHz
[1]
41.5
40.0
38.5
dBc
At 154 MHz
[1]
41.0
39.5
38.0
dBc
At 194 MHz
[1]
40.5
38.5
37.0
dBc
At 234 MHz
[1]
39.5
38.0
36.5
dBc
At 274 MHz
[1]
39.0
37.5
36.0
dBc
At 86 MHz
[2]
57.5
55.0
53.5
dBc
At 166 MHz
[2]
57.0
54.5
53.0
dBc
At 246 MHz
[2]
57.0
54.5
53.0
dBc
The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation
product (IM3) is 2 x f2 – f1, where f2 = f1 ± 6 MHz. Input power Pi = -20 dBm.
[2]
The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation
product (IM20 is |f2 – f1|, with 40 MHz < |f1 – f2| < 300 MHz. Input power Pi = -20 dBm.
[3]
AN11295
Application note
Measured with 10 NTSC channels Vo = 30 dBmV.
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7. Abbreviations
Table 2. Abbreviations
AN11295
Application note
Acronym
Description
AC
Alternating Current
CATV
Community Antenna TeleVision
DC
Direct Current
ESD
Electro Static Discharge
MMIC
Monolithic Microwave Integrated Circuit
NTSC
National Television Standards Committee
PCB
Printed Circuit Board
RF
Radio Frequency
SMD
Surface Mounted Device
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8. Legal information
8.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
8.2 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s
own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
AN11295
Application note
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express,
implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire
risk as to the quality, or arising out of the use or performance, of this product
remains with customer.
In no event shall NXP Semiconductors, its affiliates or their suppliers be
liable to customer for any special, indirect, consequential, punitive or
incidental damages (including without limitation damages for loss of
business, business interruption, loss of use, loss of data or information, and
the like) arising out the use of or inability to use the product, whether or not
based on tort (including negligence), strict liability, breach of contract, breach
of warranty or any other theory, even if advised of the possibility of such
damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by
customer for the product or five dollars (US$5.00). The foregoing limitations,
exclusions and disclaimers shall apply to the maximum extent permitted by
applicable law, even if any remedy fails of its essential purpose.
8.3 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
9. List of figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
BGA3018 evaluation circuit ............................... 4
BGA3018 evaluation board layout .................... 5
Input matching (S11); Vcc = 8 V ....................... 7
Output matching (S22): Vcc = 8 V .................... 7
Gain (S21); Vcc = 8 V ....................................... 8
K-factor; Vcc = 8 V ............................................ 8
Noise figure; Vcc = 8 V ..................................... 9
Input matching (S11); Vcc = 5 V ..................... 11
Output matching (S22): Vcc = 5 V .................. 11
Gain (S21); Vcc = 5 V ..................................... 12
K-factor; Vcc = 5 V .......................................... 12
Noise figure; Vcc = 5 V ................................... 13
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
10. List of tables
Table 1.
Table 2.
Table 3.
Evaluation board BoM....................................... 6
Measurement results at Vcc = 8 V .................. 10
Measurement results at Vcc = 5 V .................. 14
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BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application
11. Contents
1.
2.
3.
4.
4.1
4.2
4.3
5.
6.
7.
8.
8.1
8.2
8.3
9.
10.
11.
Introduction ......................................................... 3
System features................................................... 3
Customer evaluation kit contents ...................... 3
Application Information ...................................... 4
Evaluation board circuit ...................................... 4
Evaluation board layout...................................... 5
Bill of materials ................................................... 6
Measurement results at Vcc = 8 V...................... 7
Measurement results at Vcc = 5V..................... 11
Abbreviations .................................................... 15
Legal information .............................................. 16
Definitions ........................................................ 16
Disclaimers....................................................... 16
Trademarks ...................................................... 16
List of figures..................................................... 17
List of tables ...................................................... 18
Contents ............................................................. 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP B.V. 2013.
All rights reserved.
For more information, visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 February 2013
Document identifier: AN11295
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