5 Line Transient Voltage Suppressor Array

SMS05C, SMS12C, SMS15C,
SMS24C
5-Line Transient Voltage
Suppressor Array
This 5−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as computers, printers, automotive electronics,
networking communication and other applications. This device
features a monolithic common anode design which protects five
independent lines in a single TSOP−6 package.
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TSOP−6 FIVE TRANSIENT
VOLTAGE SUPPRESSOR
350 W PEAK POWER
PIN ASSIGNMENT
Features
• Protects up to 5 Lines in a Single TSOP−6 Package
• Peak Power Dissipation − 350 W (8 20 ms Waveform)
• ESD Rating of Class 3B (Exceeding 8.0 kV) per Human Body Model
•
•
•
and Class C (Exceeding 400 V) per Machine Model
Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8.0 kV
(Contact)
Flammability Rating of UL 94 V−0
These are Pb−Free Devices
6
1
TSOP−6
CASE 318G
Hand−Held Portable Applications
Networking and Telecom
Automotive Electronics
Serial and Parallel Ports
Notebooks, Desktops, Servers
5
3
4
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
CATHODE
6x MG
G
Symbol
Rating
Value
Unit
PPK 1
Peak Power Dissipation
8
20 ms Double Exponential Waveform
(Note 1)
350
W
Operating Junction Temperature Range
−40 to 150
°C
Storage Temperature Range
−55 to 150
°C
TSTG
2
MARKING DIAGRAM
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
TJ
6
PIN 1.
2.
3.
4.
5.
6.
Applications
•
•
•
•
•
1
TL
Lead Solder Temperature (10 s)
260
°C
ESD
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
>8000
>400
>15000
>8000
V
x = SMS05C:J
= SMS12C:K
= SMS15C:L
= SMS24C:M
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
TSOP−6
(Pb−Free)
3000/Tape & Reel
SMS05CT1G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current pulse per Figure 3.
SMS12CT1G
SMS15CT1G
SMS24CT1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. 7
1
Publication Order Number:
SMS05C/D
SMS05C, SMS12C, SMS15C, SMS24C
SMS05C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
Typ
(Note 2)
IT = 1.0 mA (Note 3)
6.2
Max
Unit
5.0
V
7.2
V
5.0
mA
Reverse Leakage Current
IR
VRWM = 5.0 V
Clamping Voltage
VC
IPP = 5.0 A (8
20 ms Waveform)
9.8
V
Clamping Voltage
VC
IPP = 24 A (8
20 ms Waveform)
14.5
V
Maximum Peak Pulse Current
IPP
8
Capacitance
CJ
VR = 0 V, f = 1.0 MHz (Line to GND)
24
A
260
400
pF
Typ
Max
Unit
12
V
15
V
20 ms Waveform
SMS12C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1.0 mA (Note 3)
13.3
Reverse Leakage Current
IR
VRWM = 12 V
1.0
mA
Clamping Voltage
VC
IPP = 5.0 A (8
20 ms Waveform)
0.001
19
V
Clamping Voltage
VC
IPP = 15 A (8
20 ms Waveform)
23
V
Maximum Peak Pulse Current
IPP
8
15
A
Capacitance
CJ
VR = 0 V, f = 1.0 MHz (Line to GND)
120
150
pF
Typ
Max
Unit
15
V
19
V
1.0
mA
20 ms Waveform
SMS15C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified) (See Note 4)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1.0 mA (Note 3)
17
Reverse Leakage Current
IR
VRWM = 15 V
0.05
Clamping Voltage
VC
IPP = 5.0 A (8
20 ms Waveform)
24
V
Clamping Voltage
VC
IPP = 12 A (8
20 ms Waveform)
29
V
Maximum Peak Pulse Current
IPP
8
Capacitance
CJ
VR = 0 V, f = 1.0 MHz (Line to GND)
12
A
95
125
pF
Typ
Max
Unit
24
V
32
V
1.0
mA
40
V
44
V
8.0
A
75
pF
20 ms Waveform
SMS24C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
VRWM
VBR
Conditions
Min
(Note 2)
IT = 1.0 mA (Note 3)
Reverse Leakage Current
IR
VRWM = 24 V
Clamping Voltage
VC
IPP = 5.0 A (8
Clamping Voltage
VC
IPP = 8 A (8
Maximum Peak Pulse Current
IPP
8
Capacitance
CJ
VR = 0 V, f = 1.0 MHz (Line to GND)
26.7
0.001
20 ms Waveform)
20 ms Waveform)
20 ms Waveform
60
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
4. Parametrics are the same for the Pb−Free packages, which are suffixed with a “G’’.
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2
SMS05C, SMS12C, SMS15C, SMS24C
100
100
90
90
% OF PEAK PULSE CURRENT
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25 ° C
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified)
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175
PEAK VALUE IRSM @ 8 ms
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
200
tr
0
20
Figure 1. Pulse Derating Curve
SMS24C
45
40
35
8 x 20 ms
PULSE WAVEFORM
SMS15C
30
SMS12C
25
20
SMS05C
15
10
5
0
0
5
10
15
80
60
Figure 2. 8 × 20 ms Pulse Waveform
20
300
JUNCTION CAPACITANCE (pF)
VC, CLAMPING VOLTAGE (V)
50
40
t, TIME (ms)
TA, AMBIENT TEMPERATURE (°C)
250
200
SMS05C
150
100
SMS12C
50
0
25
f = 1.0 MHz
SMS15C
0
IPP, PEAK PULSE CURRENT (A)
5
10
15
SMS24C
20
25
VBR, REVERSE VOLTAGE (V)
Figure 3. Clamping Voltage vs. Peak Pulse Current
Figure 4. Junction Capacitance vs. Reverse Voltage
Figure 5. ESD Pulse IEC 61000−4−2
(8.0 kV Contact)
Figure 6. SMS15CT1 ESD Response for IEC
61000−4−2 (+8.0 kV Contact)
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3
SMS05C, SMS12C, SMS15C, SMS24C
TYPICAL COMMON ANODE APPLICATIONS
A 5 TVS junction common anode design in a TSOP−6
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. A simplified example of
SMS05C Series Device applications is illustrated below.
A
KEYBOARD
TERMINAL
PRINTER
ETC.
B
C
I/O
D
FUNCTIONAL
DECODER
E
GND
SMS05C SERIES DEVICE
Figure 7. Computer Interface Protection
VDD
VGG
ADDRESS BUS
RAM
ROM
DATA BUS
CPU
I/O
CLOCK
CONTROL BUS
GND
SMS05C SERIES DEVICE
Figure 8. Microprocessor Protection
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4
SMS05C, SMS12C, SMS15C, SMS24C
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
H
6
5
ÉÉ
ÉÉ
E1
1
NOTE 5
2
L2
4
GAUGE
PLANE
E
3
L
b
DETAIL Z
e
0.05
M
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
SEATING
PLANE
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
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5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
SMS05C/D
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