8 Line Low Capacitance Tranisient Voltage Suppressor Array

NUP8028MN
Low Capacitance Transient
Voltage Suppressor Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its integrated design provides very effective and
reliable protection for eight separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
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8
2
7
3
6
4
5
Features
• Low Capacitance
• Low Leakage Current < 1 mA @ 3 V
• ESD Ratings:
♦
IEC61000−4−2, 18 kV (Contact)
IEC61000−4−2, 30 kV (Air)
♦ Machine Model = Class C, 400 V
♦ Human Body Model = Class 3B, 8 kV
DFN Package, 1.6 x 1.6 mm
Moisture Sensitivity Level 1
This is a Pb−Free Device
♦
•
•
•
(Top View)
MARKING
DIAGRAM
Benefits
• Provides Protection for ESD Industry Standards: IEC 61000, HBM
• Protects the Line Against Transient Voltage Conditions in Either
•
•
Direction
Minimize Power Consumption of the System
Minimize PCB Board Space
8
1
DFN8
CASE 506AK
1
5S G
G
5S
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Applications
ESD Protection for Data Lines
Wireless Phones
Handheld Products
Notebook Computers
LCD Displays
PIN CONNECTIONS
8
1
7
2
6
GND
•
•
•
•
•
3
5
4
(Bottom View)
ORDERING INFORMATION
Device
NUP8028MNT1G
Package
DFN8
(Pb−Free)
Shipping †
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 0
1
Publication Order Number:
NUP8028MN/D
NUP8028MN
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000−4−2
Value
VPP
kV
Air Discharge
Contact Discharge
Peak Power Dissipation (8 x 20 mS @ TA = 25°C)
Unit
15
8.0
Ppk
(Note 1)
20
W
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Nonrepetitive current per Figure 4.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
Max
Unit
3.0
V
5.6
5.9
V
0.01
1.0
mA
13
V
VRWM
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.3 V
Clamping Voltage
Vc
IPP = 1.6 A
Capacitance
Cd
f = 1 MHz, VR = 0 V
13
17
pF
Capacitance
Cd
f = 1 MHz, VR = 3.0 V
7.0
11.5
pF
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5.3
NUP8028MN
TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified)
% OF RATED POWER OR IPP
10
1
1
10
100
100
90
80
70
60
50
40
30
20
10
0
1000
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Figure 1. Pulse Width
Figure 2. Power Derating Curve
0.16
100
0.14
90
0.12
0.10
0.08
0.06
0.04
0.02
0
−60 −40
0
t, TIME (ms)
% OF PEAK PULSE CURRENT
IR, REVERSE LEAKAGE (mA)
110
−20
0
20
40
60
80
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
100
40
t, TIME (ms)
Figure 3. Reverse Leakage versus Temperature
Figure 4. 8 × 20 ms Pulse Waveform
0
20
1
0.1
0.01
TA = 25°C
0.001
0.6
0.8
1.0
1.2
1.4
VF, FORWARD VOLTAGE (V)
Figure 5. Forward Voltage
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150
PEAK VALUE IRSM @ 8 ms
tr
T, TEMPERATURE (°C)
IF, FORWARD CURRENT (A)
Ppk, PEAK SURGE POWER (W)
100
1.6
1.8
60
80
NUP8028MN
PACKAGE DIMENSIONS
DFN8
CASE 506AK−01
ISSUE C
A
D
PIN ONE
REFERENCE
2X
0.15 C
B
ÉÉÉ
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
4. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
E
(A3)
TOP VIEW
2X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
0.10 C
(A3)
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.15
0.25
1.60 BSC
0.70
0.90
1.60 BSC
0.30
0.50
0.40 BSC
0.20
−−−
0.20
0.40
A
8X
0.08 C
SOLDERING FOOTPRINT*
SEATING
PLANE
SIDE VIEW
A1
0.490
0.0193
C
0.924
0.0364
D2
8X
L
1
e
2X
4
NOTE 4
3X
8X
K
8
5
8X
BOTTOM VIEW
0.902
0.0355
0.200
0.0079
E2
b
0.10 C A B
0.05 C
NOTE 3
0.400
0.0157
PITCH
0.502
0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NUP8010MN/D
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