4-Channel ESD Array in CSP

CSPESD304
4-Channel ESD Array in CSP
Product Description
The CSPESD304 is a quad ESD transient voltage suppression diode
array. Each diode provides a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). These diodes safely dissipate ESD strikes of ±15 kV,
exceeding the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±30 kV.
The CSPESD304 is particularly well−suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package and low weight.
The CSPESD304 is available in a space−saving, low−profile Chip
Scale Package with lead−free finishing.
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WLCSP5
CASE 567AY
ELECTRICAL SCHEMATIC
Features
• Four Channels of ESD Protection
• ±15 kV ESD Protection on each Channel
ESD_1
ESD_2
ESD_3
ESD_4
A1
A3
C1
C3
Optimum ESD Protection
GND
(IEC 61000−4−2 Level 4, Contact Discharge)
• ±30 kV ESD Protection on each Channel (HBM)
• Chip Scale Package Features Extremely Low Lead Inductance for
B2
• 5−Bump, 0.960 mm x 1.330 mm Footprint Chip Scale Package
•
(CSP)
These Devices are Pb−Free and are RoHS Compliant
MARKING DIAGRAM
Applications
• ESD Protection for Sensitive Electronic Equipment
• I/O Port and Keypad and Button Circuitry Protection for Portable
E
Devices
E
• Can be Used for EMI Filtering when Combined with External
•
•
•
•
•
•
Series Resistance
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 3
= CSPESD304
ORDERING INFORMATION
Device
Package
Shipping†
CSPESD304
CSP−5
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1
Publication Order Number:
CSPESD304/D
CSPESD304
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Top View
(Bumps Down View)
Pin
Name
Description
A1
ESD_1
ESD Channel 1
A3
ESD_2
ESD Channel 2
B2
GND
Device Ground
A
C1
ESD_3
ESD Channel 3
B
C3
ESD_4
ESD Channel 4
Orientation
Marking
(see Note)
+
Bottom View
(Pins Up View)
1 2 3
C
C1
Orientation
Marking
C3
B2
A1
A1
A3
CSPESD304
CSP Package
Note: Lead−free devices are specified by using a “+” character
for the top side orientation mark.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Storage Temperature Range
DC Package Power Rating
Units
−65 to +150
°C
200
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
VDIODE
Parameter
Conditions
Diode Reverse Breakdown Voltage
IDIODE = 10 mA
ILEAK
Diode Leakage Current
VIN = 3.3 V, TA = 25°C
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
IDIODE = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Note 2)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Note 2)
Diode Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
VCL
CDIODE
Min
Typ
Max
5.5
V
100
5.6
−0.4
Units
6.8
−0.8
9.0
−1.5
nA
V
kV
±30
±15
V
+15
−8
1. TA = −40 to +85°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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2
22
27
32
pF
CSPESD304
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)
Figure 2. Frequency Response (single channel vs. GND, in 50 W system)
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3
CSPESD304
APPLICATION INFORMATION
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
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4
CSPESD304
PACKAGE DIMENSIONS
WLCSP5, 0.96x1.33
CASE 567AY−01
ISSUE O
D
2X
A
ÈÈ
PIN A1
REFERENCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
ÉÉÉ
OptiGuard Option
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
A1
eD/2
5X
0.05 C A B
0.03 C
PACKAGE
OUTLINE
0.87
eD
b
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.40 REF
0.29
0.35
0.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
eE
C
0.44
B
0.25
0.50
A
5X
0.25
DIMENSIONS: MILLIMETERS
1 2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
CSPESD304/D
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