5 Pin Bi Directional Quad TVS Array

NUP4004M5
5-Pin Bi-Directional Quad
TVS Array
This 5-Pin bi-directional transient suppressor array is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in transient voltage and ESD sensitive equipment
such as computers, printers, cell phones, medical equipment, and other
applications. Its integrated design provides bi-directional protection
for four separate lines using a single TSOP-5 package. This device is
ideal for situations where board space is a premium.
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5
4
Features
•Bi-directional Protection for Four Lines in a Single TSOP-5 Package
•Low Leakage Current
•Low Capacitance
•Provides ESD Protection for JEDEC Standards JESD22
- Machine Model = Class C
- Human Body Model = Class 3B
•Provides ESD Protection for IEC 61000-4-2, 15 kV (Air),
8 kV (Contact)
•This is a Pb-Free Device
2
3
1
MARKING
DIAGRAM
5
5
1
MY MG
G
TSOP-5
CASE 483
Mechanical Characteristics
•Void Free, Transfer-Molded, Thermosetting Plastic Case
•Corrosion Resistant Finish, Easily Solderable
•Package Designed for Optimal Automated Board Assembly
•Small Package Size for High Density Applications
1
MY = Specific Device Code
M = Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
Applications
•LCD, Plasma TV Video Lines
•Other Telephone Sets
•Computers / Printers / Set-Top Boxes
ORDERING INFORMATION
MAXIMUM RATINGS (TJ=25°C, unless otherwise specified)
Rating
Operating Junction Temperature Range
Storage Temperature Range
Lead Solder Temperature – Maximum (10 sec)
Human Body Model ( HBM)
Machine Model (MM)
IEC 61000-4-2 Air (ESD)
IEC 61000-4-2 Contact (ESD)
Symbol
Value
Unit
TJ
-40 to
125
°C
TSTG
-55 to
150
°C
TL
260
°C
ESD
16
0.4
30
30
kV
Device
Package
Shipping†
NUP4004M5T1G
TSOP-5
(Pb-Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 2
1
Publication Order Number:
NUP4004M5/D
NUP4004M5
ELECTRICAL CHARACTERISTICS (TJ=25°C, unless otherwise specified)
Parameter
Conditions
Symbol
(Note 1)
VRWM
Max
Unit
5.0
V
IT = 1 mA, (Note 2)
VBR
7.0
8.0
V
VRWM = 5 V
IR
100
1000
nA
Capacitance
VR = -3 V, f = 1 MHz
(Line to GND)
Cj
23
pF
Capacitance
VR = 3 V, f = 1 MHz
(Line to GND)
Cj
32
pF
Reverse Working Voltage
Breakdown Voltage
Reverse Leakage Current
Min
Typ
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
2. VBR is measured at pulse test current IT.
TYPICAL PERFORMANCE CURVES
(TJ = 25°C unless otherwise specified)
110
110
WAVEFORM
PARAMETERS
tr = 8 ms
td = 20 ms
PERCENT OF IPP
90
80
70
100
% OF RATED POWER OR IPP
100
c-t
60
td = IPP/2
50
40
30
20
10
0
0
5
10
15
20
25
90
80
70
60
50
40
30
20
10
0
30
0
25
50
75
100
125
t, TIME (ms)
TA, AMBIENT TEMPERATURE (°C)
Figure 1. Pulse Waveform
Figure 2. Power Derating Curve
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2
150
NUP4004M5
PACKAGE DIMENSIONS
TSOP-5
CASE 483-02
ISSUE F
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
D 5X
0.20 C A B
M
5
1
4
2
3
B
S
K
L
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
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3
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUP4004M5/D
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