LV5683P Multi Voltage Regulator IC

LV5683P
Multi Voltage Regulator IC
Application Note
Overview
The LV5683P is a multiple voltage regulator for car audio system. This IC has 4 voltage regulators.
The following protection circuits are integrated: over current limiter, overvoltage protection and Thermal Shut
Down. VCC1 (supply to SWU and USB) is independent terminal from VCC, and accepts lower voltage (ex.
from DC/DC converter) which enables to reduce power dissipation.
Features

4 LDO regulators
・
For VDD(μCOM):
Vout is 5V(3.3V), Iomax is 300mA,
Reverse Current Prevention Diode implemented.
・
For Audio:
Vout is 8.5V, Iomax is 400mA
・
For Systems:
Vout is 3.3V,Iomax is 500mA
・
For USB/CD:
Vout is 5V(8V), Iomax is 1100mA

Over Current Limiting

Overvoltage Protection (Without VDD-OUT)

Thermal Shut Down

VCC1 (supply to SWU and USB) is independent terminal from VCC

Maximum surge peak Voltage is 50V

Low thermal resistance package “HZIP15”(θjc=2.5℃/W)
*Detection voltage is 21V(typical)
*175℃(typical)
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used
under the conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or
thermal shutdown state may degrade the IC’s reliability and eventually damage the IC.
LV5683P Application Note
Package Dimensions
Fig1. Package Dimensions of HZIP15
(a) IC unit(HZIP15)
3
(b) with Al heatsink(50×50×1.5mm )
・Al heatsink mounting conditions
Tightening torque: 39N*cm, using silicone grease
Fig2. Allowable Power Dissipation Derating Curve
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LV5683P Application Note
Pin Assignment
LV5683
(NC)
AUDIO_EN
AUDIO
(NC)
)
VDD
N
IKVDD
O
(NC)
)
VCC
D
DVCC1
SWU_EN
)
IKUSB
C
USB_EN
1
USB
N
B GND
N SWU
B
D
U
15pin
1pin
Fig3. Pin Assignment
Block Diagram
B+
VCC
8
+
+
AUDIO
+ 400mA
3
OverVoltage
Protection
Start
up
+
Vref
VDD(5V/3.3V)
5
+ 300mA
6 IKVDD:VDD(3.3/5.0V) select
IKVDD=OPEN or VDDout:5.0V
IKVDD=GND:3.3V
AUDIO_EN 2
OUTPUT
SWU_EN 10
VCC1
Control
USB_EN 12
9
+
ex.)DC-DC
+
USB/CD (5V/8V)
13
+
1100mA
Thermal
Shut Down
GND
14
11
+
IKUSB:USB(5/8V) select
IKUSB=OPEN or USBout:8V
IKUSB=GND:5V
SWU(3.3V)
15
+
500mA
Fig4. Block Diagram of LV5683P
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LV5683P Application Note
Specifications
Absolute Maximum Ratings at Ta=25 ºC
Parameter
Symbol
Power supply voltage
Vcc max
Unit
36
V
1.3
3
(*Ta≦25 ºC)
Peak supply voltage
Ratings
IC unit
Pd max
Allowable Power dissipation
Conditions
Vcc peak
With Al heatsink(50x50x1.5mm )
5.3
W
Infinite heat radiation
26.0
See below pulse wave.
50
V
Operating ambient temperature
Topr
-40 to +85
℃
Storage temperature
Tstg
-55 to +150
℃
Junction temperature
Tjmax
150
℃
・Peak Voltage testing pulse wave
50V
90%
10%
16V
5msec
100msec
Fig5. Peak Voltage testing pulse wave
Recommended Operating condition at Ta=25 ºC
Parameter
Conditions
Power supply voltage range1
VDD output(5V/3.3V)
Power supply voltage range2
Ratings
Unit
7 to 16
V
USB (5V) output、SWU output: VCC=VCC1
7.5 to 16
V
Power supply voltage range3
AUDIO output
10 to 16
V
Power supply voltage range4
USB(8V) output: VCC=VCC1
10.5 to 16
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
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LV5683P Application Note
Electrical Characteristics at Ta=25 ºC, Vcc=Vcc1=14.4V (*1)
Parameter
Quiescent Current
Symbol
Icc
Conditions
Ratings
Min
Typ
VDD no load, All EN terminal=“L”
Max
50
Unit
100
μA
AUDIO_EN input
Low Input voltage
VIL1
0
0.5
V
High Input voltage
VIH1
2.8
5.5
V
Input impedance
RIN1
280
520
kΩ
Low Input voltage
VIL2
0
0.5
V
High Input voltage
VIH2
2.8
5.5
V
Input impedance
RIN2
280
520
kΩ
Low Input voltage
VIL3
0
0.5
V
High Input voltage
VIH3
2.8
5.5
V
Input impedance
RIN3
280
400
520
kΩ
5
5.25
V
400
SWU_EN input
400
USB_EN input
VDD (5/3.3V) output (reverse current prevention diode implemented)
VDD Output voltage1 Vo11
Io11=200mA,IKVDD=OPEN,or VDD
4.75
VDD Output current1 Io11
Vo11≧4.7V
300
VDD Output voltage2 Vo12
Io12= 200 mA, IKVDD=GND
3.13
VDD Output current2 Io12
Vo12≧3.1V
300
mA
3.3
3.47
V
mA
Line regulation
⊿VoLN1
7V＜VCC＜16 V, Io1= 200 mA
50
100
mV
Load regulation
⊿VoLD1
1 mA＜Io11, Io12＜200 mA
80
150
mV
Dropout voltage 1
VDROP1
Io1=200 mA(implemented diode)
1.5
2.5
V
VCC Ripple rejection RREJ1
f=120Hz, VCC=1Vpp, Io1=200mA
VDD reverse current Irev
Vo11=5.0V, Vcc=0V
40(*2)
50(*2)
dB
10
100
μA
8
8.4
V
USB/CD output；USB_EN=High
USB Output voltage1 Vo21
Io21=1000mA,IKUSB=OPEN,or USB
USB Output current1 Io21
Vo21≧7.45V
1100
USB Output voltage2 Vo22
Io22= 1000 mA, IKUSB=GND
4.75
USB Output current2 Io22
Vo22≧4.6V
1100
Line regulation
⊿VoLN2
10.5V＜Vcc1＜16V, Io2=1000 mA
Load regulation
⊿VoLD2
Dropout voltage
VDROP2
VCC1 Ripple rejection RREJ2
7.6
mA
5
5.25
V
mA
50
100
mV
10 mA＜Io21, Io22＜1000 mA
100
200
mV
Io21, Io22= 1000 mA
1.0
2.0
V
f=120Hz,VCC1=1Vpp,Io2=1A
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5
40(*2)
50(*2)
dB
LV5683P Application Note
Parameter
Symbol
Conditions
Ratings
Min
Typ
Max
Unit
AUDIO output；AUDIO_EN= High
AUDIO Output voltage Vo3
Io3= 300 mA
8.1
400
8.5
8.9
V
AUDIOOutput current
Io3
Vo3≧8V
Line regulation
⊿VoLN3
10V＜Vcc＜16 V, Io3= 300 mA
30
100
mV
Load regulation
⊿VoLD3
1 mA＜Io3＜300 mA
70
140
mV
Dropout voltage
VDROP3
Io3= 300 mA
0.6
1.05
V
VCC Ripple rejection RREJ3
f=120Hz, VCC=1Vpp, Io3=300 mA
mA
40(*2)
50(*2)
3.3
dB
SWU（3.3V）output；SWU_EN= High
SWU Output voltage Vo4
Io4= 400 mA
3.13
SWU Output current Io4
Vo4≧3.1V
500
3.47
V
mA
Line regulation
⊿VoLN4
7.5V＜Vcc1＜16 V, Io4= 400 mA
30
100
mV
Load regulation
⊿VoLD4
1 mA＜Io4＜400 mA
80
150
mV
VCC1 Ripple rejection RREJ4
f=120Hz, VCC1=1Vpp, Io4=400mA
40(*2)
50(*2)
dB
*1：The entire specification has been defined based on the tests performed under the conditions where
Tj and Ta(=25℃) are almost equal. There tests were performed with pulse load to minimize the increase
of junction temperature (Tj).
*2：design certification
.
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LV5683P Application Note
Timing Chart
21V
VCC
(8PIN)
VCC1
(9PIN)
VDD
(5PIN)
USB_EN
(12PIN)
USB
(13PIN)
AUDIO_EN
(2PIN)
AUDIO
(3PIN)
SWU_EN
I (10PIN)
L
M
SWU
(15PIN)
Fig6. Timing Chart
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LV5683P Application Note
Main Characteristics (VCC=VCC1 unless otherwise specified)
100
100
90
70
Quiescent Current[μA]
80
Quiescent Current[μA]
90
VCC1=OPEN
VDD No Load
All EN terminal="L"
60
50
40
30
VCC=7V
20
VCC=14.4V
10
VCC=16V
VCC1=VCC
VCC1=VCC
VDD
VDDNo
NoLoad
Load
All
AllEN
ENterminal="L"
terminal="L"
80
70
60
50
40
30
VCC=7V
20
VCC=14.4V
10
VCC=16V
0
0
-50
0
50
100
-50
0
Ambient Temperature Ta[℃]
Fig8.Quiescent Current vs. Ta@VCC1=VCC
6
5.25
VDD5V(5PIN) Output Voltage[V]
VDD5V(12PIN) Output Voltage[V]
100
Ambient Temperature Ta[℃]
Fig7.Quiescent Current vs. Ta@VCC1=OPEN
5
4
IKVDD=OPEN
3
2
Ta=-40℃
Ta=25℃
1
Ta=100℃
5.20
VCC=14.4V
5.15
VCC=6.5V
5.10
VCC=17V
IKVDD=OPEN
5.05
5.00
4.95
4.90
4.85
Iout = 200 mA
4.80
4.75
0
0
10
20
Input Voltage(VCC)[V]
-50
30
0
50
100
Ambient Temperature Ta[℃]
Fig9. [VDD(5V)] Vo vs. Input Voltage
Fig10. [VDD(5V)] Vo vs. Ta
6
6
Iomax
VDD5V(5PIN) Output Voltage[V]
VDD5V(5PIN) Output Voltage[V]
50
5
4
VCC=14.4V
IKVDD=OPEN
3
Ta=-40℃
2
Ta=25℃
Ta=100℃
1
SPEC
0
VCC=6.5V
IKVDD=OPEN
5
4
3
2
Ta=-40℃
Ta=25℃
1
Ta=100℃
0
0
0.2
0.4
0.6
0.8
VDD5V(5PIN) Output Current[A]
1
Fig11. [VDD(5V)] Vo vs. Io@VCC=14.4V
0
0.2
0.4
0.6
0.8
VDD5V(5PIN) Output Current[A]
Fig12. [VDD(5V)] Vo vs. Io@VCC=6.5V
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1
LV5683P Application Note
80
VCC=17V
IKVDD=OPEN
5
VDD5V Ripple Rejection[dB]
VDD5V(5PIN) Output Voltage[V]
6
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
70
60
50
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
10
Io=200mA
0
0
0
0.2
0.4
0.6
0.8
VDD5V(5PIN) Output Current[A]
-50
1
0
50
100
Ambient Temperature Ta[℃]
Fig14. [VDD(5V)] Ripple Rejection vs. Ta
Fig13. [VDD(5V)] Vo vs. Io@VCC=17V
VDD Reverse Current Irev[μA]
100
90
80
70
VCC=0V
VDD=5V
60
50
40
30
20
10
0
-50
0
50
100
Ambient Temperature Ta[℃]
Fig15. [VDD(5V)] Reverse Current vs. Ta
3
IKVDD=GND
2.5
2
Ta=-40℃
1.5
Ta=25℃
1
Ta=100℃
0.5
VDD3.3V(5PIN) Output Voltage[V]
VDD3.3V(5PIN) Output Voltage[V]
3.5
3.45
3.40
IKVDD=GND
3.35
3.30
3.25
VCC=14.4V
3.20
VCC=6.5V
3.15
Iout = 200mA
VCC=17V
3.10
0
-50
0
10
20
30
Supply Voltage(VCC)[V]
0
50
Ambient Temperature Ta[℃]
Fig16. [VDD(3.3V)] Vo vs. Input Voltage
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Fig17. [VDD(3.3V)] Vo vs. Ta
100
LV5683P Application Note
4
Iomax
VDD3.3V(5PIN) Output Voltage[V]
VDD3.3V(5PIN) Output Voltage[V]
4
3.5
3
VCC=14.4V
IKVDD=GND
2.5
2
1.5
Ta=-40℃
1
Ta=25℃
Ta=100℃
SPEC
0.5
3.5
3
VCC=6.5V
IKVDD=GND
2.5
2
1.5
Ta=-40℃
1
Ta=25℃
0.5
Ta=100℃
0
0
0
0.5
VDD3.3V(5PIN) Output Current[A]
0
1
0.5
VDD3.3V(5PIN) Output Current[A]
1
Fig19. [VDD(3.3V)] Vo vs. Io@VCC=6.5V
Fig18. [VDD(3.3V)] Vo vs. Io@VCC=14.4V
80
3.5
VDD3.3V Ripple Rejection[dB]
VDD3.3V(5PIN) Output Voltage[V]
4
3
VCC=17V
IKVDD=GND
2.5
2
1.5
Ta=-40℃
1
Ta=25℃
0.5
Ta=100℃
0
70
60
50
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
10
Io=200mA
0
0
0.5
VDD3.3V(5PIN) Output Current[A]
1
-50
0
50
100
Ambient Temperature Ta[℃]
Fig20. [VDD(3.3V)] Vo vs. Io@VCC=17V
Fig21. [VDD(3.3V)] Ripple Rejection vs. Ta
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10
9
8.9
8
8.8
VCC=14.4V
8.7
VCC=9.5V
AUDIO(3PIN) Output Voltage[V]
AUDIO(3PIN) Output Voltage[V]
LV5683P Application Note
7
6
Ta=-40℃
5
Ta=25℃
4
Ta=100℃
3
2
1
8.5
8.4
8.3
0
10
20
Supply Voltage(VCC)[V]
-50
30
0
50
100
Ambient Temperature Ta[℃]
Fig22. [AUDIO] Vo vs. Input Voltage
Fig23. [AUDIO] Vo vs. Ta
10
10
Iomax
9
8
7
VCC=14.4V
6
5
4
Ta=-40℃
Ta=25℃
Ta=100℃
SPEC
3
2
1
AUDIO(3PIN) Output Voltage[V]
9
AUDIO(3PIN) Output Voltage[V]
Iout = 300mA
8.2
8.1
0
0
8
7
6
VCC=9.5V
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
0
0
0.2
0.4
0.6
0.8
1
0
AUDIO(3PIN) Output Current[A]
0.5
1
AUDIO(3PIN) Output Current[A]
Fig24. [AUDIO] Vo vs. Io@VCC=14.4V
Fig25. [AUDIO] Vo vs. Io@VCC=9.5V
10
80
9
70
8
7
6
VCC=17V
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
AUDIO Ripple Rejection[dB]
AUDIO(3PIN) Output Voltage[V]
VCC=17V
8.6
60
50
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
10
Io=300mA
0
0
0
0.5
1
-50
50
100
Ambient Temperature Ta[℃]
AUDIO(3PIN) Output Current[A]
Fig26. [AUDIO] Vo vs. Io@VCC=17V
0
Fig27. [AUDIO] Ripple Rejection vs. Ta
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LV5683P Application Note
5.3
USB5V(13PIN) Output Voltage[V]
USB5V(13PIN) Output Voltage[V]
6
IKUSB=GND
5
4
Ta=-40℃
Ta=25℃
3
Ta=100℃
2
1
5.2
IKUSB=GND
5.2
5.1
5.1
5.0
5.0
VCC=14.4V
4.9
4.9
VCC=7V
Iout = 1A
VCC=17V
4.8
4.8
0
0
10
20
30
Supply Voltage(VCC)[V]
-50
40
0
50
100
Ambient Temperature Ta[℃]
Fig28. [USB(5V)] Vo vs. Input Voltage
Fig29. [USB5V] Vo vs. Ta
6
6
USB5V(13PIN) Output Voltage[V]
USB5V(13PIN) Output Voltage[V]
Iomax
5
4
VCC=14.4V
IKUSB=GND
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
SPEC
0
5
VCC=7V
IKUSB=GND
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
0
0
1
2
USB5V(13PIN) Output Current[A]
3
0
6
80
5
70
VCC=17V
IKUSB=GND
4
3
Ta=-40℃
2
Ta=25℃
1
3
Fig31. [USB(5V)] Vo vs. Io@VCC=7V
USB5V Ripple Rejection[dB]
USB5V(13PIN) Output Voltage[V]
Fig30. [USB(5V)] Vo vs. Io@VCC=14.4V
1
2
USB5V(13PIN) Output Current[A]
Ta=100℃
60
50
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
10
Io=1A
0
0
0
1
2
USB5V(13PIN) Output Current[A]
3
-50
0
50
100
Ambient Temperature Ta[℃]
Fig32. [USB(5V)] Vo vs. Io@VCC=17V
Fig33. [USB(5V)] Ripple Rejection vs. Ta
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LV5683P Application Note
8.6
IKUSB=OPEN
8
USB8V(13PIN) Output Voltage[V]
USB8V(13PIN) Output Voltage[V]
9
7
6
5
Ta=-40℃
4
Ta=25℃
Ta=100℃
3
2
1
8.2
8.0
0
VCC=10V
7.6
10
20
30
Supply Voltage(VCC)[V]
Iout = 1A
VCC=17V
-50
40
9
USB8V(13PIN) Output Voltage[V]
7
6
VCC=14.4V
IKUSB=OPEN
4
Ta=-40℃
Ta=25℃
Ta=100℃
SPEC
2
1
100
9
8
3
50
Fig35. [USB8V] Vo vs. Ta
Iomax
5
0
Ambient Temperature Ta[℃]
Fig34. [USB(8V)] Vo vs. Input Voltage
USB8V(13PIN) Output Voltage[V]
VCC=14.4V
7.8
7.4
0
0
8
7
VCC=10V
IKUSB=OPEN
6
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
0
0
1
2
USB8V(13PIN) Output Current[A]
3
0
Fig36. [USB(8V)] Vo vs. Io@VCC=14.4V
1
2
USB8V(13PIN) Output Current[A]
3
Fig37. [USB(8V)] Vo vs. Io@VCC=10V
9
80
8
USB8V Ripple Rejection[dB]
USB8V(13PIN) Output Voltage[V]
IKUSB=OPEN
8.4
7
6
VCC=17V
IKUSB=OPEN
5
4
3
Ta=-40℃
2
Ta=25℃
1
Ta=100℃
70
60
50
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
10
Io=1A
0
0
0
1
2
USB8V(13PIN) Output Current[A]
3
-50
0
50
100
Ambient Temperature Ta[℃]
Fig38. [USB(8V)] Vo vs. Io@VCC=17V
Fig39. [USB(8V)] Ripple Rejection vs. Ta
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LV5683P Application Note
3.5
3.5
SWU(15PIN) Output Voltage[V]
SWU(15PIN) Output Voltage[V]
4
3
2.5
Ta=-40℃
2
Ta=25℃
1.5
Ta=100℃
1
0.5
3.4
Iout = 400mA
3.4
3.3
3.3
VCC=14.4V
3.2
VCC=7V
3.2
VCC=17V
3.1
0
0
10
20
30
Supply Voltage(VCC)[V]
-50
40
0
50
100
Ambient Temperature Ta[℃]
Fig40. [SWU] Vo vs. Input Voltage
Fig41. [SWU] Vo vs. Ta
4
4
3.5
SWU(15PIN) Output Voltage[V]
SWU(15PIN) Output Voltage[V]
Iomax
3
VCC=14.4V
2.5
2
1.5
Ta=-40℃
1
Ta=25℃
Ta=100℃
0.5
3.5
3
VCC=7V
2.5
2
1.5
Ta=-40℃
1
Ta=25℃
0.5
Ta=100℃
SPEC
0
0
0
0.2
0.4
0.6
0.8
1
SWU(15PIN) Output Current[A]
1.2
0
Fig42. [SWU] Vo vs. Io@VCC=14.4V
Fig43. [SWU] Vo vs. Io@VCC=7V
4
80
Iomax
3.5
70
SWU Ripple Rejection[dB]
SWU(15PIN) Output Voltage[V]
0.2
0.4
0.6
0.8
1
SWU(15PIN) Output Current[A]
3
2.5
VCC=17V
2
1.5
Ta=-40℃
1
Ta=25℃
0.5
40
30
VCC=14.4V
frip=120Hz
Vrip=1.0Vpp
20
Io=400mA
0
0
0.2
0.4
0.6
0.8
1
SWU(15PIN) Output Current[A]
50
10
Ta=100℃
0
60
1.2
-50
0
50
100
Ambient Temperature Ta[℃]
Fig44. [SWU] Vo vs. Io@VCC=17V
Fig45. [SWU] Ripple Rejection vs. Ta
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1.2
LV5683P Application Note
Terminal outline
Pin No.
Pin name
Functions
1
-
NC
Equivalent circuit
8
2
AUDIO_EN
AUDIO output CTRL
VCC
10kΩ
2
270kΩ
120kΩ
GND
14
8
VCC
AUDIO output
3
3
AUDIO
when
263kΩ
AUDIO_EN=H,“ON”
8.5V/0.4A
45kΩ
14
4
-
GND
NC
8
5
VDD
VDD output
VCC
5
232kΩ
5.0V,3.3V/0.3A
190kΩ
140kΩ
14
GND
8
VCC
VDD output voltage
0.25μA
select
6
IKVDD
OPEN or VDD output
6
10kΩ
0.25μA
10kΩ
:VDD=5.0V
GND:VDD=3.3V
14
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GND
LV5683P Application Note
Pin No.
Pin name
Functions
7
-
NC
8
VCC
VCC
Equivalent circuit
VCC
8
9
9
VCC1
VCC1
GND
14
VCC1
9
10
SWU_EN
SWU output CTRL
10
10kΩ
270kΩ
120kΩ
GND
14
VCC1
9
USB output voltage
select
11
IKUSB
OPEN or USB output
11
10kΩ
10kΩ
:USB=8.0V
GND:USB=5.0V
GND
14
VCC1
9
12
USB_EN
USB output CTRL
12
10kΩ
270kΩ
120kΩ
14
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GND
LV5683P Application Note
Pin No.
Pin name
Functions
Equivalent circuit
9
USB output
13
USB
VCC1
13
136kΩ
when USB_EN=H, “ON”
5.0V,8.0V/1.1A
110kΩ
45kΩ
14
14
GND
GND
GND
9
VCC1
SWU output
15
SWU
15
when
75kΩ
SWU_EN=H, “ON”
3.3V/0.5A
45kΩ
14
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GND
LV5683P Application Note
Board Layout
・Layer 1(Top)
C5
TP1
TP3
TP4
TP2
C1
C11
TP5
TP6
C9
C7
TP7
TP9
TP10
TP15
TP11
TP12
TP8
HD1-5, SL1-5
Fig46. Top Layer
・Layer 2(Bottom)
C8
C10
C6
C12
C4
C2
C3
Fig47. Bottom Layer
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TP13
TP14
LV5683P Application Note
Application Circuit Example
+
C6
C7
C1
GND
SWU
12
11
14
13
+
15
+
C3 C4
C2
USB
USB_EN
IKUSB
10
9
+
C8
SWU_EN
IKVDD
VCC
8
7
+
C5
TP7
6
5
VCC1
4
3
(NC)
2
1
VDD
(NC)
AUDIO
(NC)
AUDIO_EN
LV5683P
+
C9
C10
C11 C12
TP9
TP10
AUDIO_EN
IKUSB
TP4
TP11
TP12
TP6
TP3
TP5
USB_EN
IKVDD
TP13
SWU_EN
TP14
TP1 TP2 TP15
TP8
: Board Header (3pins)
+Short Link
Fig48. Application Circuit Schematic
Bill of Materials
Reference
Value
Part
Vendor
Comments
C1,C3
100μF/50V
UVR1H101MPD
nichicon
Capacitor, Aluminum Electrolytic
C2,C4 ,C6,
C8,C10,C12
0.22μF/50V
GRM21BR71H224KA01L
Murata
Capacitor, Ceramic
C5,C7,
C9,C11
10μF/25V
UMA1E100MDD/
ECEA1FKS100
nichicon/
Panasonic
Capacitor, Aluminum Electrolytic
BD*
W81136T3843RC
RS
Board Header
SL*
W8010T50RC
RS
Short Link
TP1-TP15
ST-4-2
MAC8
Test Point
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LV5683P Application Note
Functional Description
electrolytic capacitor is the least expensive
The LV5683P is a multiple output voltage
solution, but if the circuit operates at low
regulator, suitable for use in car audio system.
temperatures(-25 to -40℃), both the value and
VCC1 (supply to SWU and USB) is independent
ESR of the capacitor will vary considerably. The
terminal from VCC, and accepts lower voltage
capacitor
(ex. from DC/DC converter) which enables to
provides this information.
manufacturer's
datasheet
usually
VDD regulator (3.3/5.0V, 0.3A)
reduce power dissipation.
When VCC is applied, VDD output is active
VCC, VCC1
regardless of CTRL state. The voltage of VDD
This IC has the tolerance value of 50V against
output can be switched 3.3V/5.0V by controlling
VCC peak surge voltage, but for more safety set
the IKVDD terminal. When the IKVDD is
design, adding power clamp, such as power
connected to GND, the VDD output voltage is
zenner diode, on battery connected line is
3.3V. Moreover, when IKVDD is opened or
recommended in order to absorb applied surge.
connected to the VDD output, the VDD output
This IC has no protection against battery reverse
voltage is 5V.
connection,
When the supply voltage drops below the
so
adding
Schottky
diode
is
recommended to prevent a negative voltage.
regulator output voltage, usually, the current
VCC voltage must be higher than VCC1-0.7V,
flows from output to input through a parasitic
because internal diode between VCC and VCC1
diode of Power MOS Driver. To prevent the flow
becomes positively biased. This internal diode
of reverse current through parasitic diode, the
cannot be used to supply current from VCC1 to
VDD regulator of LV5683P has inserted the
VCC because this is used only for ESD
power diode between the output and the driver.
protection purpose.
The current to VCC can be stopped by the
inserted diode, but there is the current path to
Standby mode
GND by the resistor for the voltage setting.
When all EN pins are "L" state (AUDIO_EN,
USB_EN,
SWU_EN=Low),
LV5683P
is
in
VCC<VDD-Vf
VCC
VCC
Parasitic
Diode
standby mode. In standby mode, all outputs
except VDD are disabled. Quiescent current is
Reverse
Current
50μA (typ) at VDD no load. When either EN pin
exceeds "H" threshold voltage, LV5683P exits
Output
standby mode.
Reverse
Current
Prevention
Diode
VDD
Linear Regulators
All regulators in LV5683P are low dropout
B. LV5683P
A. Conventional
outputs, because the output stage of all
Fig49. Reverse Current Path
regulators is PLDMOS.
When you select output capacitors for linear
AUDIO regulator (8.5V, 0.3A)
regulators, you should consider three main
When AUDIO_EN is “H”, AUDIO output is active.
characteristics: startup delay, transient response
AUDIO output is supplied the current from VCC.
and loop stability. The capacitor values and type
should be based on cost, availability, size and
USB regulator (5.0/8.0V, 1.1A)
temperature constraints. Tantalum, Aluminum
When USB_EN is “H”, USB output is active. The
electrolytic, Film, or Ceramic capacitors are all
voltage
acceptable solutions. However, attention must
5.0V/8.0V by controlling the IKUSB terminal.
be paid to ESR constraints. The aluminum
When the IKUSB is connected to GND, the USB
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of
USB
output
can
be
switched
LV5683P Application Note
output voltage is 5.0V. Moreover, when IKUSB is
Current Limiting
opened or connected to the USB output, the
When the each output becomes in over load
USB output voltage is 8V. USB output is supplied
condition, the device limits the output current. All
the current from VCC1.
outputs are also protected against short circuit by
SWU regulator (3.3V, 0.5A)
fold back current limiter.
When SWU_EN is “H”, SWU output is active.
Overvoltage
SWU output is supplied the current from VCC1.
The device is protected against load dump.
When VCC voltage exceeds 21V, the device
Enable input
detects over voltage condition and turns all the
All EN terminals accept two input values (L/ /H),
outputs off except VDD to protect the device. If
and have a pull-down resistance that resistance
VCC voltage gets below 21V, outputs are
value is 400kΩ.
automatically restored.
.
TEST Procedure
Voltage Select: IKVDD & IKUSB
The output voltage of the VDD or the USB is
Line regulation
switched by the state of these input terminals.
Line regulation is defined as the maximum
When it is connected to GND, the lower voltage
change in output voltage as the input voltage is
is selected, and when it is open or connected to
varied
the output, the higher voltage is selected.
measured by changing the input voltage and
When the IK-terminal open, please handle with
measuring the minimum/maximum voltage of the
care because of the high-impedance terminal.
output. Line regulation is defined as the
So, if you want to set a higher output voltage, it is
difference between maximum and minimum
recommended
voltage.
that
the
input
terminal
is
through
the
specified
range.
It
is
Load regulation
connected to the output terminal.
Load regulation is defined as the maximum
Connect to…
GND:
Output is Lower Voltage
change in output voltage as the load current is
0.25μA
varied
10kΩ
through
the
specified
range.
It
is
measured by changing the load current and
measuring the minimum/maximum voltage of the
OPEN or Output:
Output is Higher Voltage
Voltage
Limiter
output. Load regulation is defined as the
difference between maximum and minimum
voltage.
Limit the gate voltage to 6V
OFF < 6V.
Dropout voltage
Protection
Thermal Shutdown
input-to-output
To protect the device from overheating a thermal
specified load current required by the regulator to
shutdown circuit is included. If the junction
keep the output voltage in regulation. It is
temperature reaches approximately 175℃(typ),
measured by reducing input voltage until the
all outputs are turned off regardless of CTRL
output voltage drops below the nominal value.
state. Outputs remain disabled until the junction
Ripple rejection
temperature drops below 145℃(typ)(automatic
Ripple rejection is defined as the ratio of input
restoration).
ripple amplitude versus that of output.
The
thermal
shutdown
Dropout voltage is defined as the minimum
circuit
does
not
guarantee the protection of the final product
because it operates out of maximum rating
(exceeding Tjmax=150℃).
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differential
voltage
at
the
LV5683P Application Note
LV5683P is used, before the set design, must check the following
1. Absolute Maximum Rating (Common notes to general semiconductor device)
Stresses exceeding Maximum Ratings may damage the device. If a IC is applied stresses exceeding
Maximum Ratings, a IC might smoke or fire by the breakdown and the overheating.
We recommend to derating design for reducing failure rate of device. A guide of general derating
design is described below.
(1)Stress Voltage:
80% or less for Abs Max voltage.
(2)Maximum rating current: 80% or less for Abs Max Io.
(3)Temperature: 80% or less for Temperatures rating.
2. Recommended Operating Range
When LV5683P was used within Recommended Operating Range and Temperature Rating, unless
otherwise specified, we do not guarantee the specified value in all temperature ranges. As long as the
IC is at operation temperature range, IC’s characteristic doesn’t change suddenly. Operating conditions
of the input voltage and the output current are limited by the chip maximum junction temperature
(Tjmax). Please decide the value of the input voltage and the output current so as not to exceed Tjmax.
3. Output Capacitor
Between GND and each output, please be sure to put capacitor to prevent oscillation. Because abrupt
changes of input voltage and output load interfere in the output voltage, make sure to use the system
that will actually be offered to the market and define the output capacitor after a sufficient evaluation.
When selecting the capacitor, to ensure the required minimum capacity over all operating conditions of
the application, it is necessary to consider the influence of a temperature and a applied voltage on the
capacity value.
Please design the PCB pattern that the output terminal and the capacitor are located as close as
possible.
4. Parasitic Devices
Output Power MOS-FET driver has, in device structure, parasitic diode like the figure below. Because
in normal operating the input voltage is higher than the output voltage, the parasitic diode is reverse
bias. If the output is higher than the input at abnormal operating, a current flows from the output to the
input, because the parasitic diode is forward biased.
SOURCE(S)
GATE(G)
SOURCE(S)
p＋
p＋
n
n
GATE(G)
Parasitic diode
p－
Parasitic diode
p＋
DRAIN(D)
DRAIN(D)
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LV5683P Application Note
5. Over -Current Protection
Each channel has an Over-Current Protection (OCP) circuit which is the "Fold-Back" type, OCP circuit
prevent IC’s break down at an over current condition. This circuit is useful against sudden over current,
but use of continuous operation is not allowed.
The limit value of output current is changed by ambient temperature and production tolerance.
However, the limiting value doesn't fall below the output maximum current defined by the specification.
When the output current uses it exceeding the maximum current, the OCP circuit might operate in
some situations. Please design the equipment, to be sure than a specified value. Please design the
output current to use without fail below a specified maximum value.
Output current
Spec limit
(Iomax)
Changes in temperature, etc
Without OCP
Limit Current
Limit Current
Iout
Vout
Output current
operating range
Vreg
Iout≒
Iout
Rload
Rload
OCP working area
6. Over-Voltage Protection
When VCC voltage exceeds 21V, the device detects over voltage condition and shuts down all output
but “VDD” to protect the device.
The peak voltage value (Vcc peak) changes depending on Surge-waveform condition. Adding power
clamp, such as power zenner diode, on battery connected line is recommended in order to absorb
applied surge.
7. Thermal shut-down
This IC built-in thermal shut-down circuit to prevent from thermal damage. If the state to exceed the
Absolute Maximum Rating of the power dissipation continues, and the chip temperature (Junction
temperature:Tj) reaches 175℃, the thermal shut-down circuit operates. When the thermal shut-down
circuit operates, all outputs are turned off regardless of CTRL state. Outputs remain disabled until the
junction temperature drops below 145℃(typ)(automatic restoration). If the operating condition is not
changing, the output repeats on and off. The output seems to oscillate.
* The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC
if used under the conditions out of safety range or ratings. Use of the IC such as use under over-current
protection range or thermal shutdown state may degrade the IC’s reliability and eventually damage the
IC.
8. Application Circuit Example
IC’s operating characteristics are influenced by PCB layout, connection, parasitic capacitance and
inductance. Therefore, make sure to use the system that will actually be offered to the market and
define a constant after a sufficient evaluation.
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LV5683P Application Note
9. HZIP15
Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head
generated by the device to the outer environment and dissipating that heat.
a．Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder
must not be applied to the heat sink or tabs.
b．Heat sink attachment
・Use flat-head screws to attach heat sinks.
Binding-head
machine-screw
・Use also washer to protect the package.
Countersunk head
machine screw
・Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
・If tapping screws are used, do not use screws with a diameter larger than the holes in the
semiconductor device itself.
・Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab
or heat sink.
・take care a position of via hole.
・Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or
heat sink.
・Verify that there are no press burrs or screw-hole burrs on the heat sink.
・Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes,
for either concave or convex warping.
・Twisting must be limited to under 0.05 mm.
・Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
・The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400
rpm.
Heat sink
gap
via hole
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LV5683P Application Note
c．Silicone grease
・Spread the silicone grease evenly when mounting heat sinks.
・Our company recommends YG-6260 （ Momentive Performance Materials Japan LLC ）
d．Mount
・First mount the heat sink on the semiconductor device, and then mount that assembly on the printed
circuit board.
・When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when
tightening up a heat sink with the screw, the mechanical stress which is impossible to the
semiconductor device and the pin doesn't hang.
e．When mounting the semiconductor device to the heat sink using jigs, etc.,
・Take care not to allow the device to ride onto the jig or positioning dowel.
・Design the jig so that no unreasonable mechanical stress is applied to the semiconductor device.
f．Heat sink screw holes
・Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw
head used.
・When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the
screws used. A hole diameter about 15% larger than the diameter of the screw is desirable.
・When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A
diameter about 15% smaller than the diameter of the screw is desirable.
g．There is a method to mount the semiconductor device to the heat sink by using a spring band. But
this method is not recommended because of possible displacement due to fluctuation of the spring
force with time or vibration.
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LV5683P Application Note
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at
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warranty, representation or guarantee regarding the suitabilityof its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
experts. SCILLC does not convey any licenseunder its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use
as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for
any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or
death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the
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