2-Channel Very Low Capacitance ESD Protection Device

ESD6100
2 Channel Very Low
Capacitance ESD
Protection Device in CSP
Product Description
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The ESD6100 is a 4−bump very low capacitance ESD protection
device in 0.4 mm CSP form factor. It is fully compliant with IEC
61000−4−2. The ESD6100 is RoHS II compliant.
Table 1. PIN DESCRIPTIONS
WLCSP4
CASE 567CB
4−bump CSP Package
Pin
Description
A1
ESD Channel 1
A2
ESD Channel 2
B1 and B2
Device Ground
ELECTRICAL SCHEMATIC
CH1 (A1)
PACKAGE / PINOUT DIAGRAMS
CH2 (A2)
4−Bump CSP Package
Orientation
Marking
1
A
2
+
2
1
A2
A1
A1
A
PX
B
B
B2
B1
GND (B1)
Orientation
Marking
GND (B2)
MARKING DIAGRAM
PX
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
P
X
WHERE X =
A = ww01, ww02
J = ww19, ww20
S = ww37, ww38
B = ww03, ww04
K = ww21, ww22
T = ww39, ww40
C = ww05, ww06
L = ww23, ww24
U = ww41, ww42
D = ww06, ww08
M = ww25, ww26
V = ww43, ww44
E = ww08, ww10
N = ww27, ww28
W = ww45, ww46
F = ww11, ww12
O = ww29, ww30
X = ww47, ww48
G = ww13, ww14
P = ww31, ww32
Y = ww49, ww50
H = ww15, ww16
Q = ww33, ww34
Z = ww51, ww52
I = ww17, ww18
R = ww35, ww36
© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 1
1
= ESD6100
= Single Digit Date Code
ORDERING INFORMATION
Device
ESD6100
Package
Shipping†
WLCSP4
(Pb−Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
ESD6100/D
ESD6100
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
Storage Temperature Range
–55 to +150
°C
Operating Temperature Range
–40 to +85
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
VIN
Input Operating Supply Voltage
VB
Breakdown Voltage (Positive)
IF = 1 mA
Channel Leakage Current
VIN = 3 V (Note 2)
Channel Input Capacitance
At 1 MHz, VIN = 0 V (Note 2)
DCIN
Channel Input Capacitance Matching
At 1 MHz, VIN = 0 V (Note 2)
VESD
ESD Protection Peak Discharge Voltage at any
channel input
a) Contact Discharge per IEC 61000−4−2
standard
b) Air Discharge per IEC 61000−4−2 standard
(Notes 2 and 3)
Channel Clamp Voltage
Positive Transients
Negative Transients
IPP = 1 A, tP = 8/20 ms (Note 2)
Dynamic Resistance
Positive Transients
Negative Transients
IPP = 1 A, tP = 8/20 ms
Any I/O pin to Ground (Note 2)
ILEAK
CIN
VCL
RDYN
Min
Typ
Max
Units
3.0
5.5
V
6
V
1.0
0.02
100
nA
1.5
pF
pF
kV
±8
±15
V
+9.8
−1.5
W
0.7
0.5
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. All parameters specified at TA = 25°C unless otherwise noted.
2. These parameters are guaranteed by design and characterization.
3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.
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2
ESD6100
PACKAGE DIMENSIONS
WLCSP4, 0.8x0.8
CASE 567CB
ISSUE O
ÈÈ
ÈÈ
A
D
PIN A1
REFERENCE
E
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
DIM
A
A1
A2
b
D
E
e
0.05 C
2X
TOP VIEW
A2
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
4X
A1
0.05 C A B
C
SIDE VIEW
SEATING
PLANE
A1
e
b
MILLIMETERS
MIN
MAX
0.63
0.57
0.17
0.24
0.41 REF
0.24
0.29
0.80 BSC
0.80 BSC
0.40 BSC
0.40
PITCH
e
B
0.03 C
A
PACKAGE
OUTLINE
4X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
1
2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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PUBLICATION ORDERING INFORMATION
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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3
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
ESD6100/D
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