5-Line Transient Voltage Suppressor Array

NUP8020X6
5−Line Transient Voltage
Suppressor Array
This 5−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as cell phones, portables, computers, printers and
other applications. This device features a monolithic common anode
design which protects five independent lines in a single
SOT−563 package.
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SOT−563 5−LINE TRANSIENT
VOLTAGE SUPPRESSOR
Features
• Protects up to 5 Lines in a Single SOT−563 Package
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
•
•
PIN ASSIGNMENT
and Class C (Exceeding 400 V) per Machine Model.
Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8 kV (Contact)
This is a Pb−Free Device
1
6
2
5
3
4
Applications
• Hand Held Portable Applications
• Serial and Parallel Ports
• Notebooks, Desktops, Servers
PIN 1.
2.
3.
4.
5.
6.
CATHODE
ANODE
CATHODE
CATHODE
CATHODE
CATHODE
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol
PPK 1
Rating
Peak Power Dissipation
8x20 msec double exponential waveform,
(Note 1)
Value
Unit
90
W
6
TJ
Operating Junction Temperature Range
−40 to 125
°C
TSTG
Storage Temperature Range
−55 to 150
°C
TL
Lead Solder Temperature – Maximum
(10 seconds)
260
°C
ESD
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
16000
400
15000
8000
V
February, 2007 − Rev. 0
54
3
12
SOT−563
CASE 463A
STYLE 6
UX M G
G
UX = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current pulse per Figure 1.
© Semiconductor Components Industries, LLC, 2007
MARKING
DIAGRAM
1
Device
Package
Shipping †
NUP8020X6T1G
SOT−563
(Pb−Free)
4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NUP8020X6/D
NUP8020X6
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Parameter
Conditions
Reverse Working Voltage
(Note 2)
Breakdown Voltage
IT = 1 mA, (Note 3)
Reverse Leakage Current
Capacitance
Symbol
Min
VRWM
Typ
Max
Unit
−
5.0
V
VBR
6.2
6.8
7.2
V
VRWM = 3 V
IR
−
0.01
0.5
mA
VR = 0 V, f = 1 MHz (Line to GND)
VR = 2.5 V, f = 1 MHz (Line to GND)
CJ
−
54
70
pF
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
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2
NUP8020X6
120
1000
PEAK POWER (W)
% OF RATED POWER OR IPP
TA = 25 °C
100
80
60
40
100
20
0
0
25
50
75
100
125
10
150
Figure 2. Peak Power vs. Pulse Duration
60
CT, TYPICAL CAPACITANCE (pF)
10
1
6
8
10
12
14
TA = 25 °C
50
40
30
20
10
0
16
0
1
3
4
5
VR, REVERSE VOLTAGE (V)
Figure 3. Peak Current vs. Clamp Voltage
Figure 4. Typical Capacitance vs. Reverse
Voltage
6
1
TA = 25 °C
FORWARD CURRENT (A)
TA = 25 °C
REVERSE CURRENT (nA)
2
VCL, CLAMP VOLTAGE (V)
1000
100
TJ = 125 °C
10
TJ = 25 °C
1
0.1
0.01
100
Figure 1. Power Derating vs. Ambient
Temperature
TA = 25 °C
IPP, PEAK CURRENT (A)
10
PULSE DURATION (mS)
100
0.1
1
TA, AMBIENT TEMPERATURE (°C)
1
2
3
4
5
TJ = 125 °C
0.1
TJ = 25 °C
0.01
0.001
0.6
6
0.7
0.8
0.9
1.0
1.1
1.2
REVERSE VOLTAGE (V)
FORWARD VOLTAGE (V)
Figure 5. Reverse Current vs. Reverse Voltage
Figure 6. Typical Forward Current vs. Forward
Voltage
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3
NUP8020X6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
6
5
1
2
A
L
4
E
−Y−
3
b
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUP8020X6/D
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