4-Channel ESD Array in CSP

CM1244
4-Channel ESD Array in CSP
Features
• Four Channels of ESD Protection
• ±15 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
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• ±30 kV ESD Protection on Each Channel (HBM)
• Chip Scale Package Features Extremely Low Lead Inductance
for Optimum ESD Protection
• 5−bump, 0.760 mm x 1.053 mm Footprint,
Devices
A1
• Can be Used for EMI Filtering when Combined with External Series
•
•
•
•
•
•
Resistance
Wireless Handsets
Handheld PCs/PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
GND
A3
C1
ESD_4
ESD_1
• ESD Protection for Sensitive Electronic Equipment
• I/O Port and Keypad and Button Circuitry Protection for Portable
ESD_3
BLOCK DIAGRAM
Applications
ESD_2
•
•
WLCSP5
CP SUFFIX
CASE 567AX
0.4 mm Pitch, Chip Scale Package (CSP)
OptiGuardt Coating for Improved Reliability at Assembly
These Devices are Pb−Free and are RoHS Compliant
C3
B2
MARKING DIAGRAM
04 MG
G
04
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
CM1244−04CP
CSP−5
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
February, 2011 − Rev. 4
1
Publication Order Number:
CM1244/D
CM1244
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Pin
Name
A1
ESD_1
ESD Channel 1
A3
ESD_2
ESD Channel 2
B2
GND
Device Ground
C1
ESD_3
ESD Channel 3
C3
ESD_4
ESD Channel 4
Top View
(Bumps Down View)
1
2
3
Orientation
Marking
(see Note)
Description
A
B
+
04
C
Bottom View
(Bumps Up View)
ESD_3
ESD_4
C1 GND C3
Orientation
Marking
ESD_1 B2
A1
A1
ESD_2
A3
CM1244
CSP Package
Note: The “+” orientation marking indicates that the package
is lead−free.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC Package Power Rating
Rating
Units
–65 to +150
°C
200
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
–40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
VDIODE
Parameter
Conditions
Diode Reverse Breakdown Voltage
IDIODE = 10 mA
ILEAK
Diode Leakage Current
TA = 25°C; VIN = 3.3 V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
IDIODE = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per IEC 61000−4−2
(Note 2)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Note 2)
Diode Capacitance
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
VCL
CDIODE
Min
Typ
Max
5.5
V
100
5.6
−1.5
Units
6.8
–0.8
9.0
−0.4
nA
V
kV
±30
±15
V
+15
–8
1. TA = –40°C to +85°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
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2
22
27
32
pF
CM1244
APPLICATION INFORMATION
Refer to Application Note “The Chip Scale Package,” for a detailed description of Chip Scale Packages offered by
ON Semiconductor.
PERFORMANCE INFORMATION
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)
Figure 2. Frequency Response (single channel vs. GND, in 50 system)
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3
CM1244
PACKAGE DIMENSIONS
WLCSP5, 0.76x1.05
CASE 567AX−01
ISSUE O
D
È
È
PIN A1
REFERENCE
2X
0.05 C
2X
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
TOP VIEW
ÉÉ
A2
OptiGuard Option
0.05 C
RECOMMENDED
SOLDERING FOOTPRINT*
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
A1
SEATING
PLANE
eD/2
5X
b
0.05 C A B
0.03 C
eD
MILLIMETERS
MIN
MAX
0.69
0.54
0.17
0.24
0.42 REF
0.24
0.29
0.76 BSC
1.05 BSC
0.400 BSC
0.347 BSC
PACKAGE
OUTLINE
0.35
0.35
0.40
PITCH
eE
C
B
5X
0.25
DIMENSIONS: MILLIMETERS
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1 2 3
BOTTOM VIEW
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CM1244/D
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